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Effect of Mo and Sn co-regulation on low alloy steel corrosion in tropical marine atmosphere.
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- NPJ Materials Degradation, 2024, v. 8, n. 1, p. 1, doi. 10.1038/s41529-024-00507-0
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- Article
Effect of Spectral Filtering and Segmental X-ray Tube Current Switch-Off on Interventionalist's Scatter Exposure during CT Fluoroscopy.
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- Bioengineering (Basel), 2024, v. 11, n. 8, p. 838, doi. 10.3390/bioengineering11080838
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- Article
Tin-induced crystallization of amorphous silicon assisted by a pulsed laser irradiation.
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- Semiconductor Physics, Quantum Electronics & Optoelectronics, 2017, v. 20, n. 4, p. 396, doi. 10.15407/spqeo20.04.396
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- Article
Tin doping effect on crystallization of amorphous silicon obtained by vapor deposition in vacuum.
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- Semiconductor Physics, Quantum Electronics & Optoelectronics, 2013, v. 16, n. 4, p. 331
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- Article
Electrical properties of n-SnS<sub>2</sub>/n-CdIn<sub>2</sub>Te<sub>4</sub> heterostructure.
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- Semiconductor Physics, Quantum Electronics & Optoelectronics, 2010, v. 13, n. 4, p. 444, doi. 10.15407/spqeo13.04.444
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- Article
High-power-factor thermoelectric material.
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- Tribology & Lubrication Technology, 2015, v. 71, n. 7, p. 12
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- Article
Predicting the Trace Element Levels in Caspian Kutum (Rutilus kutum) from South of the Caspian Sea Based on Locality, Season and Fish Tissue.
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- Biological Trace Element Research, 2022, v. 200, n. 1, p. 354, doi. 10.1007/s12011-021-02622-4
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- Article
The Relationship between Interest Rates and Metal Price Movements.
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- Review of Economic Studies, 1980, v. 47, n. 1, p. 161, doi. 10.2307/2297108
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- Article
Underpotential deposition of tin(II) on a gold disc electrode and determination of tin in a tin plate sample.
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- Analytical & Bioanalytical Chemistry, 2005, v. 381, n. 7, p. 1467, doi. 10.1007/s00216-005-3077-8
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- Article
Effect of tin addition on the corrosion resistance of low‐alloyed steel in simulated coastal‐industrial atmosphere environment.
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- Materialwissenschaft und Werkstoffechnik, 2022, v. 53, n. 10, p. 1200, doi. 10.1002/mawe.202100268
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- Article
Thermodynamic analysis of nanocrystalline solid solutions formation in copper‐lead‐tin ternary immiscible system during mechanical alloying.
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- Materialwissenschaft und Werkstoffechnik, 2021, v. 52, n. 12, p. 1328, doi. 10.1002/mawe.202100076
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- Article
A study of corrosion performance of tinplate with different tin coating thickness in H<sub>2</sub>SO<sub>4</sub> solution.
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- Materialwissenschaft und Werkstoffechnik, 2021, v. 52, n. 4, p. 433, doi. 10.1002/mawe.202000230
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- Article
A Highly Sensitive Method for Determination of Monobutyltin in Aqueous Media by Stripping Voltammetry at a Renewable Silver Amalgam Annular Band Electrode.
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- Electroanalysis, 2013, v. 25, n. 8, p. 2007, doi. 10.1002/elan.201300218
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- Article
Hydrogen Production by Methane Pyrolysis in a Molten‐Metal Bubble Column.
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- Chemical Engineering & Technology, 2021, v. 44, n. 11, p. 1986, doi. 10.1002/ceat.202100210
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- Article
Sn<sub>2</sub>B<sub>5</sub>O<sub>9</sub>Cl: A Material with Large Birefringence Enhancement Activated Prepared via Alkaline‐Earth‐Metal Substitution by Tin.
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- Angewandte Chemie, 2019, v. 131, n. 49, p. 17839, doi. 10.1002/ange.201911187
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- Article
Mechanosynthesis of Odd‐Numbered Tetraaryl[n]cumulenes.
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- Angewandte Chemie, 2019, v. 131, n. 37, p. 13079, doi. 10.1002/ange.201905670
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- Article
SnI<sub>4</sub>⋅(S<sub>8</sub>)<sub>2</sub>: A Novel Adduct‐Type Infrared Second‐Order Nonlinear Optical Crystal.
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- Angewandte Chemie, 2018, v. 130, n. 36, p. 11714, doi. 10.1002/ange.201803482
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- Article
CO Hydrogenation on Cobalt-Based Catalysts: Tin Poisoning Unravels CO in Hollow Sites as a Main Surface Intermediate.
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- Angewandte Chemie, 2018, v. 130, n. 2, p. 556, doi. 10.1002/ange.201710301
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- Article
Thermally Stable and Regenerable Platinum-Tin Clusters for Propane Dehydrogenation Prepared by Atom Trapping on Ceria.
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- Angewandte Chemie, 2017, v. 129, n. 31, p. 9114, doi. 10.1002/ange.201701115
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- Article
Dye-Controlled Interfacial Electron Transfer for High-Current Indium Tin Oxide Photocathodes.
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- Angewandte Chemie, 2015, v. 127, n. 23, p. 6961, doi. 10.1002/ange.201500274
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- Article
Electromagnetic Preparation and Wear Behavior of In Situ Si‐Reinforced Al–Matrix Gradient Self‐Lubricating Composites.
- Published in:
- Advanced Engineering Materials, 2023, v. 25, n. 21, p. 1, doi. 10.1002/adem.202300917
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- Article
Amplifying Mn Segregation and Enhancing Damping Capacity via Adding Sn in Mn–44Cu–1.5Al as‐Cast Alloys.
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- Advanced Engineering Materials, 2023, v. 25, n. 21, p. 1, doi. 10.1002/adem.202300591
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- Article
Achievement of Ultralow Elastic Modulus through Optimization of Phase Stability and Recrystallization Texture in Ti–Nb–Fe–Sn Alloys.
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- Advanced Engineering Materials, 2023, v. 25, n. 19, p. 1, doi. 10.1002/adem.202300468
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- Article
Solid‐State Field‐Assisted Ion Exchange (Ag → Na) in Soda–Lime Float Glass: Tin Versus Air Side.
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- Advanced Engineering Materials, 2023, v. 25, n. 18, p. 1, doi. 10.1002/adem.202201572
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- Article
Effect of Al Bronze Interlayer on Liquid-Solid Compound Interface of Sn Bronze/Steel.
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- Advanced Engineering Materials, 2023, v. 25, n. 6, p. 1, doi. 10.1002/adem.202201227
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- Article
Tribological Behavior of Electrical Connector Sn/Ni/Cu Coating with Intermetallic Compound Layers Under Reciprocating Motion.
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- Advanced Engineering Materials, 2022, v. 24, n. 9, p. 1, doi. 10.1002/adem.202101783
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- Article
A Comparative Study on the Influence of SAC305 Lead‐Free Solder Sandwiched by Sn on the Micromechanical and Electrical Properties of the Joints.
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- Advanced Engineering Materials, 2022, v. 24, n. 1, p. 1, doi. 10.1002/adem.202100679
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- Article
Improving Strength and Electromagnetic Shielding Effectiveness of Mg–Sn–Zn–Ca–Ce Alloy by Sn Addition.
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- Advanced Engineering Materials, 2021, v. 23, n. 9, p. 1, doi. 10.1002/adem.202100166
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- Article
Thermal Stability Enhancement in Epitaxial Alpha Tin Films by Strain Engineering.
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- Advanced Engineering Materials, 2019, v. 21, n. 10, p. N.PAG, doi. 10.1002/adem.201900410
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- Article
Intermetallic Layer Growth Kinetics in Sn-Ag-Cu System using Diffusion Multiple and Reflow Techniques.
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- Advanced Engineering Materials, 2015, v. 17, n. 4, p. 512, doi. 10.1002/adem.201400226
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- Article
Studies on the structural, optical and electrical properties of CeO/SnPc nanocomposite for electronic applications.
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- Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 1, p. 1115, doi. 10.1007/s10854-016-5636-5
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- Article
Doped tin induced structural evaluation and performance of CHNHPbSnI thin films prepared by a simple route of unisource thermal evaporation.
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- Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 12, p. 13192, doi. 10.1007/s10854-016-5465-6
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- Article
Harsh service environment effects on the microstructure and mechanical properties of Sn-Ag-Cu-1 wt% nano-Al solder alloy.
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- Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 11, p. 11273, doi. 10.1007/s10854-016-5250-6
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- Article
Effect of Nd on whiskers growth behavior of SnAgCu solders in electronic packaging.
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- Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 9, p. 9584, doi. 10.1007/s10854-016-5012-5
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- Article
Tin sulfide nanoparticles by pulsed laser ablation in liquid.
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- Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 7, p. 6859, doi. 10.1007/s10854-016-4639-6
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- Article
Improved efficiency of plasmonic tin sulfide solar cells.
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- Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 5, p. 5107, doi. 10.1007/s10854-016-4401-0
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- Article
Effect of magnetic flux density on Sn crystallographic orientation in a solder joint system.
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- Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 4, p. 3710, doi. 10.1007/s10854-015-4212-8
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- Article
Effect of Sn doping on the structural, optical and electrical properties of TiO films prepared by spray pyrolysis.
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- Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 1, p. 659, doi. 10.1007/s10854-015-3802-9
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- Article
Fluidity of Sn-based eutectic solder alloys.
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- Journal of Materials Science: Materials in Electronics, 2015, v. 26, n. 12, p. 9478, doi. 10.1007/s10854-015-3415-3
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- Article
Characterization of Sn-doped β-GaO films deposited on MgO (100) substrate by MOCVD.
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- Journal of Materials Science: Materials in Electronics, 2015, v. 26, n. 10, p. 7889, doi. 10.1007/s10854-015-3440-2
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- Article
Effect of pulsed voltage on electrochemical migration of tin in electronics.
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- Journal of Materials Science: Materials in Electronics, 2015, v. 26, n. 10, p. 7997, doi. 10.1007/s10854-015-3454-9
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- Article
Effects of tin content on structure, properties, electrical repeatability, uniformity and stability of high sheet resistance ITO thin films for touch panels.
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- Journal of Materials Science: Materials in Electronics, 2015, v. 26, n. 9, p. 6954, doi. 10.1007/s10854-015-3314-7
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- Article
Investigation on the effect of Sn grain number and orientation on the low cycle fatigue deformation behavior of SnAgCu/Cu solder joints.
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- Journal of Materials Science: Materials in Electronics, 2015, v. 26, n. 4, p. 2175, doi. 10.1007/s10854-015-2664-5
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- Article
Influence of Sn-substitution on microstructure and microwave dielectric properties of NaNdTiO ceramics.
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- Journal of Materials Science: Materials in Electronics, 2015, v. 26, n. 1, p. 424, doi. 10.1007/s10854-014-2416-y
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- Article
Relationships between Sn substitution for Ti and microwave dielectric properties of Mg(TiSn)O ceramics system.
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- Journal of Materials Science: Materials in Electronics, 2015, v. 26, n. 1, p. 571, doi. 10.1007/s10854-014-2436-7
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- Article
Phase growth competition in solid/liquid reactions between copper or CuSn compound and liquid tin-based solder.
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- Journal of Materials Science: Materials in Electronics, 2014, v. 25, n. 10, p. 4664, doi. 10.1007/s10854-014-2221-7
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- Article
Significant modification to Bi-doped BaTiO by Sm in gaseous penetration process.
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- Journal of Materials Science: Materials in Electronics, 2014, v. 25, n. 8, p. 3543, doi. 10.1007/s10854-014-2054-4
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- Article
Fluxless bonding of Si chips to aluminum boards using electroplated Sn solder.
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- Journal of Materials Science: Materials in Electronics, 2014, v. 25, n. 8, p. 3276, doi. 10.1007/s10854-014-2014-z
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- Article
Inhibiting the growth of Sn whisker in Sn-9Zn lead-free solder by Nd and Ga.
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- Journal of Materials Science: Materials in Electronics, 2014, v. 25, n. 6, p. 2671, doi. 10.1007/s10854-014-1927-x
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- Article
Microstructure and kinetic analysis of the properties and behavior of nickel (Ni) nano-particle doped tin-zinc-bismuth (Sn-8Zn-3Bi) solders on immersion silver (Ag)-plated copper (Cu) substrates.
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- Journal of Materials Science: Materials in Electronics, 2014, v. 25, n. 6, p. 2529, doi. 10.1007/s10854-014-1906-2
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- Article