Works about SOLDER joints

Results: 1027

Mechanical response identification of local interconnections in boardlevel packaging structures under projectile penetration using Bayesian regularization.

Published in:

Defence Technology, 2025, v. 49, p. 79, doi. 10.1016/j.dt.2025.02.005

By:

Xu Long;
Yuntao Hu;
Ali, Irfan

Publication type:

Article

Creep-rupture durability test and FEA simulation of high temperature solder joints using simple new creep-rupture tester.

Published in:

Journal of Mechanical Science & Technology, 2025, v. 39, n. 7, p. 3695, doi. 10.1007/s12206-025-2413-5

By:

Jeong, Jae-Seong

Publication type:

Article

AI-driven point cloud framework for predicting solder joint reliability using 3D FEA data.

Published in:

Scientific Reports, 2025, v. 15, n. 1, p. 1, doi. 10.1038/s41598-025-06902-0

By:

Akhtar, Mohd Zubair;
Schmid, Maximilian;
Elger, Gordon

Publication type:

Article

Wettability Study of Soldered Joints in SiC Ceramics and Combined Ni-SiC Using SnSbTi-Based Solder and Electron Beam Heating.

Published in:

Materials (1996-1944), 2025, v. 18, n. 12, p. 2814, doi. 10.3390/ma18122814

By:

Melus, Tomas;
Kolenak, Roman;
Drapala, Jaromir;
Gogola, Peter;
Pasak, Matej;
Drimal, Daniel;
Sloboda, Mikulas

Publication type:

Article

Multi-scale, Correlative Investigation of Thermo-mechanical Fatigue in SAC Solder Balls.

Published in:

Microscopy & Microanalysis, 2024, v. 30, p. 1, doi. 10.1093/mam/ozae044.106

By:

Cui, Charlotte;
Flachberger, Wolfgang;
Tkadletz, Michael;
Sartory, Bernhard;
Sinojiya, Rahulkumar;
Chamasemani, Fereshteh Falah;
Paulachan, Priya;
Reisinger, Michael;
Scheiber, Daniel;
Brunner, Roland

Publication type:

Article

Applying SEM, EPMA and EBSD Analytic Techniques on Solder Joint for Microelectronic Package Development.

Published in:

2019

By:

Chou, Tzu-Ting;
Song, Rui-Wen;
Duh, Jenq-Gong

Publication type:

Abstract

Modeling a Two-Element Tangential Eddy Current Probe with Active Shielding for Soldered Joint Testing.

Published in:

Russian Journal of Nondestructive Testing, 2024, v. 60, n. 8, p. 912, doi. 10.1134/S106183092460196X

By:

Gorbunov, A. E.;
Solomenchuk, P. V.;
Umanskii, A. S.

Publication type:

Article

Eddy Current Quality Control of Soldering in Superconducting Current-Carrying Joints with Allowance for the Effect of Cross Section Variations on Testing Results.

Published in:

Russian Journal of Nondestructive Testing, 2019, v. 55, n. 9, p. 654, doi. 10.1134/S106183091909002X

By:

Kogan, L. Kh.;
Stashkov, A. N.;
Nichipuruk, A. P.

Publication type:

Article

Effect of Free-standing Al/Ni Exothermic Film on Thermal Resistance of Reactively Bonded Solder Joint.

Published in:

Sensors & Materials, 2019, v. 31, n. 3, Part 1, p. 729, doi. 10.18494/SAM.2019.2076

By:

Shunsuke Kanetsuki;
Takahiro Namazu;
Shugo Miyake

Publication type:

Article

Thermal Fatigue Behaviors of BGA Packages with an Optimized Solder Joint Layout.

Published in:

Electronics (2079-9292), 2025, v. 14, n. 11, p. 2286, doi. 10.3390/electronics14112286

By:

Abdel Razzaq, Mohammed;
Meilunas, Michael;
Cao, Xian A.;
Wilcox, Jim;
Ramini, Abdallah

Publication type:

Article

Vision-Based Structural Adhesive Detection for Electronic Components on PCBs.

Published in:

Electronics (2079-9292), 2025, v. 14, n. 10, p. 2045, doi. 10.3390/electronics14102045

By:

Zhang, Ruzhou;
Yan, Tengfei;
Zhang, Jian

Publication type:

Article

Comparison of the Reliability of SAC305 and Innolot-Based Solder Alloy in a Board-Level BGA Package Considering Harmonic and Random Vibration Environment.

Published in:

Electronics (2079-9292), 2025, v. 14, n. 2, p. 292, doi. 10.3390/electronics14020292

By:

Ferdowsi, Sima Besharat;
Doranga, Sushil;
Li, Yueqing

Publication type:

Article

Transient Liquid Phase Bonding with Sn-Ag-Co Composite Solder for High-Temperature Applications.

Published in:

Electronics (2079-9292), 2024, v. 13, n. 11, p. 2173, doi. 10.3390/electronics13112173

By:

Kim, Byungwoo;
Cheon, Gyeongyeong;
Ko, Yong-Ho;
Sohn, Yoonchul

Publication type:

Article

Experimental Study on The Performance of External Open-Circuit Failure Gas Discharge Tubes under Power-Frequency Follow Currents.

Published in:

Electronics (2079-9292), 2024, v. 13, n. 1, p. 165, doi. 10.3390/electronics13010165

By:

Lu, Hao;
Chen, Yuhang;
Li, Hongchang;
Zheng, Chuanxiao;
Hu, Heng

Publication type:

Article

Characterization of Sn-xIn Solders and Thermomigration-Induced Interfacial IMC Growth of Cu/Sn-xIn/Cu Micro Solder Joints.

Published in:

Electronics (2079-9292), 2023, v. 12, n. 8, p. 1899, doi. 10.3390/electronics12081899

By:

Du, Yanfeng;
Qiao, Yuanyuan;
Ren, Xiaolei;
Lai, Yanqing;
Zhao, Ning

Publication type:

Article

Evaluation of Solder Joint Reliability in 3D Packaging Memory Devices under Thermal Shock.

Published in:

Electronics (2079-9292), 2022, v. 11, n. 16, p. 2556, doi. 10.3390/electronics11162556

By:

Zhou, Shuai;
Lin, Zhenpei;
Qiu, Baojun;
Wang, Han;
Xiong, Jingang;
He, Chang;
Zhou, Bei;
Pan, Yiliang;
Huang, Renbin;
Bao, Yiliang;
Cai, Nian

Publication type:

Article

Survey on Fatigue Life Prediction of BGA Solder Joints.

Published in:

Electronics (2079-9292), 2022, v. 11, n. 4, p. 542, doi. 10.3390/electronics11040542

By:

Qiu, Baojun;
Xiong, Jingang;
Wang, Han;
Zhou, Shuai;
Yang, Xiuding;
Lin, Zhengpei;
Liu, Maolin;
Cai, Nian

Publication type:

Article

Study of Thermal Stress Fluctuations at the Die-Attach Solder Interface Using the Finite Element Method.

Published in:

Electronics (2079-9292), 2022, v. 11, n. 1, p. 62, doi. 10.3390/electronics11010062

By:

Yan, Luchun;
Yao, Jiawen;
Dai, Yu;
Zhang, Shanshan;
Bai, Wangmin;
Gao, Kewei;
Yang, Huisheng;
Wang, Yanbin

Publication type:

Article

Comparative Study on Reliability and Advanced Numerical Analysis of BGA Subjected to Product-Level Drop Impact Test for Portable Electronics.

Published in:

Electronics (2079-9292), 2020, v. 9, n. 9, p. 1515, doi. 10.3390/electronics9091515

By:

Chung, Soonwan;
Kwak, Jae B.

Publication type:

Article

Validation of Forward Voltage Method to Estimate Cracks of the Solder Joints in High Power LED.

Published in:

Electronics (2079-9292), 2020, v. 9, n. 6, p. 920, doi. 10.3390/electronics9060920

By:

Pinti, Federica;
Belli, Alberto;
Palma, Lorenzo;
Gattari, Massimo;
Pierleoni, Paola

Publication type:

Article

Equivalent Circuit Based Performance Coupling Analysis Method for Lead Wire Interconnection with Defects.

Published in:

Electronics (2079-9292), 2020, v. 9, n. 4, p. 642, doi. 10.3390/electronics9040642

By:

Wang, Zhihai;
Wang, Lu;
Yu, Kunpeng;
Liu, Shaoyi;
Wang, Congsi

Publication type:

Article

A Novel Method for Embedding Semiconductor Dies within Textile Yarn to Create Electronic Textiles.

Published in:

Fibers, 2019, v. 7, n. 2, p. 12, doi. 10.3390/fib7020012

By:

Nashed, Mohamad-Nour;
Hardy, Dorothy Anne;
Hughes-Riley, Theodore;
Dias, Tilak

Publication type:

Article

Mechanical performances of lead-free solder joint connections with applications in the aerospace domain.

Published in:

INCAS Bulletin, 2016, v. 8, n. 1, p. 131, doi. 10.13111/2066-8201.2016.8.1.12

By:

PADURARU, Georgiana;
TUDOR, Andrei;
PETRESCU, Alina;
PLOTOG, Ioan

Publication type:

Article

Development of hypoeutectic SnBi alloy solder reinforced with WO<sub>3</sub> nanoparticles for connecting Cu substrates via thermal bonding.

Published in:

Scientific Reports, 2025, v. 15, n. 1, p. 1, doi. 10.1038/s41598-025-89729-z

By:

Fathy, Naglaa;
Hafez, Khalid M.;
Abdulaziz, Fahad;
Abdelraouf, R. E.;
Ramadan, Mohamed

Publication type:

Article

Review on metallic components released due to the use of electronic cigarettes.

Published in:

Environmental Engineering Research, 2017, v. 22, n. 2, p. 131, doi. 10.4491/eer.2017.056

By:

Mishra, Vinit K.;
Ki-Hyun Kim;
Samaddar, Pallabi;
Kumar, Sandeep;
Aggarwal, M. L.;
Chacko, K. M.

Publication type:

Article

A Hybrid Method for Predicting Fatigue Life of Lead-Free Solder Joints Under Coupled Electrical–Thermal–Mechanical Fields.

Published in:

International Journal of Applied Mechanics, 2022, v. 14, n. 6, p. 1, doi. 10.1142/S1758825122500570

By:

Yi, J. L.;
Chen, J. H.;
Qu, C.;
Zhang, Y. X.;
Cui, Y. H.

Publication type:

Article

The fractal nature analysis by applying grain formations of SAC305/OSP Cu and SAC305-0.05Ni/OSP Cu solder joints for microelectronic packaging.

Published in:

Modern Physics Letters B, 2021, v. 35, n. 33, p. 1, doi. 10.1142/S0217984921504273

By:

Mitić, Vojislav V.;
Fleshman, Collin;
Duh, Jenq-Gong;
Ilić, Ivana D.;
Lazović, Goran

Publication type:

Article

Microstructure and shear behavior of Sn58Bi/Cu solder joint enhanced by SnAgCuBiNi bump.

Published in:

Modern Physics Letters B, 2020, v. 34, n. 36, p. N.PAG, doi. 10.1142/S0217984920504138

By:

Liu, Yang;
Chang, Jian;
Zhou, Min;
Xue, Yuxiong;
Zeng, Xianghua;
Sun, Fenglian

Publication type:

Article

Microstructure evolution and mechanical properties of copper/304 stainless-steel joints by low-temperature soldering.

Published in:

International Journal of Modern Physics B: Condensed Matter Physics; Statistical Physics; Applied Physics, 2022, v. 36, n. 9-11, p. 1, doi. 10.1142/S021797922240015X

By:

Yao, Shuyi;
Shi, Xin;
Li, Yuanxing;
Wan, Liping;
Zheng, Xiangbo;
Wang, Yao;
Chen, Hui

Publication type:

Article

Effect of ultrasonic power on wettability, porosity and mechanical properties of ultrasonic-aided laser reflow soldering.

Published in:

International Journal of Modern Physics B: Condensed Matter Physics; Statistical Physics; Applied Physics, 2021, v. 35, n. 5, p. N.PAG, doi. 10.1142/S0217979221500636

By:

Wang, Bo;
Pan, Kailin;
Gong, Yubing;
Long, Yuhong;
Shi, Kai

Publication type:

Article

Effects of SiC nanowires on reliability of Sn58Bi-0.05GNSs/Cu solder joints.

Published in:

International Journal of Modern Physics B: Condensed Matter Physics; Statistical Physics; Applied Physics, 2021, v. 35, n. 1, p. N.PAG, doi. 10.1142/S0217979221500077

By:

Jiang, Nan;
Zhang, Liang;
Xu, Kai-Kai;
Li, Mu-Lan;
Wang, Feng-Jiang

Publication type:

Article

Effects of nanoparticles on properties and interface reaction of Sn solder for microelectronic packaging.

Published in:

International Journal of Modern Physics B: Condensed Matter Physics; Statistical Physics; Applied Physics, 2020, v. 34, n. 8, p. N.PAG, doi. 10.1142/S0217979220500642

By:

Zhao, Meng;
Zhang, Liang;
Sun, Lei;
Xiong, Ming-yue;
Jiang, Nan;
Xu, Kai-kai

Publication type:

Article

Microstructure evolution and mechanical properties of 6N01S-T5 aluminum alloy joints with semi-solid solders by ultrasonic soldering.

Published in:

International Journal of Modern Physics B: Condensed Matter Physics; Statistical Physics; Applied Physics, 2019, v. 33, n. 1-3, p. N.PAG, doi. 10.1142/S0217979219400277

By:

Wang, Yao;
Li, Yuanxing;
Han, Dengquan;
Qiu, Sifu;
Chen, Hui

Publication type:

Article

GROWTH OF THE IMC AT THE INTERFACE OF SnAgCuBi (Bi = 0,5; 1,0) SOLDER JOINTS WITH Cu SUBSTRATE.

Published in:

Technical Gazette / Tehnički Vjesnik, 2012, v. 19, n. 1, p. 107

By:

Šimeková, Beáta;
Hodúlová, Erika;
Kovaříkovd, Ingrid;
Palcut, Marián;
Ulrich, Koloman

Publication type:

Article

Influence of the shape and particle size of powder solders on the properties of plasticized powder tapes.

Published in:

Welding International, 2022, v. 36, n. 5, p. 281, doi. 10.1080/09507116.2022.2033439

By:

Morozov, V. A.;
Pashkov, I. N.

Publication type:

Article

Effects of Sn-Ag-x layers on the solderability and mechanical properties of Sn-58Bi solder.

Published in:

Welding International, 2021, v. 35, n. 1-3, p. 16, doi. 10.1080/09507116.2021.1913451

By:

Zhang, Shuang;
Liu, Yang;
Zhang, Hao;
Zhou, Min;
Xue, Yuxiong;
Zeng, Xianghua;
Cao, Rongxing;
Chen, Penghui

Publication type:

Article

Effect of isothermal ageing on the microstructure, shear behaviour and hardness of the Sn58Bi/SnAgCuBiNi/Cu solder joints.

Published in:

Welding International, 2021, v. 35, n. 1-3, p. 3, doi. 10.1080/09507116.2021.1889291

By:

Chang, Jian;
Liu, Yang;
Zhang, Hao;
Zhou, Min;
Yuxiong, Xue;
Zeng, Xianghua;
Cao, Rongxing;
Chen, Penghui

Publication type:

Article

Induction brazing of carbide cutters for a mining tool. The choice of composition and solder form.

Published in:

Welding International, 2019, v. 33, n. 10-12, p. 411, doi. 10.1080/09507116.2021.1894032

By:

Pashkov, I.N;
Misnikov, V.E;
Morozov, V.A;
Tavolzhanskiy, S.A

Publication type:

Article

Correction.

Published in:: 2018
Publication type:: Correction Notice

Plastic deformation of lap joints in low-carbon steel brazed with tin.

Published in:

Welding International, 2018, v. 32, n. 11, p. 719, doi. 10.1080/09507116.2018.1443883

By:

Kopaeva, B. V.;
Andreeva, L. P.

Publication type:

Article

Brazing of high-temperature heat exchangers with a composite brazing alloy of the Cr–Ni–Mn system.

Published in:

Welding International, 2016, v. 30, n. 8, p. 635, doi. 10.1080/09507116.2016.1140420

By:

Novosadov, V. S.

Publication type:

Article

Corrosion resistance of ultrasonic soldered aluminium joint using Zn-based solder alloy.

Published in:

Welding International, 2012, v. 26, n. 8, p. 573, doi. 10.1080/09507116.2011.590678

By:

Nagaoka, Toru;
Morisada, Yoshiaki;
Fukusumi, Masao;
Takemoto, Tadashi

Publication type:

Article

Phase Equilibria of the Cu-Si-Sn System at 700 and 500 °C.

Published in:

Journal of Phase Equilibria & Diffusion, 2015, v. 36, n. 5, p. 493, doi. 10.1007/s11669-015-0405-3

By:

Song, Yuanyuan;
Su, Xuping;
Liu, Ya;
Peng, Haoping;
Wu, Changjun;
Wang, Jianhua

Publication type:

Article

Retraction Note: Estimation of Thermomechanical Fatigue Lifetime of Ball Grid Solder Joints in Electronic Devices Using a Machine Learning Approach.

Published in:

2025

By:

Chen, Tzu-Chia;
Opulencia, Maria Jade Catalan;
Majdi, Hasan Sh.;
Hammid, Ali Thaeer;
Sharma, Himanshu;
Sajjadifar, Sami;
Surendar, Aravindhan

Publication type:

Correction Notice

Effects of Minor Addition of Cu and Ni on the Microstructure, Thermal and Mechanical Properties, and Wettability of Sn-58Bi Solder Alloys.

Published in:

Journal of Electronic Materials, 2025, v. 54, n. 5, p. 4154, doi. 10.1007/s11664-025-11861-3

By:

Sungkhaphaitoon, Phairote;
Chantaramanee, Suchart

Publication type:

Article

Time-Lapse Imaging of Bismuth Precipitation and Coarsening on the Surface of Sn-Ag-Cu-Bi Solder Joints After Thermal Cycling: Time-Lapse Imaging of Bismuth Precipitation and Coarsening on the Surface of Sn-Ag-Cu-Bi...: C.-L. Hsieh et al.

Published in:

Journal of Electronic Materials, 2025, v. 54, n. 4, p. 2657, doi. 10.1007/s11664-025-11747-4

By:

Hsieh, Chen-Lin;
Coyle, Richard J.;
Gourlay, Christopher M.

Publication type:

Article

The Effect of Gallium Addition on the Microstructure and Superconducting Properties of In-Bi-Sn Solder Alloys.

Published in:

Journal of Electronic Materials, 2025, v. 54, n. 4, p. 2628, doi. 10.1007/s11664-024-11584-x

By:

Zhou, Jiye;
Shahbazi, Mahboobeh;
Poitras, Jordan T.;
Tan, Xin Fu;
McDonald, Stuart D.;
Nogita, Kazuhiro

Publication type:

Article

Effect of Mo Nanoparticles on the Microstructure Evolution and Tensile Strength of Sn58Bi/Cu Solder Joints.

Published in:

Journal of Electronic Materials, 2025, v. 54, n. 3, p. 2308, doi. 10.1007/s11664-024-11621-9

By:

Zhao, Yuwen;
Yang, Jiyou;
Xu, Liming;
Zhao, Yueqi;
Li, Kun;
Yang, Linmei

Publication type:

Article

Misorientations and Subgrains in Sn-Ag and Sn-Ag-Cu Solder Balls After Solidification.

Published in:

Journal of Electronic Materials, 2024, v. 53, n. 12, p. 8024, doi. 10.1007/s11664-024-11447-5

By:

Sun, Sihan;
Xian, Jingwei;
Hsieh, Chen-Lin;
Gourlay, Christopher M.

Publication type:

Article

Effects of Mixed Percentage on the Microstructure and Mechanical Properties of Sn-52In/Sn-3.0Ag-0.5Cu Hybrid Solder Joints.

Published in:

Journal of Electronic Materials, 2024, v. 53, n. 10, p. 6463, doi. 10.1007/s11664-024-11350-z

By:

Zhao, W. T.;
Ren, J.;
Huang, M. L.

Publication type:

Article