Works about SOLDER joints
Results: 994
Stage-based neural network for reflow profile prediction and reflow recipe optimization for quality and energy-saving.
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- International Journal of Advanced Manufacturing Technology, 2025, v. 137, n. 3, p. 1745, doi. 10.1007/s00170-025-15282-8
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- Article
Experimental study on thermal cycling of nano-silver and nano-silver coated tin flip solder joints.
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- Frequenz, 2025, v. 79, n. 3/4, p. 193, doi. 10.1515/freq-2024-0223
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- Article
Effects of Bi and In Addition on Microstructure and Properties of Sn-0.7Cu Solder.
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- Metals (2075-4701), 2025, v. 15, n. 2, p. 157, doi. 10.3390/met15020157
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- Article
Methods and Means of Eddy Current Testing of Soldered Lap Joints of Electrical Machines.
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- Applied Sciences (2076-3417), 2025, v. 15, n. 4, p. 2036, doi. 10.3390/app15042036
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- Article
Development of hypoeutectic SnBi alloy solder reinforced with WO<sub>3</sub> nanoparticles for connecting Cu substrates via thermal bonding.
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- Scientific Reports, 2025, v. 15, n. 1, p. 1, doi. 10.1038/s41598-025-89729-z
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- Article
Investigation of the Microstructures and Mechanical Properties of Sn-Cu-Bi-In-Ni Solders.
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- Materials (1996-1944), 2025, v. 18, n. 4, p. 858, doi. 10.3390/ma18040858
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- Article
Reliability Analysis of Complex PCB Assemblies Under Temperature Cycling and Random Vibration.
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- Micromachines, 2025, v. 16, n. 2, p. 212, doi. 10.3390/mi16020212
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- Article
Reduction of electromigration damage in SAC305 solder joints by adding Ni nanoparticles through flux doping.
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- Journal of Materials Science, 2015, v. 50, n. 20, p. 6748, doi. 10.1007/s10853-015-9230-7
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- Article
Interfacial reactions with and without current stressing at Sn-Co/Ag and Sn-Co/Cu solder joints.
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- Journal of Materials Science, 2013, v. 48, n. 19, p. 6640, doi. 10.1007/s10853-013-7464-9
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- Article
Analysing the growth of intermetallic compounds in lead-free solder joints by differential scanning calorimetry measurements.
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- Journal of Materials Science, 2013, v. 48, n. 6, p. 2479, doi. 10.1007/s10853-012-7035-5
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- Article
Microstructural variation and high-speed impact responses of Sn-3.0Ag-0.5Cu/ENEPIG solder joints with ultra-thin Ni-P deposit.
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- Journal of Materials Science, 2013, v. 48, n. 6, p. 2724, doi. 10.1007/s10853-012-7070-2
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- Article
The coupling effects of thermal cycling and high current density on Sn58Bi solder joints.
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- Journal of Materials Science, 2013, v. 48, n. 6, p. 2318, doi. 10.1007/s10853-012-7011-0
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- Article
Effect of addition of Ce in Sn-30Zn solder on the structure and properties of the Mg/Al-brazed joint.
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- Journal of Materials Science, 2013, v. 48, n. 5, p. 2030, doi. 10.1007/s10853-012-6972-3
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- Article
The influence of Pd on growth behavior of a quaternary (Cu,Ni,Pd)Sn compound in Sn-3.0Ag-0.5Cu/Au/Pd/Ni-P solder joint during a liquid state reaction.
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- Journal of Materials Science, 2013, v. 48, n. 2, p. 857, doi. 10.1007/s10853-012-6807-2
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- Article
Suppressing the growth of interfacial Cu-Sn intermetallic compounds in the Sn-3.0Ag-0.5Cu-0.1Ni/Cu-15Zn solder joint during thermal aging.
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- Journal of Materials Science, 2012, v. 47, n. 9, p. 4012, doi. 10.1007/s10853-012-6254-0
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- Article
Multi-scale, Correlative Investigation of Thermo-mechanical Fatigue in SAC Solder Balls.
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- Microscopy & Microanalysis, 2024, v. 30, p. 1, doi. 10.1093/mam/ozae044.106
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- Article
Avoiding inelastic strains in solder joint interconnections of space electronics.
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- ZAMM -- Journal of Applied Mathematics & Mechanics / Zeitschrift für Angewandte Mathematik und Mechanik, 2023, v. 103, n. 2, p. 1, doi. 10.1002/zamm.202200097
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- Article
Dynamic response of electronic materials to impact loading: review.
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- ZAMM -- Journal of Applied Mathematics & Mechanics / Zeitschrift für Angewandte Mathematik und Mechanik, 2017, v. 97, n. 6, p. 699, doi. 10.1002/zamm.201600064
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- Article
Reliability issues of lead-free solder joints in electronic devices.
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- Science & Technology of Advanced Materials, 2019, v. 20, n. 1, p. 876, doi. 10.1080/14686996.2019.1640072
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- Article
Structure and properties of Sn-Cu lead-free solders in electronics packaging.
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- Science & Technology of Advanced Materials, 2019, v. 20, n. 1, p. 421, doi. 10.1080/14686996.2019.1591168
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- Article
Intermetallic compounds in 3D integrated circuits technology: a brief review.
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- Science & Technology of Advanced Materials, 2017, v. 18, n. 1, p. 693, doi. 10.1080/14686996.2017.1364975
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- Article
Influence of nanoparticle addition on the formation and growth of intermetallic compounds (IMCs) in Cu/Sn–Ag–Cu/Cu solder joint during different thermal conditions.
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- Science & Technology of Advanced Materials, 2015, v. 16, n. 3, p. 1, doi. 10.1088/1468-6996/16/3/033505
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- Article
Detection of BGA solder defects from X-ray images using deep neural network.
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- Turkish Journal of Electrical Engineering & Computer Sciences, 2020, v. 28, n. 4, p. 2020, doi. 10.3906/elk-1910-135
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- Article
Possibilities of Carrying out Quality Control of Solder Joints Using the Burst test in the Practice.
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- TEM Journal, 2018, v. 7, n. 2, p. 308, doi. 10.18421/TEM72-10
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- Article
Microstructural and mechanical responses of Sn58Bi/Cu composite solder joints with 0.1wt.% Ni and carbon fiber addition.
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- Scientific Reports, 2024, v. 14, n. 1, p. 1, doi. 10.1038/s41598-024-83905-3
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- Article
Effect of Electromigration and Thermal Ageing on the Tin Whiskers' Formation in Thin Sn–0.7Cu–0.05Ga Lead (Pb)-Free Solder Joints.
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- Coatings (2079-6412), 2021, v. 11, n. 8, p. 935, doi. 10.3390/coatings11080935
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- Article
Electrodeposition of Sn–In Alloys Involving Deep Eutectic Solvents.
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- Coatings (2079-6412), 2019, v. 9, n. 12, p. 800, doi. 10.3390/coatings9120800
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- Article
Identifying defects on solar cells using magnetic field measurements and artificial intelligence trained by a finite-element-model.
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- EPJ Photovoltaics, 2023, v. 14, p. 1, doi. 10.1051/epjpv/2023005
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- Article
Effect of Stress Interaction on Multi-Stress Accelerated Life Test Plan: Assessment Based on Particle Swarm Optimization.
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- Sustainability (2071-1050), 2023, v. 15, n. 4, p. 3451, doi. 10.3390/su15043451
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- Article
Effect of Power Cycling and Heat Aging on Reliability and IMC Growth of Sn-5Sb and Sn-10Sb Solder Joints.
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- Advances in Materials Science & Engineering, 2018, p. 1, doi. 10.1155/2018/4829508
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- Article
Corrosion resistance of ultrasonic soldered aluminium joint using Zn-based solder alloy.
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- Welding International, 2012, v. 26, n. 8, p. 573, doi. 10.1080/09507116.2011.590678
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- Article
NONDESTRUCTIVE DEFECT DETECTION IN 3D X-RAY MICROSCOPY DATA OF BALL GRID ARRAY SOLDER FOR VOID DETECTION IN SOLDER JOINTS USING DEEP LEARNING.
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- Electronic Device Failure Analysis, 2024, v. 26, n. 3, p. 4, doi. 10.31399/asm.edfa.2024-3.p004
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- Article
MICROSTRUCTURE AND RELIABILITY OF TIN-SILVER MICRO-COPPER PILLAR ASSEMBLIES.
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- Electronic Device Failure Analysis, 2018, v. 20, n. 1, p. 20, doi. 10.31399/asm.edfa.2018-1.p020
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- Article
Use of Artificial Neural Network to Evaluate and Forecast Selected Welding Parameters on Mild Steel Welded Joints Soldered by Tungsten Inert Gas.
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- Journal of Applied Sciences & Environmental Management, 2024, v. 28, n. 7, p. 2249, doi. 10.4314/jasem.v28i7.40
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- Article
Iterative PGD model reduction for the strongly-coupled thermomechanical analysis of crack propagation in power electronic modules.
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- Computational Mechanics, 2022, v. 70, n. 2, p. 407, doi. 10.1007/s00466-022-02173-y
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- Article
A phase field computational procedure for electromigration with specified contact angle and diffusional anisotropy.
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- Computational Mechanics, 2020, v. 66, n. 2, p. 373, doi. 10.1007/s00466-020-01855-9
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- Article
基于有限元分析的弹载二次电源高加速寿命 试验仿真模拟 .
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- Systems Engineering & Electronics, 2021, v. 43, n. 4, p. 1153, doi. 10.12305/j.issn.1001-506X.2021.04.34
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- Article
Improving the reliability of ball grid arrays under random vibration by optimization of module design.
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- Mechanics of Advanced Materials & Structures, 2020, v. 27, n. 20, p. 1748, doi. 10.1080/15376494.2018.1525626
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- Article
Fatigue Failure Analysis and Structural Improvement of PCB Solder Joints Under Thermal Cycles.
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- Applied Mathematics & Mechanics (1000-0887), 2015, v. 36, n. 4, p. 414, doi. 10.3879/j.issn.1000-0887.2015.04.009
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- Article
Study of the effect of Sn grain boundaries on IMC morphology in solid state inter-diffusion soldering.
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- Scientific Reports, 2019, v. 9, n. 1, p. N.PAG, doi. 10.1038/s41598-019-51179-9
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- Article
Research on defect detection of improved target detection algorithm on the image surface of 5G communication ring.
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- International Journal of Modeling, Simulation & Scientific Computing, 2023, v. 14, n. 1, p. 1, doi. 10.1142/S1793962323410118
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- Article
Experimental and finite element analysis on determining the fatigue life of pb-free solder joint (Sn-0.5Cu-3Bi-1Ag) used in electronic packages under harmonic loads.
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- International Journal of Modeling, Simulation & Scientific Computing, 2020, v. 11, n. 3, p. N.PAG, doi. 10.1142/S1793962320500208
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- Article
A Hybrid Method for Predicting Fatigue Life of Lead-Free Solder Joints Under Coupled Electrical–Thermal–Mechanical Fields.
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- International Journal of Applied Mechanics, 2022, v. 14, n. 6, p. 1, doi. 10.1142/S1758825122500570
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- Article
高温高电流密度下 BGA 焊点电迁移损伤.
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- Journal of Beijing University of Technology, 2021, v. 47, n. 11, p. 1264, doi. 10.11936/bjutxb2021040010
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- Article
SABI333 焊点拉伸性能及晶界对焊点拉伸性能影响.
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- Journal of Beijing University of Technology, 2021, v. 47, n. 9, p. 1074, doi. 10.11936/bjutxb2019120025
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- Article
基于价电子理论的 Ag-Sn 金属间化合物形成机理.
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- Journal of Beijing University of Technology, 2021, v. 47, n. 6, p. 655, doi. 10.11936/bjutxb2019100006
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- Article
SolderNet: Towards trustworthy visual inspection of solder joints in electronics manufacturing using explainable artificial intelligence.
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- AI Magazine, 2023, v. 44, n. 4, p. 442, doi. 10.1002/aaai.12129
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- Article
Research Progress on the Solder Joint Reliability of Electronics Using in Deep Space Exploration.
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- Chinese Journal of Mechanical Engineering, 2023, v. 36, n. 1, p. 1, doi. 10.1186/s10033-023-00834-4
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- Article
SHOP TIP: Testing Electric Draw Stop Units Before Installation.
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- Journal of American Organbuilding, 2024, v. 39, n. 3, p. 28
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- Article
Enhancement of interfacial reaction between solid iron and molten tin by mechanical actions.
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- Materials Science & Technology, 2014, v. 30, n. 8, p. 944, doi. 10.1179/1743284713Y.0000000369
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- Article