Works about SOLDER & soldering

Results: 2946

Superconducting Properties of Welded Three Top‐Seeded YBa2Cu3O7−x Produced with NdBCO/YBCO/MgO Thin‐Film Seed.

Published in:

Physica Status Solidi (B), 2025, v. 262, n. 4, p. 1, doi. 10.1002/pssb.202400455

By:

Batur, Kübra Nur;
Duman, Şeyda;
Çakir, Bakiye;
Başoğlu, Mehmet;
Aydiner, Alev

Publication type:

Article

PCB Electronic Component Soldering Defect Detection Using YOLO11 Improved by Retention Block and Neck Structure.

Published in:

Sensors (14248220), 2025, v. 25, n. 11, p. 3550, doi. 10.3390/s25113550

By:

Xu, Youzhi;
Wu, Hao;
Liu, Yulong;
Zhang, Xing

Publication type:

Article

Thermal Fatigue Behaviors of BGA Packages with an Optimized Solder Joint Layout.

Published in:

Electronics (2079-9292), 2025, v. 14, n. 11, p. 2286, doi. 10.3390/electronics14112286

By:

Abdel Razzaq, Mohammed;
Meilunas, Michael;
Cao, Xian A.;
Wilcox, Jim;
Ramini, Abdallah

Publication type:

Article

Impact of Annealing Treatment on the Microstructure and Micromechanical Properties of Pb-Containing and Pb-Free Solder Alloys.

Published in:

Materials (1996-1944), 2025, v. 18, n. 11, p. 2596, doi. 10.3390/ma18112596

By:

Jiang, Wen;
Wang, Changwei;
Han, Kangning;
Zhu, Yaxin;
Hou, Chuantao;
Xing, Ruisi

Publication type:

Article

Integrating Virtual Reality into Welding Training: An Industry 5.0 Approach.

Published in:

Electronics (2079-9292), 2025, v. 14, n. 10, p. 1964, doi. 10.3390/electronics14101964

By:

Alfaro-Viquez, David;
Zamora-Hernandez, Mauricio;
Fernandez-Vega, Michael;
Garcia-Rodriguez, Jose;
Azorin-Lopez, Jorge

Publication type:

Article

Luojiu Hua and Its Archive: Index Cards and Wild Cards.

Published in:

Culture Context / Konteksty Kultury, 2024, v. 21, n. 3, p. 280, doi. 10.4467/23531991KK.24.027.20862

By:

Peng Yi

Publication type:

Article

Using wet chemistry for etching under-bump metal.

Published in:

Solid State Technology, 2001, v. 44, n. 10, p. 89

By:

Beret, Marvin;
Solomon, Gary

Publication type:

Article

Electrochemically deposited solder bumps for wafer-level packaging.

Published in:

Solid State Technology, 2001, v. 44, n. 4, p. 83

By:

Solomon, Gary

Publication type:

Article

Thermal-mechanical stress analysis of a silicon-based system-in-a-package.

Published in:

Solid State Technology, 2000, v. 43, n. 7, p. 279

By:

Goetz, Martin P.

Publication type:

Article

Effects of Minor Addition of Cu and Ni on the Microstructure, Thermal and Mechanical Properties, and Wettability of Sn-58Bi Solder Alloys.

Published in:

Journal of Electronic Materials, 2025, v. 54, n. 5, p. 4154, doi. 10.1007/s11664-025-11861-3

By:

Sungkhaphaitoon, Phairote;
Chantaramanee, Suchart

Publication type:

Article

Role of Cavitation in Necking-Driven Tertiary Stage of Power-Law Creep of Sn and Sn-Ag-Cu Solder Alloy: An Experiment-Inspired Modeling Approach.

Published in:

Journal of Electronic Materials, 2025, v. 54, n. 4, p. 2638, doi. 10.1007/s11664-024-11688-4

By:

Kanjilal, Anwesha;
Kumar, Praveen

Publication type:

Article

The Effect of Gallium Addition on the Microstructure and Superconducting Properties of In-Bi-Sn Solder Alloys.

Published in:

Journal of Electronic Materials, 2025, v. 54, n. 4, p. 2628, doi. 10.1007/s11664-024-11584-x

By:

Zhou, Jiye;
Shahbazi, Mahboobeh;
Poitras, Jordan T.;
Tan, Xin Fu;
McDonald, Stuart D.;
Nogita, Kazuhiro

Publication type:

Article

Systematic Study of Liquid-State Interfacial Reactions Between Co and In-Sn Solders with Varying Sn Contents.

Published in:

Journal of Electronic Materials, 2025, v. 54, n. 4, p. 2589, doi. 10.1007/s11664-024-11382-5

By:

Wang, Chao-hong;
Chang, Tai-yu

Publication type:

Article

Effects of Interaction Between Sn-Rich and Pb-Rich Phases on the Mechanical Properties of Sn-Pb Eutectic Solder Alloy at Cryogenic Temperature.

Published in:

Journal of Electronic Materials, 2025, v. 54, n. 3, p. 2368, doi. 10.1007/s11664-024-11694-6

By:

An, Qi;
Zhang, Minghua;
Wang, Ningning;
Fei, Jingming

Publication type:

Article

Microstructurally Adaptive Model for Evolution of Creep Due to Aging in SnAgCu Solder Alloys: Microstructurally Adaptive Model...: S. C. Chavali et al.

Published in:

Journal of Electronic Materials, 2025, v. 54, n. 3, p. 2404, doi. 10.1007/s11664-024-11701-w

By:

Chavali, Sri Chaitra;
Ganti, Sai Sanjit;
Singh, Yuvraj;
Subbarayan, Ganesh;
Dutta, Indranath;
Dayananda, Mysore

Publication type:

Article

Effect of Mo Nanoparticles on the Microstructure Evolution and Tensile Strength of Sn58Bi/Cu Solder Joints.

Published in:

Journal of Electronic Materials, 2025, v. 54, n. 3, p. 2308, doi. 10.1007/s11664-024-11621-9

By:

Zhao, Yuwen;
Yang, Jiyou;
Xu, Liming;
Zhao, Yueqi;
Li, Kun;
Yang, Linmei

Publication type:

Article

Misorientations and Subgrains in Sn-Ag and Sn-Ag-Cu Solder Balls After Solidification.

Published in:

Journal of Electronic Materials, 2024, v. 53, n. 12, p. 8024, doi. 10.1007/s11664-024-11447-5

By:

Sun, Sihan;
Xian, Jingwei;
Hsieh, Chen-Lin;
Gourlay, Christopher M.

Publication type:

Article

Effect of Annealing Treatment on Electromigration Resistance of Low-Temperature Sn-57Bi-1Ag Solder Interconnect.

Published in:

Journal of Electronic Materials, 2024, v. 53, n. 11, p. 7065, doi. 10.1007/s11664-024-11402-4

By:

Chen, J. L.;
Wang, S. B.;
Ren, J.;
Huang, M. L.

Publication type:

Article

Effects of Mixed Percentage on the Microstructure and Mechanical Properties of Sn-52In/Sn-3.0Ag-0.5Cu Hybrid Solder Joints.

Published in:

Journal of Electronic Materials, 2024, v. 53, n. 10, p. 6463, doi. 10.1007/s11664-024-11350-z

By:

Zhao, W. T.;
Ren, J.;
Huang, M. L.

Publication type:

Article

Enhanced Shear Strength of Sn-Bi/(111)Cu Joints by Refined Distribution of Bi in the Composite Solder.

Published in:

Journal of Electronic Materials, 2024, v. 53, n. 8, p. 4539, doi. 10.1007/s11664-024-11169-8

By:

Zhang, Dan;
Ma, Haoran;
Dong, Chong;
Guo, Tianhao;
Ma, Haitao;
Wang, Yunpeng

Publication type:

Article

Fine-Pitch Copper Nanowire Interconnects for 2.5/3D System Integration.

Published in:

Journal of Electronic Materials, 2024, v. 53, n. 8, p. 4410, doi. 10.1007/s11664-024-11107-8

By:

Bickel, Steffen;
Quednau, Sebastian;
Birlem, Olav;
Graff, Andreas;
Altmann, Frank;
Junghähnel, Manuela;
Panchenko, Juliana

Publication type:

Article

In-Line Test Structures and Non-destructive Characterization of Electromigration-Driven Phase Evolution in Microscale Solder Joints.

Published in:

Journal of Electronic Materials, 2024, v. 53, n. 6, p. 3070, doi. 10.1007/s11664-024-11043-7

By:

Jois, Chetan;
Chou, Pei-En;
Subbarayan, Ganesh

Publication type:

Article

Long-Term Microstructural Stability of Sn-40Bi and Sn-40Bi-10In Alloys.

Published in:

Journal of Electronic Materials, 2024, v. 53, n. 5, p. 2455, doi. 10.1007/s11664-024-10995-0

By:

Spinelli, José E.;
Leal, Jaderson R.;
Wu, John A.;
Luktuke, Amey;
Ganju, Eshan;
Chawla, Nikhilesh

Publication type:

Article

Thermal Cycling–Electric Current Coupling Damage Mechanisms of SnAgCu/Cu Solder Joints Under Different Temperature Ranges.

Published in:

Journal of Electronic Materials, 2024, v. 53, n. 5, p. 2544, doi. 10.1007/s11664-024-10975-4

By:

Zhang, Q. K.;
An, C. W.;
Song, Z. L.

Publication type:

Article

Laser power effects on properties of laser brazing diamond coating.

Published in:

Surface Engineering, 2020, v. 36, n. 12, p. 1315, doi. 10.1080/02670844.2020.1758292

By:

Long, Weimin;
Liu, Dashuang;
Dong, Xian;
Wu, Aiping

Publication type:

Article

Characterisation of lead free solderability of immersion Sn finish on PWBs using wetting balance technique.

Published in:

Surface Engineering, 2008, v. 24, n. 5, p. 337, doi. 10.1179/174329408X281821

By:

Hong, S. J.;
Park, B-H.;
Seo, D. S.;
Ryu, C.-R.

Publication type:

Article

Advancement solidification microstructure and mechanical properties of Sn–2.0Ag–0.5Cu alloy by applying a rotary magnetic field.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 20, p. 18838, doi. 10.1007/s10854-019-02240-w

By:

Hammad, A. E.;
Ragab, M.

Publication type:

Article

Effects of TiO2 nanoparticles addition on physical and soldering properties of Sn–xTiO2 composite solder.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 20, p. 18828, doi. 10.1007/s10854-019-02239-3

By:

Liu, Zhiyuan;
Ma, Haoran;
Shang, Shengyan;
Wang, Yunpeng;
Li, Xiaogan;
Ma, Haitao

Publication type:

Article

Influences of Ag and In alloying on Sn-Bi eutectic solder and SnBi/Cu solder joints.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 20, p. 18524, doi. 10.1007/s10854-019-02206-y

By:

Wang, Z.;
Zhang, Q. K.;
Chen, Y. X.;
Song, Z. L.

Publication type:

Article

Wettability, interfacial reaction and mechanical properties of Sn/Sn–CuZnAl solder and Cu sheet during solid–liquid diffusion.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 20, p. 18462, doi. 10.1007/s10854-019-02200-4

By:

Sun, Lei;
Chen, Ming-he;
Zhang, Liang;
Xie, Lan-sheng;
Wei, Chun-chun

Publication type:

Article

Microstructure and shear property of In-Sn-xAg solder joints fabricated by TLP bonding.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 19, p. 18211, doi. 10.1007/s10854-019-02175-2

By:

Yang, Li;
Xiong, Yifeng;
Zhang, Yaocheng;
Jiang, Wei;
Wei, Di

Publication type:

Article

Wettability and interfacial morphology of Sn–3.0Ag–0.5Cu solder on electroless nickel plated ZnS transparent ceramic.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 19, p. 17972, doi. 10.1007/s10854-019-02151-w

By:

Zhang, Shuye;
Zhu, Bingxuan;
Zhou, Xiang;
Wang, Xingxing;
Lin, Tiesong;
He, Peng;
Paik, Kyung-Wook

Publication type:

Article

Influences of doping Ti nanoparticles on microstructure and properties of Sn58Bi solder.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 19, p. 17583, doi. 10.1007/s10854-019-02107-0

By:

Jiang, Nan;
Zhang, Liang;
Liu, Zhi-quan;
Sun, Lei;
Xiong, Ming-yue;
Zhao, Meng;
Xu, Kai-kai

Publication type:

Article

Nucleation behavior of Mg2Sn on Ta surface during ultrasonic-assisted soldering of Ta/Sn/Mg joint.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 18, p. 17239, doi. 10.1007/s10854-019-02071-9

By:

Yang, Haifeng;
Tan, Qi;
Ji, Hongjun;
Xu, Wenfu;
Wang, Zhihong;
Li, Mingyu

Publication type:

Article

Experimental investigations in the intermetallic and microvoid formation in sub-200 °C Cu–Sn bonding.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 17, p. 16427, doi. 10.1007/s10854-019-02017-1

By:

Kannojia, Harindra Kumar;
Dixit, Pradeep

Publication type:

Article

Effect of polyvinyl chloride fire smoke on the long-term corrosion kinetics and surface microstructure of tin–lead and lead-free solders.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 17, p. 16395, doi. 10.1007/s10854-019-02013-5

By:

Li, Qian;
Lin, Jin;
Li, Changhai;
Lu, Shouxiang;
Chen, Xiao

Publication type:

Article

Effect of polycrystalline Cu microstructures on IMC growth behavior at Sn/Cu soldering interface.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 17, p. 15964, doi. 10.1007/s10854-019-01966-x

By:

Zhu, Zhidan;
Ma, Haoran;
Shang, Shengyan;
Ma, Haitao;
Wang, Yunpeng;
Li, Xiaogan

Publication type:

Article

Void fraction of a Sn–Ag–Cu solder joint underneath a chip resistor and its effect on joint strength and thermomechanical reliability.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 17, p. 15889, doi. 10.1007/s10854-019-01935-4

By:

Seo, Wonil;
Ko, Yong-Ho;
Kim, Young-Ho;
Yoo, Sehoon

Publication type:

Article

Current density dependent shear performance and fracture behavior of micro-scale BGA structure Cu/Sn–3.0Ag–0.5Cu/Cu joints under coupled electromechanical loads.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 16, p. 15184, doi. 10.1007/s10854-019-01891-z

By:

Le, W. K.;
Ning, X.;
Ke, C. B.;
Zhou, M. B.;
Zhang, X. P.

Publication type:

Article

Influence of Ni and Cu electrodeposits on the interfacial reaction between SAC305 solder and the Bi2(Te,Se)3 thermoelectric material.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 15, p. 14791, doi. 10.1007/s10854-019-01852-6

By:

Cheng, Jinxuan;
Hu, Xiaowu;
Li, Qinglin

Publication type:

Article

The effect of temperature gradient on interfacial Cu6Sn5 growth during thermal compression bonding.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 15, p. 13957, doi. 10.1007/s10854-019-01741-y

By:

Sun, Fenglian;
Yin, Zuozhu;
Guo, Mengjiao

Publication type:

Article

Viscoplastic characterization and mechanical strength of novel Sn–1.7Ag–0.7Cu lead-free solder alloys with microalloying of Te and Co.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 14, p. 12937, doi. 10.1007/s10854-019-01656-8

By:

El-Daly, A. A.;
Ibrahiem, A. A.;
Abdo, M. A.;
Eid, N. A. M.

Publication type:

Article

Effects of Ni layer thickness of thin-ENEPIG surface finishes on the interfacial reactions and shear strength of Sn-3.0Ag–0.5Cu solder joints during aging.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 14, p. 12911, doi. 10.1007/s10854-019-01653-x

By:

Kim, Jungsoo;
Back, Jong-Hoon;
Jung, Seung-Boo;
Yoon, Jeong-Won

Publication type:

Article

Thermal and mechanical property of FCLED package component interconnected with Sn–MWCNT composite solder.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 14, p. 12869, doi. 10.1007/s10854-019-01648-8

By:

Lee, Choong-Jae;
Jeong, Haksan;
Jung, Kwang-Ho;
Min, Kyung Deuk;
Jung, Seung-Boo

Publication type:

Article

Effects of substrate annealing on wettability and intermetallic compound formation in Sn–3.0Cu/Cu systems.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 13, p. 12087, doi. 10.1007/s10854-019-01566-9

By:

Mookam, Niwat;
Kanlayasiri, Kannachai

Publication type:

Article

Microstructure and mechanical properties of Sn–1.0Ag–0.5Cu solder with minor Zn additions.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 13, p. 11914, doi. 10.1007/s10854-019-01532-5

By:

Leong, Y. M.;
Haseeb, A. S. M. A.;
Nishikawa, Hiroshi;
Mokhtari, Omid

Publication type:

Article

Solder interconnects reliability subjected to thermal-vibration coupling loading.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 12, p. 11482, doi. 10.1007/s10854-019-01501-y

By:

Jiao, Honghao;
Sun, Fenglian;
Wu, Nan;
Liu, Yang;
Fang, Hongyuan

Publication type:

Article

Microstructure refinement, characterization of tensile behavior and aging resistance of Zr-modified SAC105 solder alloy.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 12, p. 11429, doi. 10.1007/s10854-019-01492-w

By:

Wang, Hongxuan;
Lu, Tao;
Yi, Danqing;
Wang, Bin

Publication type:

Article

A study on the resistivity and mechanical properties of modified nano-Ag coated Cu particles in electrically conductive adhesives.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 10, p. 9171, doi. 10.1007/s10854-019-01246-8

By:

Zhang, Shuye;
Qi, Xiaoquan;
Yang, Ming;
Cao, Yang;
Lin, Tiesong;
He, Peng;
Paik, Kyung-Wook

Publication type:

Article

Relation of silver electrode solderability to intermetallic compound growth rate.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 8, p. 7209, doi. 10.1007/s10854-019-00972-3

By:

Zhang, Jiefeng;
Li, Guoqing;
Yuan, Xiao;
Zhao, Hua;
Yang, Yunxia;
Li, Hongbo;
Tong, Hua

Publication type:

Article