High‐Density Post‐Perovskite for Ultra‐Sensitive Hard X‐Ray Detection.
- Published in:
- Angewandte Chemie, 2025, v. 137, n. 19, p. 1, doi. 10.1002/ange.202425448
- By:
- Publication type:
- Article
Works about SEMICONDUCTORS
Results: 5000
1
2
Uncovering the doping mechanism of nitric oxide in high-performance P-type WSe<sub>2</sub> transistors.
- Published in:
- Nature Communications, 2025, v. 16, n. 1, p. 1, doi. 10.1038/s41467-025-59423-9
- By:
- Publication type:
- Article
3
Computers in the human services.
- Published in:
- Social Work, 1979, v. 24, n. 2, p. 96
- By:
- Publication type:
- Article
4
Developments in materials for 157nm photoresists.
- Published in:
- Solid State Technology, 2001, v. 44, n. 10, p. 63
- Publication type:
- Article
5
The race is on: CVD and spin-on vie for the low-k dielectric market.
- Published in:
- Solid State Technology, 2001, v. 44, n. 10, p. 40
- By:
- Publication type:
- Article
6
Chemistry and treatment of III-V semiconductor wastewater.
- Published in:
- Solid State Technology, 2001, v. 44, n. 8, p. 79
- By:
- Publication type:
- Article
7
An alternative to solid polyurethane for CMP.
- Published in:
- Solid State Technology, 2001, v. 44, n. 8, p. 30
- By:
- Publication type:
- Article
8
WORLDWIDE HIGHLIGHTS.
- Published in:
- Solid State Technology, 2001, v. 44, n. 8, p. 18
- Publication type:
- Article
9
Characterizing resists and films with VUV spectroscopic ellipsometry.
- Published in:
- Solid State Technology, 2001, v. 44, n. 7, p. 165
- By:
- Publication type:
- Article
10
Safety solutions for high-pressure gas cylinders.
- Published in:
- Solid State Technology, 2001, v. 44, n. 7, p. 153
- By:
- Publication type:
- Article
11
Spin-on stacked films for low-k[sub eff] dielectrics.
- Published in:
- Solid State Technology, 2001, v. 44, n. 7, p. 105
- By:
- Publication type:
- Article
12
Floating 3-D display seemingly out of sci-fi.
- Published in:
- Solid State Technology, 2001, v. 44, n. 6, p. 28
- Publication type:
- Article
13
Adapting to the economics of SOC.
- Published in:
- Solid State Technology, 2001, v. 44, n. 6, p. 14
- By:
- Publication type:
- Article
14
WORLDWIDE HIGHLIGHTS.
- Published in:
- Solid State Technology, 2001, v. 44, n. 5, p. 18
- Publication type:
- Article
15
Navigating yield through the maze of copper CMP defects.
- Published in:
- Solid State Technology, 2001, v. 44, n. 4, p. 63
- By:
- Publication type:
- Article
16
Process and environmental benefits with solvent-free stripping.
- Published in:
- Solid State Technology, 2001, v. 44, n. 4, p. 52
- By:
- Publication type:
- Article
17
Eliminating the effects of gas-system pressure transients.
- Published in:
- Solid State Technology, 2001, v. 44, n. 2, p. 115
- By:
- Publication type:
- Article
18
Part Two of Two--Operation: How to make a sensor smarter.
- Published in:
- Solid State Technology, 2001, v. 44, n. 2, p. 105
- By:
- Publication type:
- Article
19
Ultrasonic technologies enable ultra-fine-pitch low-temperature bonding.
- Published in:
- Solid State Technology, 2001, v. 44, n. 2, p. 97
- By:
- Publication type:
- Article
20
At long last, SOI wafer market on the move.
- Published in:
- Solid State Technology, 2001, v. 44, n. 2, p. 62
- By:
- Publication type:
- Article
21
Advanced lithography needs rigorously tested fused silica glass.
- Published in:
- Solid State Technology, 2001, v. 44, n. 1, p. 111
- By:
- Publication type:
- Article
22
Strong phase shift mask designs with lower cost.
- Published in:
- Solid State Technology, 2001, v. 44, n. 1, p. 104
- By:
- Publication type:
- Article
23
Low-k integration issues.
- Published in:
- Solid State Technology, 2001, v. 44, n. 1, p. 78
- By:
- Publication type:
- Article
24
Equipment and process considerations for ALD.
- Published in:
- Solid State Technology, 2001, v. 44, n. 1, p. 70
- By:
- Publication type:
- Article
25
Nodal predictions.
- Published in:
- Solid State Technology, 2001, v. 44, n. 1, p. 62
- Publication type:
- Article
26
The lithography equipment marketplace.
- Published in:
- Solid State Technology, 2001, v. 44, n. 1, p. 58
- By:
- Publication type:
- Article
27
Welcome to the REAL New Millennium.
- Published in:
- 2001
- By:
- Publication type:
- Editorial
28
M is for Manufacturing.
- Published in:
- Solid State Technology, 2000, v. 43, n. 12, p. 44
- By:
- Publication type:
- Article
29
The challenges of macro integration for fully automated 300mm fabs.
- Published in:
- Solid State Technology, 2000, v. 43, n. 10, p. 52
- By:
- Publication type:
- Article
30
Design and chip fabrication need to be linked.
- Published in:
- Solid State Technology, 2000, v. 43, n. 8, p. 12
- By:
- Publication type:
- Article
31
WORLD NEWS.
- Published in:
- Solid State Technology, 2000, v. 43, n. 7, p. 16
- Publication type:
- Article
32
Cu contamination control for advanced interconnect manufacturing.
- Published in:
- Solid State Technology, 2000, v. 43, n. 5, p. 137
- By:
- Publication type:
- Article
33
1999 Roadmap: Solutions and caveats.
- Published in:
- Solid State Technology, 2000, v. 43, n. 5, p. 76
- Publication type:
- Article
34
Nitrogen put in GaAs for solar cells.
- Published in:
- Solid State Technology, 2000, v. 43, n. 5, p. 34
- By:
- Publication type:
- Article
35
SC300 consortium experiments wih single monitor wafer.
- Published in:
- Solid State Technology, 2000, v. 43, n. 4, p. 30
- By:
- Publication type:
- Article
36
Tech Briefs.
- Published in:
- Solid State Technology, 2000, v. 43, n. 4, p. 26
- Publication type:
- Article
37
Keeping ahead of the curve.
- Published in:
- Solid State Technology, 2000, v. 43, n. 4, p. 12
- By:
- Publication type:
- Article
38
Powerful simulation yields perovskite transistors.
- Published in:
- Solid State Technology, 2000, v. 43, n. 3, p. 22
- By:
- Publication type:
- Article
39
Photomask market prospect brighter; industry consolidation continues.
- Published in:
- Solid State Technology, 2000, v. 43, n. 2, p. 47
- By:
- Publication type:
- Article
40
IEDM 1999 focused on CMOS solutions.
- Published in:
- Solid State Technology, 2000, v. 43, n. 2, p. 30
- By:
- Publication type:
- Article
41
SC300 consortium experiments with single monitor wafer.
- Published in:
- Solid State Technology, 2000, v. 43, n. 2, p. 28
- Publication type:
- Article
42
Silicon-pulling technology for 2000+.
- Published in:
- Solid State Technology, 2000, v. 43, n. 1, p. 69
- By:
- Publication type:
- Article
43
Exciting, challenging, anything but routine.
- Published in:
- Solid State Technology, 2000, v. 43, n. 1, p. 49
- By:
- Publication type:
- Article
44
Growth predicted for sputtering target and sputtered film markets.
- Published in:
- Solid State Technology, 2000, v. 43, n. 1, p. 24
- By:
- Publication type:
- Article
45
Worlwide highlights.
- Published in:
- Solid State Technology, 2000, v. 43, n. 1, p. 16
- Publication type:
- Article
46
Diverging paths ahead for process tools?
- Published in:
- 2000
- By:
- Publication type:
- Editorial
47
Tech Briefs.
- Published in:
- Solid State Technology, 1999, v. 42, n. 12, p. 20
- Publication type:
- Article
48
Significant progress with pilot-line 300mm lithography.
- Published in:
- Solid State Technology, 1999, v. 42, n. 12, p. 18
- By:
- Publication type:
- Article
49
Two-layer copper for SDRAM.
- Published in:
- Solid State Technology, 1999, v. 42, n. 11, p. 28
- Publication type:
- Article
50
Isolation's path to SOI technology.
- Published in:
- Solid State Technology, 1999, v. 42, n. 10, p. 109
- By:
- Publication type:
- Article