Works about KIRKENDALL effect

Results: 1583

Hierarchical Cu2O/CuO/TiO2 composite films with high superhydrophobicity and strong adhesion.

Published in:

Surface Engineering, 2021, v. 37, n. 10, p. 1223, doi. 10.1080/02670844.2021.1873899

By:

Zeng, Chunyan;
Wang, Yong;
Gao, Chen;
Liu, Yi

Publication type:

Article

Analytical-experimental approach for accurate depth profile evaluation of diffusion zone in plasma nitrided iron.

Published in:

Surface Engineering, 2011, v. 27, n. 4, p. 259, doi. 10.1179/174329409X439069

By:

Hosseini, S R;
Ashrafizadeh, F;
Kermanpur, A

Publication type:

Article

Processing and microstructure of NiRuAl diffusion barrier coating on Ni-based superalloy.

Published in:

Surface Engineering, 2011, v. 27, n. 4, p. 253, doi. 10.1179/174329409X446359

By:

Wang, Y;
Guo, H-B;
Peng, L-Q;
Gong, S-K

Publication type:

Article

Non‐Isothermal Solid Phase Diffusion in Activated Powder Mixtures. Thermal Regimes and Critical Conditions.

Published in:

Propellants, Explosives, Pyrotechnics, 2019, v. 44, n. 4, p. 472, doi. 10.1002/prep.201800086

By:

Filimonov, Valeriy Y.;
Koshelev, Konstantin B.

Publication type:

Article

Barrier Properties of Biodegradable Aliphatic–Aromatic Copolyesters (PBXT Series).

Published in:

Macromolecular Chemistry & Physics, 2024, v. 225, n. 15, p. 1, doi. 10.1002/macp.202400051

By:

Wang, Lizheng;
Tu, Zhu;
Liang, Jiaming;
Wei, Zhiyong

Publication type:

Article

Synthesis of Uniquely Structured SnO2 Hollow Nanoplates and Their Electrochemical Properties for Li-Ion Storage.

Published in:

Advanced Functional Materials, 2017, v. 27, n. 4, p. n/a, doi. 10.1002/adfm.201603399

By:

Park, Gi Dae;
Lee, Jung ‐ Kul;
Kang, Yun Chan

Publication type:

Article

Control of the Oxygen and Cobalt Atoms Diffusion through Co Nanoparticles Differing by Their Crystalline Structure and Size.

Published in:

Advanced Functional Materials, 2015, v. 25, n. 6, p. 891, doi. 10.1002/adfm.201403617

By:

Yang, Zhijie;
Yang, Nailiang;
Yang, Jianhui;
Bergström, Johanna;
Pileni, Marie‐Paule

Publication type:

Article

Creep performance of phase-inhomogeneous Cu/Sn–58Bi/Cu solder joints with increasing current density.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 20, p. 16167, doi. 10.1007/s10854-022-08507-z

By:

Li, Xingmin;
Wang, Jian;
Qin, Hongbo;
He, Siliang;
Li, Wangyun;
Wei, Song

Publication type:

Article

Growth mechanism and kinetics of Cu3Sn in the interfacial reaction between liquid Sn and diversely oriented Cu substrates.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 6, p. 2957, doi. 10.1007/s10854-021-07494-x

By:

Shang, Min;
Dong, Chong;
Ma, Haoran;
Ma, Haitao;
Wang, Yunpeng

Publication type:

Article

Role of graphene oxide (GO) for enhancing the solidification rate and mechanical properties of Sn–6.5Zn–0.4 wt% Cu Pb-free solder alloy.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 1, p. 522, doi. 10.1007/s10854-021-07324-0

By:

Fouda, A. N.;
Eid, E. A.

Publication type:

Article

Preparation of carbon-coated MnCO3@MnO2 hierarchical hollow nanostructure and their application in supercapacitors.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 1, p. 367, doi. 10.1007/s10854-021-07306-2

By:

Sun, Meijiao;
Zhang, Zhenkun;
Wang, Xiaoqiang;
Tan, Yifan;
Xia, Shuixin;
Xue, Yuhua;
Yang, Guangzhi

Publication type:

Article

Interfacial microstructure evolution of solder joints by doping Cu nanoparticles into Ni(P) electroless plating.

Published in:

Journal of Materials Science: Materials in Electronics, 2020, v. 31, n. 22, p. 20232, doi. 10.1007/s10854-020-04543-9

By:

Cheng, Jinxuan;
Zhang, Jiankang;
Liu, Yi;
Hu, Xiaowu;
Zhang, Zhe;
Jiang, Xiongxin

Publication type:

Article

Study of accelerated shear creep behavior and fracture process of micro-scale ball grid array (BGA) structure Cu/Sn–3.0Ag–0.5Cu/Cu joints under coupled electro-thermo-mechanical loads.

Published in:

Journal of Materials Science: Materials in Electronics, 2020, v. 31, n. 18, p. 15575, doi. 10.1007/s10854-020-04121-z

By:

Le, W. K.;
Zhou, J. Y.;
Ke, C. B.;
Zhou, M. B.;
Zhang, X. P.

Publication type:

Article

The reliability assessment of Au–Al bonds using parallel gap resistance microwelding.

Published in:

Journal of Materials Science: Materials in Electronics, 2020, v. 31, n. 8, p. 6313, doi. 10.1007/s10854-020-03187-z

By:

Liu, Peng;
Cong, Sen;
Tan, Xingwen;
Lin, Xiang;
Wu, Ping

Publication type:

Article

Effect of nano-ZnO particles on wettability, interfacial morphology and growth kinetics of Sn–3.0Ag–0.5Cu–xZnO composite solder.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 21, p. 19214, doi. 10.1007/s10854-019-02279-9

By:

Qu, Min;
Cao, Tianze;
Cui, Yan;
Liu, Fengbin;
Jiao, Zhiwei

Publication type:

Article

Leveraging prior strain rates effect during stress relaxation of Sn–1.7Ag–0.7Cu lead-free alloys with microalloying of Te and Co for microelectronics applications.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 14, p. 13757, doi. 10.1007/s10854-019-01758-3

By:

El-Daly, A. A.;
Zohdy, K. M.;
Abdo, M. A.;
Eid, N. A. M.

Publication type:

Article

Effects of Pd addition on the interfacial reactions between Cu and Al during ultrasonic welding.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 14, p. 12840, doi. 10.1007/s10854-019-01729-8

By:

Du, Yahong;
Wen, Ming;
Ji, Hongjun;
Li, Mingyu;
Liu, Zhi-Quan

Publication type:

Article

Bonding performance of sintered nanosilver joints on bare copper substrates with different grain structures.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 14, p. 12860, doi. 10.1007/s10854-019-01601-9

By:

Du, Cheng-Jie;
Li, Xin;
Mei, Yun-Hui;
Lu, Guo-Quan

Publication type:

Article

Growth behavior of intermetallic compounds in Fe/Sn diffusion couples.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 13, p. 12639, doi. 10.1007/s10854-019-01627-z

By:

Wang, Xiyu;
Li, Deyu;
Li, Ning;
Wang, Rui

Publication type:

Article

Novel insights in growth of intermetallic compounds between Sn–3.0Ag–0.5Cu solder and flexible PCB substrates under strain.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 10, p. 9410, doi. 10.1007/s10854-019-01271-7

By:

Zhang, Xudong;
Hu, Xiaowu;
Jiang, Xiongxin;
Li, Qinglin;
Zhou, Liuru

Publication type:

Article

Influence of La3+ and V5+ doping on the polarization and impedance behaviour of BaBi2Nb2O9 nano-ceramics prepared by chemical route.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 7, p. 7065, doi. 10.1007/s10854-019-01023-7

By:

Khatun, Julekha;
Adak, Mrinal K.;
Dhak, Prasanta;
Ghorai, Uttam K.;
Dhak, Debasis

Publication type:

Article

Surface grain boundary passivation via mixed antisolvent and PC61BM assistant for stable perovskite solar cells.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 4, p. 3511, doi. 10.1007/s10854-018-00628-8

By:

Mao, Hanying;
Huang, Yuelong;
Ma, Zhu;
Jin, Lifen;
Tian, Liuwen;
Li, Yuepeng;
Yu, Hua;
Peng, Changtao

Publication type:

Article

Investigation of charge transport mechanism in semiconducting La0.5Ca0.5Mn0.5Fe0.5O3 manganite prepared by sol-gel method.

Published in:

Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 16, p. 13577, doi. 10.1007/s10854-018-9485-2

By:

Khan, Ayaz Arif;
Fayaz, Muhammad Umer;
Khan, Muhammad Nasir;
Iqbal, Mazhar;
Majeed, Asif;
Bilkees, Rehana;
Mukhtar, Surayya;
Javed, Muhammad

Publication type:

Article

Robust tuning of Kirkendall void density in circuit interconnections through substrate strain annealing.

Published in:

Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 10, p. 8287, doi. 10.1007/s10854-018-8837-2

By:

Cai, Chongyang;
An, Rong;
Wang, Chunqing;
Tian, Yanhong;
Ji, Xiaoliang

Publication type:

Article

Effect of Au, Pd and Pt addition in Cu on the growth of intermetallic compounds and the Kirkendall voids in the Cu-Sn system.

Published in:

Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 22, p. 17014, doi. 10.1007/s10854-017-7624-9

By:

Baheti, Varun;
Kumar, Praveen;
Paul, Aloke

Publication type:

Article

Effect of annealing temperature on properties of molybdenum disulfide thin films.

Published in:

Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 21, p. 16148, doi. 10.1007/s10854-017-7515-0

By:

Kite, S.;
Chate, P.;
Garadkar, K.;
Sathe, D.

Publication type:

Article

Transgranular region preference of crack propagation along Bi-2212 crystal structure due to Au nanoparticle diffusion and modeling of new systems.

Published in:

Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 17, p. 12839, doi. 10.1007/s10854-017-7111-3

By:

Zalaoglu, Y.;
Akkurt, B.;
Oz, M.;
Yildirim, G.

Publication type:

Article

Enhanced grain size effect on electrical characteristics of fine-grained BaTiO ceramics.

Published in:

Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 17, p. 13229, doi. 10.1007/s10854-017-7158-1

By:

Shi, Yu;
Pu, Yongping;
Cui, Yongfei;
Luo, Yanjie

Publication type:

Article

Structural and electrical properties of lead reduced lanthanum modified BiFeO-PbTiO solid solution.

Published in:

Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 2, p. 1186, doi. 10.1007/s10854-016-5645-4

By:

Pradhan, S.;
Das, S.;
Bhuyan, S.;
Behera, C.;
P Choudhary, R.

Publication type:

Article

Creep behavior of micro-scale Cu/Sn-3.0Ag-0.5Cu/Cu joints under electro-thermo-mechanical coupled loads.

Published in:

Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 12, p. 13022, doi. 10.1007/s10854-016-5443-z

By:

Li, W.;
Jin, H.;
Yue, W.;
Tan, M.;
Zhang, X.

Publication type:

Article

Improved output power and low forward voltage for GaN-based light emitting diodes with an annealed ITO transparent conducting layer.

Published in:

Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 6, p. 6265, doi. 10.1007/s10854-016-4558-6

By:

Lin, Yen-Sheng;
Li, Ching;
Chang, Yu-Cheng;
Tseng, Chun-Lung;
Shen, Ching-Hsing

Publication type:

Article

Effect of sintering temperature on the dielectric and varistor properties of SnO-ZnSnO composite ceramics.

Published in:

Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 3, p. 2242, doi. 10.1007/s10854-015-4017-9

By:

Liu, Huan-Huan;
Li, Li-Ben;
Zang, Guo-Zhong;
Wang, Xiao-Fei;
Zuo, Zheng-Wei

Publication type:

Article

Oxygen diffusion in germanium: interconnecting point defect parameters with bulk properties.

Published in:

Journal of Materials Science: Materials in Electronics, 2015, v. 26, n. 10, p. 7378, doi. 10.1007/s10854-015-3367-7

By:

Chroneos, A.;
Vovk, R.

Publication type:

Article

Effect of alloying Cu substrate on microstructure and coarsening behavior of CuSn grains of soldered joints.

Published in:

Journal of Materials Science: Materials in Electronics, 2015, v. 26, n. 5, p. 2782, doi. 10.1007/s10854-015-2759-z

By:

Yu, Xiao;
Hu, Xiaowu;
Li, Yulong;
Zhang, Ruhua

Publication type:

Article

Growth behavior of interfacial Cu-Sn intermetallic compounds of Sn/Cu reaction couples during dip soldering and aging.

Published in:

Journal of Materials Science: Materials in Electronics, 2014, v. 25, n. 2, p. 936, doi. 10.1007/s10854-013-1667-3

By:

Hu, Xiaowu;
Ke, Zunrong

Publication type:

Article

Microstructure and dielectric properties of CaBiCuTiO ( x = 0, 0.05, 0.10, 0.15 and 0.20) ceramics.

Published in:

Journal of Materials Science: Materials in Electronics, 2014, v. 25, n. 2, p. 817, doi. 10.1007/s10854-013-1651-y

By:

Xu, L.;
Cheng, T.;
Wang, R.;
Xiao, H.;
Liu, G.;
Yang, C.

Publication type:

Article

Interdiffusion study in the Pd-Pt system.

Published in:

Journal of Materials Science: Materials in Electronics, 2013, v. 24, n. 8, p. 2833, doi. 10.1007/s10854-013-1179-1

By:

Baheti, Varun;
Ravi, Raju;
Paul, Aloke

Publication type:

Article

Study on important diffusion parameters of binary NiSn phase.

Published in:

Journal of Materials Science: Materials in Electronics, 2013, v. 24, n. 7, p. 2558, doi. 10.1007/s10854-013-1133-2

By:

Ghosh, C.

Publication type:

Article

Diffusion and growth mechanism of phases in the Pd-Sn system.

Published in:

Journal of Materials Science: Materials in Electronics, 2012, v. 23, n. 12, p. 2306, doi. 10.1007/s10854-012-0832-4

By:

Ravi, Raju;
Paul, Aloke

Publication type:

Article

Two-step sintering and electrical properties of sol-gel derived 0.94(BiNa)TiO-0.06BaTiO lead-free ceramics.

Published in:

Journal of Materials Science: Materials in Electronics, 2011, v. 22, n. 12, p. 1841, doi. 10.1007/s10854-011-0371-4

By:

Meng, Weiqing;
Zuo, Ruzhong;
Su, Shi;
Wang, Xiaohui;
Li, Longtu

Publication type:

Article

Microstructure of interfacial reaction layer in Sn-Ag-Cu/electroless Ni (P) solder joint.

Published in:

Journal of Materials Science: Materials in Electronics, 2011, v. 22, n. 9, p. 1308, doi. 10.1007/s10854-011-0305-1

By:

Han-Byul Kang;
Jee-Hwan Bae;
Jeong-Won Yoon;
Seung-Boo Jung;
Jongwoo Park;
Cheol-Woong Yang

Publication type:

Article

Growth mechanism of phases, Kirkendall voids, marker plane position, and indication of the relative mobilities of the species in the interdiffusion zone.

Published in:

Journal of Materials Science: Materials in Electronics, 2011, v. 22, n. 7, p. 833, doi. 10.1007/s10854-010-0220-x

By:

Paul, A.

Publication type:

Article

Formation and behavior of Kirkendall voids within intermetallic layers of solder joints.

Published in:

Journal of Materials Science: Materials in Electronics, 2011, v. 22, n. 7, p. 703, doi. 10.1007/s10854-011-0357-2

By:

Doosoo Kim;
Jong-hyeon Chang;
Jungil Park;
Pak, James Jungo

Publication type:

Article

Spectroscopic studies of O-vacancy defects in transition metal oxides.

Published in:

Journal of Materials Science: Materials in Electronics, 2007, v. 18, p. 263, doi. 10.1007/s10854-007-9192-x

By:

Lucovsky, G.;
Lüning, J.;
Fleming, L.;
Ulrich, M. D.;
Rowe, J. E.;
Seo, H.;
Lee, S.;
Lysaght, P.;
Bersuker, G.

Publication type:

Article

Grain boundary engineering of metastable 204Cu, 301, and 301LN austenitic stainless steels to improve their sensitization resistance.

Published in:

Materials & Corrosion / Werkstoffe und Korrosion, 2015, v. 66, n. 2, p. 95, doi. 10.1002/maco.201407694

By:

Forsström, A.;
Talonen, J.;
Saukkonen, T.;
Hänninen, H.

Publication type:

Article

Effect of DyF3 on the corrosion behavior of hot-pressed Nd-Fe-B permanent magnets.

Published in:

Materials & Corrosion / Werkstoffe und Korrosion, 2015, v. 66, n. 2, p. 152, doi. 10.1002/maco.201307303

By:

Sueptitz, R.;
Sawatzki, S.;
Moore, M.;
Uhlemann, M.;
Gutfleisch, O.;
Gebert, A.

Publication type:

Article

Influence of tool path strategies on friction and wear behavior of high-speed ball-end-milled hardened AISI D2 steel.

Published in:

International Journal of Advanced Manufacturing Technology, 2018, v. 96, n. 5-8, p. 2769, doi. 10.1007/s00170-018-1774-7

By:

Huang, Weimin;
Zhao, Jun;
Ai, Xing;
Wang, Guijie;
Zhong, Xin

Publication type:

Article

Any order spectral volume methods for diffusion equations using the local discontinuous Galerkin formulation.

Published in:

ESAIM: Mathematical Modelling & Numerical Analysis (ESAIM: M2AN), 2023, v. 57, n. 2, p. 367, doi. 10.1051/m2an/2023003

By:

An, Jing;
Cao, Waixiang

Publication type:

Article

Grain-Boundary Diffusion of Titanium in Zr-1 wt.%Nb Alloy Under Irradiation with a Pulsed Electron Beam.

Published in:

Russian Physics Journal, 2024, v. 66, n. 11, p. 1129, doi. 10.1007/s11182-023-03053-5

By:

Grabovetskaya, G. P.;
Stepanova, E. N.;
Teresov, A. D.;
Kruglyakov, M. A.;
Lomygin, A. D.

Publication type:

Article

Effect of Temperature Dynamics on TiAl Oxidation Due to Grain-Boundary Diffusion of Oxygen.

Published in:

Russian Physics Journal, 2023, v. 66, n. 1, p. 88, doi. 10.1007/s11182-023-02908-1

By:

Chepak-Gizbrekht, M. V.

Publication type:

Article