Works matching DE "INTERMETALLIC compounds"

Results: 4340

Corrosion Behavior of Austempered Ductile Iron in Molten Al.

Published in:

Steel Research International, 2025, v. 96, n. 7, p. 1, doi. 10.1002/srin.202400831

By:

Zheng, Qi;
Du, Yuzhou;
Li, Wei;
Zhou, Rui;
Jiang, Bailing

Publication type:

Article

КРИСТАЛІЧНА СТРУКТУРА НОВОГО ТЕРНАРНОГО СИЛІЦИДУ ErRe2Si4.

Published in:

Issues of Chemistry & Chemical Technology / Voprosy Khimii & Khimicheskoi Tekhnologii, 2025, n. 3, p. 28, doi. 10.32434/0321-4095-2025-160-3-28-35

By:

Михалічко, В. М.;
Федина, Л. О.;
Федорчук, А. О.;
Федина, Ф.

Publication type:

Article

钛/铝异种金属搅拌摩擦焊及其改型新工艺研究进展.

Published in:

Journal of Materials Engineering / Cailiao Gongcheng, 2025, v. 53, n. 6, p. 62, doi. 10.11868/j.issn.1001-4381.2023.000844

By:

石磊;
张贤昆;
李阳;
武传松;
刘小超

Publication type:

Article

IMPROVING THE WEAR RESISTANCE OF TITANIUM ALLOYS BY THERMAL SPRAYING METHODS.

Published in:

Problems of Friction & Wear, 2025, v. 107, n. 2, p. 19, doi. 10.18372/0370-2197.2(107).20141

By:

KINDRACHUK, M. V.;
KHARCHENKO, V. V.;
YURCHUK, A. O.;
STEBELETSKA, N. M.

Publication type:

Article

Friction Stir Spot Extrusion Joining With Its Metal Flow Investigation.

Published in:

Advances in Materials Science & Engineering, 2025, v. 2025, p. 1, doi. 10.1155/amse/1617392

By:

Mejbel, Mohanad Kadhim;
Abdullah, Isam Tareq;
Weiwei, Kong

Publication type:

Article

The Effect of Mg Content on the Microstructure and Open Porosity of a Porous FeAl Intermetallic Compound.

Published in:

Metals (2075-4701), 2025, v. 15, n. 6, p. 628, doi. 10.3390/met15060628

By:

Xue, Weilun;
Liu, Zhuoxuan;
Liu, Dongming;
Xu, Zhigang

Publication type:

Article

Laser-MIG Hybrid Welding–Brazing Characteristics of Ti/Al Butt Joints with Different Groove Shapes.

Published in:

Metals (2075-4701), 2025, v. 15, n. 6, p. 625, doi. 10.3390/met15060674

By:

Zhao, Xin;
Yang, Zhibin;
Huang, Yonghao;
Qu, Taixu;
Cheng, Rui;
Lv, Haiting

Publication type:

Article

Phase Evolution and Synthesis of Be 12 Nb Intermetallic Compound in the 800–1300 °C Temperature Range.

Published in:

Materials (1996-1944), 2025, v. 18, n. 12, p. 2915, doi. 10.3390/ma18122915

By:

Udartsev, Sergey;
Kenzhina, Inesh E.;
Kulsartov, Timur;
Samarkhanov, Kuanysh;
Zaurbekova, Zhanna;
Ponkratov, Yuriy;
Yelishenkov, Alexandr;
Begentayev, Meiram;
Askerbekov, Saulet;
Tolenova, Aktolkyn;
Kylyshkanov, Manarbek;
Podoinikov, Mikhail;
Kaynazarova, Ainur;
Obgolts, Oleg

Publication type:

Article

Interfacial Behavior During Reactions Between Sn and Electroplated Co–Zn Alloys.

Published in:

Materials (1996-1944), 2025, v. 18, n. 12, p. 2680, doi. 10.3390/ma18122680

By:

Wang, Chao-Hong;
Lin, Che-Yang

Publication type:

Article

Microstructure Evolution and Fracture Mode of Laser Welding–Brazing DP780 Steel-5754 Aluminum Alloy Joints with Various Laser Spot Positions.

Published in:

Materials (1996-1944), 2025, v. 18, n. 12, p. 2676, doi. 10.3390/ma18122676

By:

Li, Bolong;
Zhou, Jiayi;
Hu, Rongxun;
Pan, Hua;
Wu, Tianhai;
Gao, Yulai

Publication type:

Article

Mechanochemical Synthesis of Intermetallic Compounds in the Gallium–Iridium System.

Published in:

International Journal of Nanoscience, 2019, v. 18, n. 3/4, p. N.PAG, doi. 10.1142/S0219581X19400672

By:

Vitiaz, P.;
Lyakhov, N.;
Grigoreva, T.;
Pavlov, E.

Publication type:

Article

Discovering a Dual-Buffer Effect for Lithium Storage: Durable Nanostructured Ordered Mesoporous Co-Sn Intermetallic Electrodes.

Published in:

Advanced Functional Materials, 2016, v. 26, n. 17, p. 2800, doi. 10.1002/adfm.201600121

By:

Park, Gwi Ok;
Yoon, Jeongbae;
Shon, Jeong Kuk;
Choi, Yun Seok;
Won, Jong Gu;
Park, Su Bin;
Kim, Kyoung Ho;
Kim, Hansu;
Yoon, Won‐Sub;
Kim, Ji Man

Publication type:

Article

Ultrafast and Highly Reversible Sodium Storage in Zinc-Antimony Intermetallic Nanomaterials.

Published in:

Advanced Functional Materials, 2016, v. 26, n. 4, p. 543, doi. 10.1002/adfm.201504461

By:

Nie, Anmin;
Gan, Li‐yong;
Cheng, Yingchun;
Tao, Xinyong;
Yuan, Yifei;
Sharifi‐Asl, Soroosh;
He, Kun;
Asayesh‐Ardakani, Hasti;
Vasiraju, Venkata;
Lu, Jun;
Mashayek, Farzad;
Klie, Robert;
Vaddiraju, Sreeram;
Schwingenschlögl, Udo;
Shahbazian‐Yassar, Reza

Publication type:

Article

Mesostructured Intermetallic Compounds of Platinum and Non-Transition Metals for Enhanced Electrocatalysis of Oxygen Reduction Reaction.

Published in:

Advanced Functional Materials, 2015, v. 25, n. 2, p. 230, doi. 10.1002/adfm.201401868

By:

Lang, Xing‐You;
Han, Gao‐Feng;
Xiao, Bei‐Bei;
Gu, Lin;
Yang, Zhen‐Zhong;
Wen, Zi;
Zhu, Yong‐Fu;
Zhao, Ming;
Li, Jian‐Chen;
Jiang, Qing

Publication type:

Article

Solid state reactions in the platinum–mercury system.

Published in:

Journal of Thermal Analysis & Calorimetry, 2007, v. 88, n. 1, p. 127, doi. 10.1007/s10973-006-8037-9

By:

Souza, G. R.;
Pastre, I. A.;
Benedetti, A. V.;
Ribeiro, C. A.;
Fertonani, F. L.

Publication type:

Article

Characteristics of CuAl2-Cu9Al4/Al2O3 nanocomposites synthesized by mechanical treatment.

Published in:

Journal of Thermal Analysis & Calorimetry, 2005, v. 80, n. 3, p. 619, doi. 10.1007/s10973-005-0703-9

By:

Wieczorek-Ciurowa, K.;
Gamrat, K.;
Saw&lslash;owicz, Z.

Publication type:

Article

Effect of YO particles on microstructure formation and shear properties of Sn-58Bi solder.

Published in:

Journal of Materials Science: Materials in Electronics, 2010, v. 21, n. 10, p. 1046, doi. 10.1007/s10854-009-0025-y

By:

Xiaoying Liu;
Mingliang Huang;
Wu, C. M. L.;
Lai Wang

Publication type:

Article

Effect of praseodymium on the microstructure and properties of Sn3.8Ag0.7Cu solder.

Published in:

Journal of Materials Science: Materials in Electronics, 2010, v. 21, n. 9, p. 910, doi. 10.1007/s10854-009-0017-y

By:

Lili Gao;
Songbai Xue;
Liang Zhang;
Zhengxiang Xiao;
Wei Dai;
Feng Ji;
Huan Ye;
Guang Zeng

Publication type:

Article

Effects of Ag on microstructures, wettabilities of Sn–9Zn–xAg solders as well as mechanical properties of soldered joints.

Published in:

Journal of Materials Science: Materials in Electronics, 2010, v. 21, n. 5, p. 461, doi. 10.1007/s10854-009-9939-7

By:

Wen Xue Chen;
Song Bai Xue;
Hui Wang;
Jian Xin Wang;
Zong Jie Han;
Li Li Gao

Publication type:

Article

A review on the interfacial intermetallic compounds between Sn–Ag–Cu based solders and substrates.

Published in:

Journal of Materials Science: Materials in Electronics, 2010, v. 21, n. 5, p. 421, doi. 10.1007/s10854-010-0086-y

By:

Guang Zeng;
Songbai Xue;
Liang Zhang;
Lili Gao;
Wei Dai;
Jiadong Luo

Publication type:

Article

Development of Sn–Zn lead-free solders bearing alloying elements.

Published in:

Journal of Materials Science: Materials in Electronics, 2010, v. 21, n. 1, p. 1, doi. 10.1007/s10854-009-0014-1

By:

Liang Zhang;
Song-bai Xue;
Li-li Gao;
Zhong Sheng;
Huan Ye;
Zheng-xiang Xiao;
Guang Zeng;
Yan Chen;
Sheng-lin Yu

Publication type:

Article

Effect of rare earth element additions on the impression creep of Sn–9Zn solder alloy.

Published in:

Journal of Materials Science: Materials in Electronics, 2010, v. 21, n. 1, p. 58, doi. 10.1007/s10854-009-9870-y

By:

Mahmudi, R.;
Geranmayeh, A. R.;
Zahiri, B.;
Marvasti, M. H.

Publication type:

Article

Influence of minor Bi additions on the interfacial morphology between Sn–Zn– xBi solders and a Cu layer.

Published in:

Journal of Materials Science: Materials in Electronics, 2009, v. 20, n. 11, p. 1112, doi. 10.1007/s10854-008-9835-6

By:

Jie Chen;
Jun Shen;
Dong Min;
Changfei Peng

Publication type:

Article

Effects of small amounts of Ni/P/Ce element additions on the microstructure and properties of Sn3.0Ag0.5Cu solder alloy.

Published in:

Journal of Materials Science: Materials in Electronics, 2009, v. 20, n. 10, p. 1008, doi. 10.1007/s10854-008-9826-7

By:

Wenxing Dong;
Yaowu Shi;
Yongping Lei;
Zhidong Xia;
Fu Guo

Publication type:

Article

Formation of interfacial structure of Sn–3.7Ag–0.9Zn eutectic solder with different Al additions.

Published in:

Journal of Materials Science: Materials in Electronics, 2009, v. 20, n. 9, p. 861, doi. 10.1007/s10854-008-9807-x

By:

Wei, C.;
Liu, Y. C.;
Wan, J. B.

Publication type:

Article

The formation and evolution of intermetallic compounds formed between Sn–Ag–Zn–In lead-free solder and Ni/Cu substrate.

Published in:

Journal of Materials Science: Materials in Electronics, 2009, v. 20, n. 7, p. 675, doi. 10.1007/s10854-008-9785-z

By:

Xu, R. L.;
Liu, Y. C.;
Han, Y. J.;
Wei, C.;
Wang, X.;
Yu, L. M.

Publication type:

Article

Effect of rare earth addition on shear strength of SnAgCu lead-free solder joints.

Published in:

Journal of Materials Science: Materials in Electronics, 2009, v. 20, n. 2, p. 186, doi. 10.1007/s10854-008-9696-z

By:

Guangdong Li;
Yaowu Shi;
Hu Hao;
Zhidong Xia;
Yongping Lei;
Fu Guo;
Xiaoyan Li

Publication type:

Article

Effect of Al content on the formation of intermetallic compounds in Sn–Ag–Zn lead-free solder.

Published in:

Journal of Materials Science: Materials in Electronics, 2008, v. 19, n. 3, p. 247, doi. 10.1007/s10854-007-9279-4

By:

Wan, J. B.;
Liu, Y. C.;
Wei, C.;
Gao, Z. M.;
Ma, C. S.

Publication type:

Article

The effects of third alloying elements on the bulk Ag3Sn formation in slowly cooled Sn–3.5Ag lead-free solder.

Published in:

Journal of Materials Science: Materials in Electronics, 2008, v. 19, n. 3, p. 275, doi. 10.1007/s10854-007-9292-7

By:

Jun Shen;
Shiqiang Lai;
Yongchang Liu;
Houxiu Gao;
Jun Wei

Publication type:

Article

Direct robust bonding between Sn-based solder and Si substrate.

Published in:

Journal of Materials Science: Materials in Electronics, 2007, v. 18, n. 10, p. 1057, doi. 10.1007/s10854-006-9114-3

By:

Yu, D. Q.;
Wu, C. M.;
Wong, Y. W.;
Lai, J. K. L.

Publication type:

Article

In situ nanoparticulate-reinforced lead-free Sn–Ag composite prepared by rapid solidification.

Published in:

Journal of Materials Science: Materials in Electronics, 2007, v. 18, n. 4, p. 463, doi. 10.1007/s10854-006-9056-9

By:

J. Shen;
Y. Liu;
H. Gao

Publication type:

Article

Corrosion property of TiNi shape memory alloys coated with tantalum.

Published in:

Journal of Materials Science Letters, 2003, v. 22, n. 23, p. 1681, doi. 10.1023/B:JMSL.0000004648.40757.56

By:

Cheng, Y.;
Cai, W.;
Li, H. T.;
Zhao, L. C.

Publication type:

Article

Synthesis and fabrication of WC particulate reinforced Ni3Al intermetallic matrix composite coating by laser powder deposition.

Published in:

Journal of Materials Science Letters, 2003, v. 22, n. 19, p. 1369, doi. 10.1023/A:1025799630810

By:

Xu, X. Y.;
Liu, W. J.;
Zhong, M. L.;
Sun, H. Q.

Publication type:

Article

Effect of lamellar structure on microhardness and yield stress of directionally solidified intermetallic Ti-46Al-2W-0.5Si alloy.

Published in:

Journal of Materials Science Letters, 2003, v. 22, n. 10, p. 747, doi. 10.1023/A:1023708110793

By:

Lapin, J.

Publication type:

Article

Role of P and Fe on the precipitation of copper intermetallics in 319 alloys.

Published in:

Journal of Materials Science Letters, 2003, v. 22, n. 8, p. 585, doi. 10.1023/A:1023342227912

By:

Li, Z.;
Samuel, A. M.;
Samuel, F. H.

Publication type:

Article

Electrochemical lithium intercalation in CoSb3 compound.

Published in:

Journal of Materials Science Letters, 2003, v. 22, n. 3, p. 221, doi. 10.1023/A:1022214429241

By:

Jian Xie;
Xinbing Zhao;
Gaoshao Cao;
Yaodong Zhong;
Mingjian Zhao

Publication type:

Article

X-ray Maps in WDS and EDS: Comparing Low Voltage and Low Overvoltage Techniques on Intermetallic Phases.

Published in:

2023

By:

Williard, John;
Boro, Joseph

Publication type:

Abstract

TEM Studies of a New Modulated Structure in Mn2RuSn Alloy and Intermetallic Phases in Fe3+xCo3-xTi2 (x = 0, 1, 2, 3) Alloys.

Published in:

2023

By:

Li, Xing-Zhong;
Valloppilly, Shah R

Publication type:

Abstract

Observation Of Al-Cu Interface Instability During Room Temperature Storage.

Published in:

2023

By:

Sørhaug, Jørgen;
Vullum, Per Erik;
Holmestad, Randi

Publication type:

Abstract

Effect of Transition Element Addition on the Microstructure and Microhardness of (Al-Si-Cu) Aged Alloys.

Published in:

Microscopy & Microanalysis, 2019, p. 2278, doi. 10.1017/S143192761801187X

By:

Medrano-Prieto, H. M.;
Garay-Reyes, C.G.;
Ruiz-Esparza-Rodriguez, M.A.;
Estrada-Guel, I.;
Maldonado-Orozco, M. C.;
Martinez-Sanchez, R.

Publication type:

Article

FIB and SEM-STEM Studies of Friction-stir Processed AM60 Magnesium Alloy.

Published in:

Microscopy & Microanalysis, 2012, v. 18, n. S5, p. 97, doi. 10.1017/S1431927612013141

By:

Rodríguez, J. B.;
Miniño, P.;
Pena, G.;
Gesto, D.;
Rey, P.;
Verdera, D.

Publication type:

Article

Morphology and Structure of Compacted Coated Powders Studied by SEM and TEM.

Published in:: Microscopy & Microanalysis, 2008, v. 14, n. 0, p. 31, doi. 10.1017/S1431927608089290
Publication type:: Article

Morphology and Structure of Compacted Coated Powders Studied by SEM and TEM.

Published in:

Microscopy & Microanalysis, 2008, v. 14, n. S3, p. 31, doi. 10.1017/S1431927608089290

By:

Simões, F.;
Trindade, B.

Publication type:

Article

Characterizing the intermetallic formed during ball attach process.

Published in:

Microscopy & Microanalysis, 2008, v. 14, n. S3, p. 17, doi. 10.1017/S1431927608089253

By:

Pereira, Paulo;
Santos, Rúben;
Barbosa, Maria M.;
Almeida, Cátia

Publication type:

Article

Characterization of the Interface of a Non-Ferrous Dissimilar Realized by Rotary Friction Welding.

Published in:

Russian Journal of Nondestructive Testing, 2021, v. 57, n. 2, p. 163, doi. 10.1134/S1061830921020078

By:

Mebtouche, A.;
Bezzazi, B.;
Ramou, N.;
Aboudi, D.;
Faci, Y.;
Latef, M.

Publication type:

Article

Processing and Characterization of Nickel Matrix Nanocomposites Reinforced with Layered Nickel Aluminide Intermetallics Using Mechanical Alloying and Spark Plasma Sintering.

Published in:

Nanomanufacturing, 2025, v. 5, n. 1, p. 1, doi. 10.3390/nanomanufacturing5010001

By:

Adabavazeh, Zary;
Shiranibidabadi, Amir Hossein;
Enayati, Mohammad Hossein;
Karimzadeh, Fathallah

Publication type:

Article

SURFACE PROTECTIVE LAYERS OF IRON ALUMINIDES DEVELOPED ON MEDIUM CARBON STEEL BY THE HOT-DIP ALUMINIZING (HDA) PROCESS.

Published in:

Multidiszciplináris Tudományok, 2021, v. 11, n. 5, p. 68, doi. 10.35925/j.multi.2021.5.7

By:

Muhammed, Hawkar J.;
Koncz-Horváth, Dániel;
Illés, István Balázs;
Török, Tamás I.

Publication type:

Article

ФАЗОВІ ТА СТРУКТУРНІ ПЕРЕТВОРЕННЯ ПРИ НАГРІВАННІ БАГАТОШАРОВИХ ФОЛЬГ Ti/Cu ЕВТЕКТИЧНОГО СКЛАДУ, ОТРИМАНИХ МЕТОДОМ EBPVD.

Published in:

Electrometallurgy Today / Sovremennaya Elektrometallurgiya, 2024, n. 3, p. 13, doi. 10.37434/sem2024.03.02

By:

Демченков, С. О.;
Мельниченко, Т. В.;
Устінов, А. І.;
Руденко, О. Е.;
Самофалов, О. В.

Publication type:

Article

Environmentally Friendly Thermoelectric Materials: High Performance from Inorganic Components with Low Toxicity and Abundance in the Earth.

Published in:

Advanced Sustainable Systems, 2021, v. 5, n. 11, p. 1, doi. 10.1002/adsu.202100095

By:

Caballero‐Calero, Olga;
Ares, José R.;
Martín‐González, Marisol

Publication type:

Article

Сучасні методи нейтралізації неґативного впливу домішок Феруму на властивості заевтектичних Al–Si-стопів.

Published in:

Metallophysics & Advanced Technologies / Metallofizika i Novejsie Tehnologii, 2025, v. 47, n. 4, p. 377, doi. 10.15407/mfint.47.04.0377

By:

Цір, Т. Г.;
Шеневидько, К. Л.

Publication type:

Article