Works matching DE "CONTACT resistance (Materials science)"
1
- Advanced Functional Materials, 2013, v. 23, n. 23, p. 2941, doi. 10.1002/adfm.201203250
- Gruber, Manfred;
- Zojer, Egbert;
- Schürrer, Ferdinand;
- Zojer, Karin
- Article
2
- Open Physics, 2018, v. 16, n. 1, p. 1, doi. 10.1515/phys-2018-0001
- Iatcheva, Ilona;
- Darzhanova, Denitsa;
- Manilova, Marina
- Article
3
- Heat Transfer Engineering, 2013, v. 34, n. 4, p. 349, doi. 10.1080/01457632.2013.716352
- Zubair, SyedM.;
- Mustafa, M.Tahir;
- Arif, AbulFazal M.
- Article
4
- International Journal of Automation Technology, 2019, v. 13, n. 1, p. 125, doi. 10.20965/ijat.2019.p0125
- Amine Gouarir;
- Syuhei Kurokawa;
- Takao Sajima;
- Mitsuaki Murata
- Article
5
- Science & Technology of Welding & Joining, 2017, v. 22, n. 1, p. 22, doi. 10.1080/13621718.2016.1180844
- Zhang, W. J.;
- Cross, I.;
- Feldman, P.;
- Rama, S.;
- Norman, S.;
- Del Duca, M.
- Article
6
- Journal of Materials Science, 2017, v. 52, n. 18, p. 10879, doi. 10.1007/s10853-017-1254-8
- Kennon, E.;
- Orzali, T.;
- Xin, Y.;
- Vert, A.;
- Lind, A.;
- Jones, K.
- Article
7
- International Journal of Advanced Manufacturing Technology, 2015, v. 76, n. 9-12, p. 1913, doi. 10.1007/s00170-014-6350-1
- Liu, Zhifeng;
- Pan, Minghui;
- Zhang, Aiping;
- Zhao, Yongsheng;
- Yang, Yong;
- Ma, Chengyu
- Article
8
- International Journal of Advanced Manufacturing Technology, 2014, v. 75, n. 9-12, p. 1517, doi. 10.1007/s00170-014-6244-2
- Su, Hao;
- Lu, Lihua;
- Liang, Yingchun;
- Zhang, Qiang;
- Sun, Yazhou;
- Liu, Haitao
- Article
9
- Eurasian Physical Technical Journal, 2025, v. 22, n. 1, p. 76, doi. 10.31489/2025N1/76-82
- А. I., Soldatov;
- A. A., Soldatov;
- M. A., Kostina;
- A. A., Abouellail;
- S. I., Bortalevich
- Article
10
- Eurasian Physical Technical Journal, 2024, v. 21, n. 2, p. 38, doi. 10.31489/2024No2/38-48
- Soldatov A. I.;
- Soldatov A. A.;
- Abouellail A. A.;
- Kostina M. A.
- Article
11
- IET Renewable Power Generation (Wiley-Blackwell), 2016, v. 10, n. 10, p. 1515, doi. 10.1049/iet-rpg.2016.0026
- Bo Zhao;
- Chuan Li;
- Yi Jin;
- Cenyu Yang;
- Guanghui Leng;
- Hui Cao;
- Yongliang Li;
- Yulong Ding
- Article
12
- NPJ 2D Materials & Applications, 2020, v. 4, n. 1, p. 1, doi. 10.1038/s41699-020-0144-0
- Subramanian, Shruti;
- Xu, Ke;
- Wang, Yuanxi;
- Moser, Simon;
- Simonson, Nicholas A.;
- Deng, Donna;
- Crespi, Vincent H.;
- Fullerton-Shirey, Susan K.;
- Robinson, Joshua A.
- Article
13
- ChemElectroChem, 2017, v. 4, n. 12, p. 3061, doi. 10.1002/celc.201700819
- Zhou, Junli;
- Yu, Lin;
- Deng, Yulin;
- Yang, Yin;
- Hao, Zhifeng;
- Sun, Ming
- Article
14
- Crystals (2073-4352), 2017, v. 7, n. 6, p. 177, doi. 10.3390/cryst7060177
- Ravaux, Florent;
- Saadat, Irfan;
- Jouiad, Mustapha
- Article
15
- Crystals (2073-4352), 2013, v. 3, n. 1, p. 257, doi. 10.3390/cryst3010257
- Wenjun Liu;
- Jun Wei;
- Xiaowei Sun;
- Hongyu Yu
- Article
16
- Annals of the University Dunarea de Jos of Galati: Fascicle XIV, Mechanical Engineering / Analele Universităţii 'Dunărea de Jos' din Galaţi. Fascicula XIV, Inginerie Mecanică, 2015, n. 2, p. 21
- Daniela, Ghelase;
- Luiza, Daschievici
- Article
17
- Annals of the University Dunarea de Jos of Galati: Fascicle XIV, Mechanical Engineering / Analele Universităţii 'Dunărea de Jos' din Galaţi. Fascicula XIV, Inginerie Mecanică, 2015, n. 2, p. 17
- Daniela, Ghelase;
- Luiza, Daschievici
- Article
18
- Journal of Thermal Stresses, 2016, v. 39, n. 9, p. 1017, doi. 10.1080/01495739.2016.1192451
- Xue, Zhang-Na;
- Yu, Ya-Jun;
- Li, Chen-Lin;
- Tian, Xiao-Geng
- Article
19
- Journal of Thermal Stresses, 2016, v. 39, n. 4, p. 414, doi. 10.1080/01495739.2016.1152132
- Torabi, Mohsen;
- Zhang, Kaili
- Article
20
- Thermal Science, 2015, v. 19, n. 4, p. 1369, doi. 10.2298/TSCI1504369Z
- Zhe ZHAO;
- Hai-Ming HUANG;
- Qing WANG;
- Song JI
- Article
22
- EE: Evaluation Engineering, 2016, v. 55, n. 5, p. 22
- Article
23
- Journal of Electronic Materials, 2019, v. 48, n. 5, p. 3115, doi. 10.1007/s11664-019-07072-2
- Article
24
- Journal of Electronic Materials, 2019, v. 48, n. 4, p. 1870, doi. 10.1007/s11664-018-6785-5
- Article
25
- Journal of Electronic Materials, 2019, v. 48, n. 1, p. 596, doi. 10.1007/s11664-018-6759-7
- Pang, Dandan;
- Zhang, Aibing;
- Wang, BaoLin;
- Li, Guangyong
- Article
26
- Journal of Electronic Materials, 2018, v. 47, n. 11, p. 6791, doi. 10.1007/s11664-018-6605-y
- Ahmad, Samir Mahmmod;
- Leong, Cheow Siu;
- Winder, Richard W.;
- Sopian, K.;
- Zaidi, Saleem H.
- Article
27
- Journal of Electronic Materials, 2018, v. 47, n. 10, p. 5905, doi. 10.1007/s11664-018-6480-6
- Article
28
- Journal of Electronic Materials, 2018, v. 47, n. 10, p. 5825, doi. 10.1007/s11664-018-6456-6
- Boukortt, Nour El Islam;
- Hadri, Baghdad
- Article
29
- Journal of Electronic Materials, 2018, v. 47, n. 1, p. 305, doi. 10.1007/s11664-017-5775-3
- Sarkar, Biplab;
- Reddy, Pramod;
- Klump, Andrew;
- Kaess, Felix;
- Rounds, Robert;
- Kirste, Ronny;
- Mita, Seiji;
- Kohn, Erhard;
- Collazo, Ramon;
- Sitar, Zlatko
- Article
30
- Journal of Electronic Materials, 2017, v. 46, n. 6, p. 3390, doi. 10.1007/s11664-016-5276-9
- Article
31
- Journal of Electronic Materials, 2016, v. 45, n. 12, p. 6323, doi. 10.1007/s11664-016-5002-7
- Ohmi, Shun-ichiro;
- Chen, Mengyi;
- Masahiro, Yasushi
- Article
32
- Journal of Electronic Materials, 2016, v. 45, n. 11, p. 5764, doi. 10.1007/s11664-016-4818-5
- Pfeffer, Michael;
- Kumar, Praveen;
- Eibl, Oliver
- Article
33
- Journal of Electronic Materials, 2016, v. 45, n. 7, p. 3734, doi. 10.1007/s11664-016-4498-1
- Pettersen, Sigurd;
- Kristiansen, Helge;
- Nagao, Shijo;
- Helland, Susanne;
- Njagi, John;
- Suganuma, Katsuaki;
- Zhang, Zhiliang;
- He, Jianying
- Article
34
- Journal of Electronic Materials, 2016, v. 45, n. 4, p. 2142, doi. 10.1007/s11664-016-4358-z
- Wallace, T.;
- Jin, Z.-H.;
- Su, J.
- Article
35
- Journal of Electronic Materials, 2016, v. 45, n. 3, p. 1296, doi. 10.1007/s11664-015-4003-2
- Vizel, Roi;
- Bargig, Tal;
- Beeri, Ofer;
- Gelbstein, Yaniv
- Article
36
- Journal of Electronic Materials, 2016, v. 45, n. 3, p. 1301, doi. 10.1007/s11664-015-4014-z
- Article
37
- Journal of Electronic Materials, 2016, v. 45, n. 3, p. 1321, doi. 10.1007/s11664-015-4022-z
- Sakamoto, Tatsuya;
- Taguchi, Yutaka;
- Kutsuwa, Takeshi;
- Ichimi, Kiyohide;
- Kasatani, Shinichi;
- Inada, Minoru
- Article
38
- Journal of Electronic Materials, 2016, v. 45, n. 3, p. 1711, doi. 10.1007/s11664-015-4182-x
- Brito, F.;
- Figueiredo, L.;
- Rocha, L.;
- Cruz, A.;
- Goncalves, L.;
- Martins, J.;
- Hall, M.
- Article
39
- Journal of Electronic Materials, 2015, v. 44, n. 8, p. 2869, doi. 10.1007/s11664-015-3731-7
- Article
40
- Journal of Electronic Materials, 2015, v. 44, n. 6, p. 1851, doi. 10.1007/s11664-014-3574-7
- Wu, Wenchang;
- Du, Zhengliang;
- Cui, Jiaolin;
- Shi, Zhongtao;
- Deng, Yuan
- Article
41
- Journal of Electronic Materials, 2015, v. 44, n. 6, p. 2192, doi. 10.1007/s11664-015-3761-1
- Romanjek, K.;
- Vesin, S.;
- Aixala, L.;
- Baffie, T.;
- Bernard-Granger, G.;
- Dufourcq, J.
- Article
42
- Journal of Electronic Materials, 2015, v. 44, n. 4, p. 1200, doi. 10.1007/s11664-014-3612-5
- Ha, Yong-Seok;
- Park, Hong-Gyu;
- Seo, Dae-Shik
- Article
43
- Journal of Electronic Materials, 2014, v. 43, n. 12, p. 4464, doi. 10.1007/s11664-014-3431-8
- Article
44
- Journal of Electronic Materials, 2014, v. 43, n. 10, p. 3792, doi. 10.1007/s11664-014-3165-7
- Sakamoto, Tatsuya;
- Iida, Tsutomu;
- Sekiguchi, Takeshi;
- Taguchi, Yutaka;
- Hirayama, Naomi;
- Nishio, Keishi;
- Takanashi, Yoshifumi
- Article
45
- Journal of Electronic Materials, 2014, v. 43, n. 6, p. 2337, doi. 10.1007/s11664-014-3059-8
- Huang, Gia-Yeh;
- Hsu, Cheng-Ting;
- Yao, Da-Jeng
- Article
46
- Journal of Electronic Materials, 2014, v. 43, n. 6, p. 2247, doi. 10.1007/s11664-014-3020-x
- Högblom, Olle;
- Andersson, Ronnie
- Article
47
- Journal of Electronic Materials, 2014, v. 43, n. 6, p. 2109, doi. 10.1007/s11664-014-2982-z
- Haras, Maciej;
- Lacatena, Valeria;
- Monfray, Stéphane;
- Robillard, Jean-François;
- Skotnicki, Thomas;
- Dubois, Emmanuel
- Article
48
- Journal of Electronic Materials, 2014, v. 43, n. 6, p. 2023, doi. 10.1007/s11664-013-2940-1
- Thimont, Yohann;
- Lognoné, Quentin;
- Goupil, Christophe;
- Gascoin, Franck;
- Guilmeau, Emmanuel
- Article
49
- Journal of Electronic Materials, 2014, v. 43, n. 6, p. 2397, doi. 10.1007/s11664-014-3078-5
- Kähler, Julian;
- Stranz, Andrej;
- Waag, Andreas;
- Peiner, Erwin
- Article
50
- Journal of Electronic Materials, 2014, v. 43, n. 5, p. 1389, doi. 10.1007/s11664-014-3093-6
- Kessler, V.;
- Dehnen, M.;
- Chavez, R.;
- Engenhorst, M.;
- Stoetzel, J.;
- Petermann, N.;
- Hesse, K.;
- Huelser, T.;
- Spree, M.;
- Stiewe, C.;
- Ziolkowski, P.;
- Schierning, G.;
- Schmechel, R.
- Article