Works matching Soldering

Results: 5000

Implications of Adjustable Fountain Wave in Pin Through Hole Soldering Process.

Published in:

Arabian Journal for Science & Engineering (Springer Science & Business Media B.V. ), 2014, v. 39, n. 12, p. 9101, doi. 10.1007/s13369-014-1457-0

By:

Abdul Aziz, M.;
Abdullah, M.;
Khor, C.;
Jalar, A.;
Bakar, M.;
Yusoff, W.;
Che Ani, F.;
Yan, N.;
Zhou, M.;
Cheok, C.

Publication type:

Article

Characterization of Zn-Mg-Sr Type Soldering Alloy and Study of Ultrasonic Soldering of SiC Ceramics and Cu-SiC Composite.

Published in:

Materials (1996-1944), 2023, v. 16, n. 10, p. 3795, doi. 10.3390/ma16103795

By:

Kolenak, Roman;
Pluhar, Alexej;
Drapala, Jaromir;
Babincova, Paulina;
Pasak, Matej

Publication type:

Article

Characterization of an Active Soldering Zn-Mg Alloy and the Study of Ultrasonic Soldering of SiC Ceramics with Copper Substrate.

Published in:

Applied Sciences (2076-3417), 2024, v. 14, n. 4, p. 1504, doi. 10.3390/app14041504

By:

Kolenak, Roman;
Pluhar, Alexej;
Drapala, Jaromir;
Gogola, Peter;
Pasak, Matej;
Sloboda, Mikulas

Publication type:

Article

Fluxless ultrasonic soldering of SiC ceramics and Cu by Bi–Ag–Ti based solder.

Published in:

AIMS Materials Science, 2020, v. 7, n. 1, p. 24, doi. 10.3934/matersci.2020.1.24

By:

Šuryová, Daniela;
Kostolný, Igor;
Koleňák, Roman

Publication type:

Article

Fluxless soldering.

Published in:

International Materials Reviews, 2006, v. 51, n. 5, p. 313, doi. 10.1179/174328006X102547

By:

Jacobson, D. M.;
Humpston, G.

Publication type:

Article

Impact of Cu Pillar Bump Diameter and Solder Material on Reflow Soldering: A Computational Study with Thermal Fluid–Structure Interaction.

Published in:

Journal of Electronic Materials, 2024, v. 53, n. 3, p. 1201, doi. 10.1007/s11664-023-10855-3

By:

Lee, Jing Rou;
Abdul Aziz, Mohd Sharizal;
Khor, Chu Yee;
Ishak, Mohammad Hafifi Hafiz;
Kamarudin, Roslan;
Ani, F. Che

Publication type:

Article

Transient Soldering Reaction Mechanisms of SnCu Solder on CuNi Nano Conducting Layer and Fracture Behavior of the Joint Interfaces.

Published in:

Journal of Electronic Materials, 2020, v. 49, n. 5, p. 3383, doi. 10.1007/s11664-020-08030-z

By:

Zhang, Qingke;
Hu, Fangqin;
Song, Zhenlun

Publication type:

Article

Characterization of Soldering Alloy Type Bi-Ag-Ti and the Study of Ultrasonic Soldering of Silicon and Copper.

Published in:

Metals (2075-4701), 2021, v. 11, n. 4, p. 624, doi. 10.3390/met11040624

By:

Kolenak, Roman;
Kostolny, Igor;
Drapala, Jaromir;
Babincova, Paulina;
Gogola, Peter

Publication type:

Article

Characterizing the Soldering Alloy Type Zn–Al–Cu and Study of Ultrasonic Soldering of Al7075/Cu Combination.

Published in:

Metals (2075-4701), 2021, v. 11, n. 1, p. 27, doi. 10.3390/met11010027

By:

Kolenak, Roman;
Kostolny, Igor;
Drapala, Jaromir;
Babincova, Paulina;
Sahul, Martin

Publication type:

Article

Characterizing the Soldering Alloy Type In–Ag–Ti and the Study of Direct Soldering of SiC Ceramics and Copper.

Published in:

Metals (2075-4701), 2018, v. 8, n. 4, p. 274, doi. 10.3390/met8040274

By:

Koleňák, Roman;
Kostolný, Igor;
Sahul, Martin;
Urminský, Ján;
Drápala, Jaromír

Publication type:

Article

Thermophysical Characteristics of the Protective Coating of the Soldering Rod.

Published in:

Journal of Engineering Physics & Thermophysics, 2015, v. 88, n. 1, p. 146, doi. 10.1007/s10891-015-1176-8

By:

Shtennikov, V.

Publication type:

Article

Temperature Drop Over the Soldering Rod Length.

Published in:

Journal of Engineering Physics & Thermophysics, 2014, v. 87, n. 3, p. 729, doi. 10.1007/s10891-014-1066-5

By:

Shtennikov, V.;
Seleznev, V.

Publication type:

Article

The Need for a New Approach to Soldering in High Pressure Die Casting.

Published in:

International Journal of Metalcasting, 2021, v. 15, n. 2, p. 391, doi. 10.1007/s40962-020-00504-4

By:

Monroe, Alex;
Sanders, Paul

Publication type:

Article

MMaJIC, an Experimental Chamber for Investigating Soldering and Brazing in Microgravity.

Published in:

Gravitational & Space Research, 2017, v. 5, n. 2, p. 28, doi. 10.2478/gsr-2017-0008

By:

Daly, Shannen;
Hardyman, Micah;
Ragan, James;
Toombs, Joseph;
Prater, Tracie;
Grugel, Richard N.

Publication type:

Article

Reducing the Cost of the Production Process. Selective Soldering -- Continuous Improvement.

Published in:

Journal of Computer Science & Control Systems, 2015, v. 8, n. 1, p. 11

By:

DRĂGHICIU, Nicolae;
KUN, Simona

Publication type:

Article

Ozone Generator Aluminum Electrode Soldering.

Published in:

Chemical & Petroleum Engineering, 2018, v. 53, n. 11/12, p. 711, doi. 10.1007/s10556-018-0409-z

By:

Storchai, I. E.;
Smorodin, A. I.;
Gorbatskii, Yu. V.

Publication type:

Article

The effects of soldering flux type on corrosion properties of electrical wires.

Published in:

International Journal of Materials & Engineering Technology (TIJMET), 2023, v. 6, n. 2, p. 46

By:

Başyiğit, Aziz Barış;
Ilıcan, Murat Serdar

Publication type:

Article

Sn-Zn系无铅焊料在波峰焊中的应用.

Published in:

Electronic Components & Materials, 2018, v. 37, n. 7, p. 8, doi. 10.14106/j.cnki.1001-2028.2018.07.002

By:

陈一鸣;
王正宏;
马莒生;
张弓

Publication type:

Article

DAMAGE MECHANISM ANALYSIS OF DEVICE FOR THE WAVE SOLDERING.

Published in:

Annals of DAAAM & Proceedings, 2011, p. 1019

By:

Provaznik, Martin;
Kolenak, Roman;
Martinkovic, Maros

Publication type:

Article

The Interfacial Reaction Between Sn-Ag-Cu (SAC)/Cu During Laser Soldering.

Published in:

Lasers in Engineering (Old City Publishing), 2021, v. 51, n. 6, p. 333

By:

ADAWIYAH, M. A. RABIATUL;
SYAFIQ, H.;
AMMAR, M. D.;
AZLINA, O. SALIZA

Publication type:

Article

Liquid Metal based Stretchable Room Temperature Soldering Sticker Patch for Stretchable Electronics Integration (Adv. Funct. Mater. 36/2023).

Published in:

Advanced Functional Materials, 2023, v. 33, n. 36, p. 1, doi. 10.1002/adfm.202370214

By:

Kim, Minwoo;
Park, Jung Jae;
Cho, Chulmin;
Ko, Seung Hwan

Publication type:

Article

Liquid Metal based Stretchable Room Temperature Soldering Sticker Patch for Stretchable Electronics Integration.

Published in:

Advanced Functional Materials, 2023, v. 33, n. 36, p. 1, doi. 10.1002/adfm.202303286

By:

Kim, Minwoo;
Park, Jung Jae;
Cho, Chulmin;
Ko, Seung Hwan

Publication type:

Article

基于 EKF 的热压焊温度控制方法建模与仿真.

Published in:

Journal of South China University of Technology (Natural Science Edition), 2023, v. 51, n. 9, p. 11, doi. 10.12141/jissn.1000-565X.220826

By:

曾敏;
谢剑醒;
李智涛;
杨辉

Publication type:

Article

Validation of Heat-Level Vapor Phase Soldering Process and Workspace Leakage Detection with Applied Pressure Sensors.

Published in:

Applied Sciences (2076-3417), 2021, v. 11, n. 4, p. 1755, doi. 10.3390/app11041755

By:

Alaya, Mohamed Amine;
Illés, Balázs;
Bušek, David;
Géczy, Attila;
Scargiali, Francesca

Publication type:

Article

Quality Control of Soldering of Side Walls of Clamps in Current-Carrying Connections of Electric Machines Taking into Account the Influence of Their Sizes.

Published in:

Russian Journal of Nondestructive Testing, 2022, v. 58, n. 12, p. 1142, doi. 10.1134/S1061830922700140

By:

Kogan, L. Kh.;
Stashkov, A. N.;
Nichipuruk, A. P.

Publication type:

Article

Eddy Current Quality Control of Soldering in Superconducting Current-Carrying Joints with Allowance for the Effect of Cross Section Variations on Testing Results.

Published in:

Russian Journal of Nondestructive Testing, 2019, v. 55, n. 9, p. 654, doi. 10.1134/S106183091909002X

By:

Kogan, L. Kh.;
Stashkov, A. N.;
Nichipuruk, A. P.

Publication type:

Article

Improving the Reliability of Eddy-Current Quality Control of Soldering in Current-Carrying Copper Joints and Expanding the Nomenclature of Inspected Joints in Energy Equipment.

Published in:

Russian Journal of Nondestructive Testing, 2018, v. 54, n. 11, p. 784, doi. 10.1134/S1061830918110049

By:

Kogan, L. Kh.;
Stashkov, A. N.;
Nichipuruk, A. P.

Publication type:

Article

The Results of Thermal Investigations in the Region of the Contact Soldering of Electronic Devices.

Published in:

Measurement Techniques, 2014, v. 57, n. 1, p. 79, doi. 10.1007/s11018-014-0410-7

By:

Shtennikov, V.;
Budai, B.

Publication type:

Article

Reconstruction of Soft Biological Tissues Using Laser Soldering Technology with Temperature Control and Biopolymer Nanocomposites.

Published in:

Bioengineering (Basel), 2022, v. 9, n. 6, p. 238, doi. 10.3390/bioengineering9060238

By:

Gerasimenko, Alexander Yu.;
Morozova, Elena A.;
Ryabkin, Dmitry I.;
Fayzullin, Alexey;
Tarasenko, Svetlana V.;
Molodykh, Victoria V.;
Pyankov, Evgeny S.;
Savelyev, Mikhail S.;
Sorokina, Elena A.;
Rogalsky, Alexander Y.;
Shekhter, Anatoly;
Telyshev, Dmitry V.

Publication type:

Article

Ultrasonic soldering of Al<sub>2</sub>O<sub>3</sub> ceramics and Ni-SiC composite by use of Bi-based active solder.

Published in:

AIMS Materials Science, 2023, v. 10, n. 2, p. 213, doi. 10.3934/matersci.2023012

By:

Meluš, Tomáš;
Koleňák, Roman;
Drápala, Jaromír;
Babincová, Paulína;
Pašák, Matej

Publication type:

Article

Decomposition of Ag-based soldering alloys used in space maintainers after intra-oral exposure. A retrieval analysis study.

Published in:

Acta Odontologica Scandinavica, 2014, v. 72, n. 2, p. 130, doi. 10.3109/00016357.2013.812745

By:

Soteriou, Despo;
Ntasi, Argyro;
Papagiannoulis, Lisa;
Eliades, Theodore;
Zinelis, Spiros

Publication type:

Article

Intellectualizing the Process of Waveguide Tracks Induction Soldering for Spacecrafts.

Published in:

International Review of Aerospace Engineering, 2019, v. 12, n. 6, p. 280

By:

Tynchenko, Vadim S.;
Milov, Anton V.;
Tynchenko, Valeriya V.;
Bukhtoyarov, Vladimir V.;
Kukartsev, Vladislav V.

Publication type:

Article

Evaluation of Die-Soldering and Erosion Resistance of High Velocity Oxy-Fuel Sprayed MoB-Based Cermet Coatings.

Published in:

Journal of Thermal Spray Technology, 2011, v. 20, n. 5, p. 1022, doi. 10.1007/s11666-010-9610-0

By:

Faisal Farooq Khan;
Gyuyeol Bae;
Kicheol Kang;
Hyuntaek Na;
Junghwan Kim;
Taeho Jeong;
Changhee Lee

Publication type:

Article

Data-based thermodynamic model and feedforward-PI control method for laser soldering.

Published in:

International Journal of Advanced Manufacturing Technology, 2023, v. 129, n. 11/12, p. 5249, doi. 10.1007/s00170-023-12553-0

By:

Chen, Zhihua;
Chen, Jiasen;
Hong, Peiqing;
Zhang, Tao;
Bao, Yunan

Publication type:

Article

Obtaining a low-temperature paste based on eutectic silumin for soldering special-purpose products.

Published in:

International Journal of Advanced Manufacturing Technology, 2022, v. 119, n. 5/6, p. 3857, doi. 10.1007/s00170-021-08619-6

By:

Uskov, Igor Vasilevich;
Gorokhov, Yuriy Vasilevich;
Gubanov, Ivan Yurievich;
Belyaev, Sergey Vladimirovich;
Kosovich, Aleksandr Aleksandrovich;
Lesiv, Elena Mikhailovna;
Konstantinov, Igor Lazarevich;
Gubanova, Marina Igorevna;
Kosyachenko, Ivan Sergeevich;
Pavlov, Nikita Evgenevich

Publication type:

Article

Mechanism of die soldering during aluminum die casting.

Published in:

China Foundry, 2015, v. 12, n. 2, p. 136

By:

Qing-you Han

Publication type:

Article

Laser Beam Ultrasonic Assisted Fluxless Soldering of Ceramics Using Bi-Ag-La Solder.

Published in:

International Review of Mechanical Engineering, 2017, v. 11, n. 9, p. 661, doi. 10.15866/ireme.v11i9.11724

By:

Koleňák, Roman;
Kostolný, Igor;
Šimek, Michal

Publication type:

Article

Wettability of Soldering Alloys Heated by Electron Beam.

Published in:

International Review of Mechanical Engineering, 2016, v. 10, n. 2, p. 95, doi. 10.15866/ireme.v10i2.8283

By:

Koleňák, Roman;
Kostolný, Igor;
Dřímal, Daniel;
Rabatin, Andrej

Publication type:

Article

Local vacuum sealing of casings of devices by light beam soldering.

Published in:

Welding International, 2014, v. 28, n. 5, p. 417, doi. 10.1080/09507116.2013.840029

By:

Bazhanov, A.V.;
Frolov, V.A.;
Fedorov, S.A.

Publication type:

Article

Use of contact-reactive soldering in production of power semiconductor devices.

Published in:

Welding International, 2012, v. 26, n. 1, p. 45, doi. 10.1080/09507116.2011.592712

By:

Zenin, V.V.;
Boiko, V.I.

Publication type:

Article

Strength and corrosion resistance of a solder joint in ultrasonic soldering of aluminium using quasi-melting solder.

Published in:

Welding International, 2009, v. 23, n. 12, p. 879, doi. 10.1080/09507110902836960

By:

Nagaoka, Toru;
Morisada, Yoshiaki;
Fukusumi, Masao;
Takemoto, Tadashi

Publication type:

Article

Research on Microstructure and Shear Behavior of Au/Sn-Ag-Cu/Cu Lead-free Solder Joints at Different Soldering Temperatures.

Published in:

Journal of Electronic Materials, 2021, v. 50, n. 10, p. 5965, doi. 10.1007/s11664-021-09107-z

By:

Zhai, Xinmeng;
Chen, Yue;
Li, Yuefeng;
Zou, Jun;
Shi, Mingming;
Yang, Bobo;
Li, Yang;
Guo, Chunfeng;
Hu, Rongrong;
Bao, Qijun

Publication type:

Article

Effect of Soldering Temperature on the Reliability of Sn-Ag-Cu Lead-Free Solder Joints.

Published in:

Journal of Electronic Materials, 2021, v. 50, n. 3, p. 869, doi. 10.1007/s11664-020-08715-5

By:

Xinmeng, Zhai;
Yuefeng, Li;
Jun, Zou;
Mingming, Shi;
Bobo, Yang;
Yang, Li;
Chunfeng, Guo;
Rongrong, Hu

Publication type:

Article

Effect of the Silver Content of SnAgCu Solder on the Interfacial Reaction and on the Reliability of Angle Joints Fabricated by Laser-Jet Soldering.

Published in:

Journal of Electronic Materials, 2015, v. 44, n. 2, p. 733, doi. 10.1007/s11664-014-3516-4

By:

Ji, Hongjun;
Ma, Yuyou;
Li, Mingyu;
Wang, Chunqing

Publication type:

Article

Wetting and Soldering Behavior of Eutectic Au-Ge Alloy on Cu and Ni Substrates.

Published in:

Journal of Electronic Materials, 2011, v. 40, n. 7, p. 1533, doi. 10.1007/s11664-011-1639-4

By:

Leinenbach, C.;
Valenza, F.;
Giuranno, D.;
Elsener, H.;
Jin, S.;
Novakovic, R.

Publication type:

Article

Comparison of Sn2.8Ag20In and Sn10Bi10In Solders for Intermediate-Step Soldering.

Published in:

Journal of Electronic Materials, 2006, v. 35, n. 11, p. 1975, doi. 10.1007/s11664-006-0302-y

By:

Sun-Kyoung Seo;
Moon Gi Cho;
Hyuck Mo Lee;
Won Kyoung Choi

Publication type:

Article

Phase Field Simulations of Intermetallic Compound Growth during Soldering Reactions.

Published in:

Journal of Electronic Materials, 2004, v. 33, n. 10, p. 1161, doi. 10.1007/s11664-004-0118-6

By:

Huh, J. Y.;
Hong, K. K.;
Kim, Y. B.;
Kim, K. T.

Publication type:

Article

Interfacial reaction on different solder composition after laser soldering.

Published in:

Materialwissenschaft und Werkstoffechnik, 2024, v. 55, n. 11, p. 1484, doi. 10.1002/mawe.202200320

By:

Muhamad Razizy, F.;
Saliza Azlina, O.;
Farazila, Y.

Publication type:

Article

Lead Titanate Granulometric Composition Effect on CLTE of Low-Melting Glass-Composition Materials for Vacuum-Tight Low-Temperature Soldering of Corundum Parts.

Published in:

Glass & Ceramics, 2017, v. 74, n. 5/6, p. 176, doi. 10.1007/s10717-017-9956-6

By:

Chakvetadze, D.;
Spiridonov, Yu.;
Savinkov, V.;
Karpov, E.;
Zinina, É.;
Sigaev, V.

Publication type:

Article

Contact allergy to colophony in soldering flux.

Published in:

Contact Dermatitis (01051873), 1983, v. 9, n. 3, p. 205, doi. 10.1111/j.1600-0536.1983.tb04359.x

By:

Wideström, Lena

Publication type:

Article