Works matching Solder %26 soldering

Results: 3060

Comparison of Sn2.8Ag20In and Sn10Bi10In Solders for Intermediate-Step Soldering.

Published in:

Journal of Electronic Materials, 2006, v. 35, n. 11, p. 1975, doi. 10.1007/s11664-006-0302-y

By:

Sun-Kyoung Seo;
Moon Gi Cho;
Hyuck Mo Lee;
Won Kyoung Choi

Publication type:

Article

Relationship between free solder thickness to the solderability of Sn-0.7Cu-0.05Ni solder coating during soldering.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 4, p. 3669, doi. 10.1007/s10854-018-00647-5

By:

Ramli, M. I. I.;
Mohd Salleh, M. A. A.;
Mohd Sobri, F. A.;
Narayanan, P.;
Sweatman, K.;
Nogita, K.

Publication type:

Article

Formation and evolution of intermetallic compounds between the In-3Ag solder and Cu substrate during soldering.

Published in:

Journal of Materials Science: Materials in Electronics, 2015, v. 26, n. 10, p. 7967, doi. 10.1007/s10854-015-3451-z

By:

Ma, Yunzhu;
Luo, Huiting;
Li, Yongjun;
Liu, Wensheng;
Wang, Yikai;
Huang, Boyun

Publication type:

Article

The effects of solder deformation on the wetting characteristics and interfacial reaction of Sn-3.5Ag solders on Cu substrates in fluxless soldering.

Published in:

Journal of Materials Science: Materials in Electronics, 2013, v. 24, n. 9, p. 3255, doi. 10.1007/s10854-013-1238-7

By:

Lee, Jeong;
Ma, Sung;
Kim, Young;
Lee, Jin;
Kim, Ki;
Kim, Jae;
Oh, Jae;
Kim, Namseog;
Kim, Young-Ho

Publication type:

Article

Powder solders for hard soldering of aluminium and its alloys.

Published in:

Welding International, 2011, v. 25, n. 1, p. 37, doi. 10.1080/09507111003655135

By:

Mirski, Zbigniew;
Granat, Kazimierz;
Drzeniek, Hubert

Publication type:

Article

Research on Microstructure and Shear Behavior of Au/Sn-Ag-Cu/Cu Lead-free Solder Joints at Different Soldering Temperatures.

Published in:

Journal of Electronic Materials, 2021, v. 50, n. 10, p. 5965, doi. 10.1007/s11664-021-09107-z

By:

Zhai, Xinmeng;
Chen, Yue;
Li, Yuefeng;
Zou, Jun;
Shi, Mingming;
Yang, Bobo;
Li, Yang;
Guo, Chunfeng;
Hu, Rongrong;
Bao, Qijun

Publication type:

Article

Interfacial reaction on different solder composition after laser soldering.

Published in:

Materialwissenschaft und Werkstoffechnik, 2024, v. 55, n. 11, p. 1484, doi. 10.1002/mawe.202200320

By:

Muhamad Razizy, F.;
Saliza Azlina, O.;
Farazila, Y.

Publication type:

Article

Effect of in Addition on Thermodynamic Properties, Wettability, Interface Microstructure, and Soldering Performance of SnBiAg–xIn/Cu Solder Joints.

Published in:

Metals (2075-4701), 2022, v. 12, n. 10, p. 1594, doi. 10.3390/met12101594

By:

Shen, Bingwei;
Yang, Shangrong;
Xu, Mingyue;
Zhao, Jincheng;
Liu, Guohua;
Xie, Ming;
Zhang, Qiao

Publication type:

Article

Microstructure evolution and mechanical properties of 6N01S-T5 aluminum alloy joints with semi-solid solders by ultrasonic soldering.

Published in:

International Journal of Modern Physics B: Condensed Matter Physics; Statistical Physics; Applied Physics, 2019, v. 33, n. 1-3, p. N.PAG, doi. 10.1142/S0217979219400277

By:

Wang, Yao;
Li, Yuanxing;
Han, Dengquan;
Qiu, Sifu;
Chen, Hui

Publication type:

Article

Application of ultrasonic assisted soldering method to hard-to-solder material.

Published in:

International Journal of Modern Physics B: Condensed Matter Physics; Statistical Physics; Applied Physics, 2018, v. 32, n. 19, p. N.PAG, doi. 10.1142/S0217979218400544

By:

Yonekura, Daisuke;
Ueki, Tomoyuki;
Taguchi, Yuki

Publication type:

Article

Sn-Zn系无铅焊料在波峰焊中的应用.

Published in:

Electronic Components & Materials, 2018, v. 37, n. 7, p. 8, doi. 10.14106/j.cnki.1001-2028.2018.07.002

By:

陈一鸣;
王正宏;
马莒生;
张弓

Publication type:

Article

The Interphases Formed During the Very Early Stage Liquid Solder/Metal Substrate Interaction of the Soldering Process.

Published in:

JOM: The Journal of The Minerals, Metals & Materials Society (TMS), 2012, v. 64, n. 10, p. 1184, doi. 10.1007/s11837-012-0441-y

By:

Lin, Kwang-Lung;
Lin, Yu-Wei;
Yu, Chang-Ho

Publication type:

Article

Numerical simulation and experimental study on wetting of Sn-based solder for laser soldering.

Published in:

Journal of Mechanical Science & Technology, 2024, v. 38, n. 6, p. 2749, doi. 10.1007/s12206-024-2205-3

By:

Li, Fenqiang;
Wang, Qianting;
Shu, Jiawei;
Chen, Hao;
Li, Hui

Publication type:

Article

Wettability, interfacial reactions, and impact strength of Sn–3.0Ag–0.5Cu solder/ENIG substrate used for fluxless soldering under formic acid atmosphere.

Published in:

Journal of Materials Science, 2020, v. 55, n. 7, p. 3107, doi. 10.1007/s10853-019-04153-9

By:

He, Siliang;
Gao, Runhua;
Shen, Yu-An;
Li, Jiahui;
Nishikawa, Hiroshi

Publication type:

Article

Effects of TiO2 nanoparticles addition on physical and soldering properties of Sn–xTiO2 composite solder.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 20, p. 18828, doi. 10.1007/s10854-019-02239-3

By:

Liu, Zhiyuan;
Ma, Haoran;
Shang, Shengyan;
Wang, Yunpeng;
Li, Xiaogan;
Ma, Haitao

Publication type:

Article

The morphology and kinetic evolution of intermetallic compounds at Sn-Ag-Cu solder/Cu and Sn-Ag-Cu-0.5AlO composite solder/Cu interface during soldering reaction.

Published in:

Journal of Materials Science: Materials in Electronics, 2012, v. 23, n. 1, p. 100, doi. 10.1007/s10854-011-0476-9

By:

Chang, S.;
Tsao, L.;
Wu, M.;
Chen, C.

Publication type:

Article

Strength and corrosion resistance of a solder joint in ultrasonic soldering of aluminium using quasi-melting solder.

Published in:

Welding International, 2009, v. 23, n. 12, p. 879, doi. 10.1080/09507110902836960

By:

Nagaoka, Toru;
Morisada, Yoshiaki;
Fukusumi, Masao;
Takemoto, Tadashi

Publication type:

Article

Impact of Cu Pillar Bump Diameter and Solder Material on Reflow Soldering: A Computational Study with Thermal Fluid–Structure Interaction.

Published in:

Journal of Electronic Materials, 2024, v. 53, n. 3, p. 1201, doi. 10.1007/s11664-023-10855-3

By:

Lee, Jing Rou;
Abdul Aziz, Mohd Sharizal;
Khor, Chu Yee;
Ishak, Mohammad Hafifi Hafiz;
Kamarudin, Roslan;
Ani, F. Che

Publication type:

Article

Transient Soldering Reaction Mechanisms of SnCu Solder on CuNi Nano Conducting Layer and Fracture Behavior of the Joint Interfaces.

Published in:

Journal of Electronic Materials, 2020, v. 49, n. 5, p. 3383, doi. 10.1007/s11664-020-08030-z

By:

Zhang, Qingke;
Hu, Fangqin;
Song, Zhenlun

Publication type:

Article

Cross-Interaction of Interfacial Reactions in Ni (Au/Ni/Cu)-SnAg-Cu Solder Joints during Reflow Soldering and Thermal Aging.

Published in:

Journal of Electronic Materials, 2007, v. 36, n. 1, p. 26, doi. 10.1007/s11664-006-0005-4

By:

Chen, H. T.;
Wang, C. Q.;
Yan, C.;
Li, M. Y.;
Huang, Y.

Publication type:

Article

Comparative Study of Interfacial Reactions of Sn-Ag-Cu and Sn-Ag Solders on Cu Pads during Reflow Soldering.

Published in:

Journal of Electronic Materials, 2005, v. 34, n. 1, p. 46, doi. 10.1007/s11664-005-0179-1

By:

Sharif, Ahmed;
Chan, Y. C.

Publication type:

Article

Study on the performance of Cu foam with different porosity on SAC305 solder joints under ultrasonic-assisted soldering.

Published in:

Journal of Materials Science: Materials in Electronics, 2021, v. 32, n. 24, p. 28108, doi. 10.1007/s10854-021-07186-6

By:

Mao, Xin;
Zhang, Ruhua;
Yi, Xiong;
Hu, Xiaowu;
Li, Yulong;
Jiang, Xiongxin

Publication type:

Article

Board-level drop reliability and fracture behavior of low-temperature soldering Sn–Ag–Cu/Sn–Bi–X hybrid BGA solder joints for consumer electronics.

Published in:

Journal of Materials Science: Materials in Electronics, 2021, v. 32, n. 11, p. 15453, doi. 10.1007/s10854-021-06094-z

By:

Ren, J.;
Huang, M. L.

Publication type:

Article

Electromigration behavior of Cu/Sn–58Bi–1Ag/Cu solder joints by ultrasonic soldering process.

Published in:

Journal of Materials Science: Materials in Electronics, 2020, v. 31, n. 15, p. 11997, doi. 10.1007/s10854-020-03817-6

By:

Liu, Shengfa;
Liu, Zhangyang;
Liu, Li;
Song, Tianjie;
Liu, Wei;
Tan, Yingzhen;
San, Zhanyi;
Huang, Shangyu

Publication type:

Article

Use of Sn91Zn9 Lead-Free Solder in Resistance Element Soldering Technology.

Published in:

Metals (2075-4701), 2025, v. 15, n. 3, p. 306, doi. 10.3390/met15030306

By:

Sejč, Pavol;
Vanko, Branislav;
Gábrišová, Zuzana;
Schrek, Alexander

Publication type:

Article

Use of Sn60Pb40 Solder in Resistance Element Soldering Technology.

Published in:

Metals (2075-4701), 2023, v. 13, n. 7, p. 1313, doi. 10.3390/met13071313

By:

Sejč, Pavol;
Vanko, Branislav;
Schrek, Alexander;
Gábrišová, Zuzana

Publication type:

Article

Board-level drop properties of Sn–49Bi–1Ag/Sn–3.0Ag–0.5Cu hybrid solder joints assembled by low-temperature soldering.

Published in:

Science & Technology of Welding & Joining, 2022, v. 27, n. 7, p. 564, doi. 10.1080/13621718.2022.2085990

By:

Ren, J.;
Huang, M. L.

Publication type:

Article

Fabrication and properties of NiO-modified Al2O3 reinforced Sn1.0Ag0.5Cu composite solder and soldering performance.

Published in:

Journal of Materials Science, 2022, v. 57, n. 36, p. 17491, doi. 10.1007/s10853-022-07729-0

By:

Wang, Bingying;
Wu, Yongjin;
Wu, Wan;
Wang, Huigai;
Zhang, Keke

Publication type:

Article

Workplace Exposure to Rosin-based Solder Flux Fume During Hand Soldering.

Published in:

Annals of Occupational Hygiene, 1998, v. 42, n. 5, p. 295, doi. 10.1016/S0003-4878(98)00032-5

By:

PENGELLY, I.;
GROVES, J.;
SIMPSON, A.;
NORTHAGE, C.

Publication type:

Article

Effect of Temperature on the Chip Soldering Process with AuGa0.03 Alloy Solder.

Published in:

Crystals (2073-4352), 2020, v. 10, n. 2, p. 59, doi. 10.3390/cryst10020059

By:

Zhao, Zhihuan;
Gong, Guanghao;
Jiang, Mingming;
Chen, Chuanzhong;
Pan, Yingyue;
Liu, Weili;
Zhang, Li

Publication type:

Article

RESEARCH OF THE ALLOYING ADDITIVES CONTENT IN HIGH-SILVER SOLDERS ON THEIR SUSCEPTIBILITY TO SOLDERING PROCESS AND BASIC PERFORMANCE PROPERTIES.

Published in:

Metalurgija, 2024, v. 63, n. 2, p. 275

By:

LAMLA, N.;
KWAŚNIEWSKI, P.;
KIESIEWICZ, G.;
SADZIKOWSKI, M.;
FRANCZAK, K.

Publication type:

Article

Lead-free soldering: Materials science and solder joint reliability.

Published in:

JOM: The Journal of The Minerals, Metals & Materials Society (TMS), 2009, v. 61, n. 6, p. 28, doi. 10.1007/s11837-009-0084-9

By:

Kejun Zeng

Publication type:

Article

Technology of soldering of ZrO2 ceramics with solders of the Ag-Cu-O system in air.

Published in:

Materials Science, 2004, v. 40, n. 4, p. 552, doi. 10.1007/s11003-005-0077-y

By:

Durov, O. V.

Publication type:

Article

Development of Tooling and Modes of Dispersion for Powders of Solder Aluminum Alloys.

Published in:

Metallurgist, 2018, v. 62, n. 5/6, p. 597, doi. 10.1007/s11015-018-0697-8

By:

Uskov, I. V.;
Gorokhov, Yu. V.;
Gubanov, I. Yu.;
Gubanova, M. I.;
Lesiv, E. M.

Publication type:

Article

The development and formation of soldering technique on the bronze ritual vessel casting of the Shang and Zhou Dynasties.

Published in:

Chinese Archaeology, 2018, v. 18, n. 1, p. 180, doi. 10.1515/char-2018-0018

By:

Zhang, Changping

Publication type:

Article

Effects of substrate annealing on wettability and intermetallic compound formation in Sn–3.0Cu/Cu systems.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 13, p. 12087, doi. 10.1007/s10854-019-01566-9

By:

Mookam, Niwat;
Kanlayasiri, Kannachai

Publication type:

Article

Characterization of solder joints made with VPS on DBC substrate.

Published in:

Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 2, p. 1769, doi. 10.1007/s10854-016-5724-6

By:

Skwarek, Agata;
Illés, Balázs;
Synkiewicz, Beata;
Wroński, Sebastian;
Tarasiuk, Jacek;
Witek, Krzysztof

Publication type:

Article

Direct robust bonding between Sn-based solder and Si substrate.

Published in:

Journal of Materials Science: Materials in Electronics, 2007, v. 18, n. 10, p. 1057, doi. 10.1007/s10854-006-9114-3

By:

Yu, D. Q.;
Wu, C. M.;
Wong, Y. W.;
Lai, J. K. L.

Publication type:

Article

Microstructure and Properties of Ni-GNSs Reinforced Sn2.5Ag0.7Cu0.1RE Composite Solder/Cu Soldering Joint During Thermal Migration.

Published in:

Journal of Henan University of Science & Technology, Natural Science, 2022, v. 43, n. 2, p. 1, doi. 10.15926/j.cnki.issn1672-6871.2022.02.001

By:

LI Shijie;
ZHANG Keke;
ZHANG Chao;
LI Junheng;
WU Wan

Publication type:

Article

Effect of Electromigration on Microstructure and Properties of Ni-rGO Reinforced Sn2. 5Ag0. 7Cu 0.1 RE Composite Solder/Cu Soldering Joints.

Published in:

Journal of Henan University of Science & Technology, Natural Science, 2020, v. 41, n. 1, p. 5, doi. 10.15926/j.cnki.issn1672-6871.2020.01.002

By:

PAN Yibo;
ZHANG Keke;
ZHANG Chao;
WANG Huigai;
LI Junheng

Publication type:

Article

Challenging gold based filler metals for uses in medicine.

Published in:

Materials Science & Technology, 2009, v. 25, n. 12, p. 1422, doi. 10.1179/174328407X226590

By:

Bobzin, K.;
Lugscheider, E.;
Ernst, F.;
Rösing, J.;
Ferrara, S.

Publication type:

Article

Soldering of aluminium with copper.

Published in:

Welding International, 2013, v. 27, n. 3, p. 190, doi. 10.1080/09507116.2011.600029

By:

Mirski, Zbigniew;
Granat, Kazimierz;
Drzeniek, Hubert;
Piwowarczyk, Tomasz;
Wojdat, Tomasz

Publication type:

Article

The aggressive influence of lead-free solders and the protection of soldering devices against damage.

Published in:

Welding International, 2011, v. 25, n. 8, p. 622, doi. 10.1080/09507116.2010.540844

By:

Mirski, Zbigniew;
Drzeniek, Hubert;
Wojdat, Tomasz

Publication type:

Article

Effect of the Welding Process on the Microstructure and Mechanical Properties of Au/Sn–3.0Ag–0.5Cu/Cu Solder Joints.

Published in:

Journal of Electronic Materials, 2022, v. 51, n. 4, p. 1597, doi. 10.1007/s11664-021-09426-1

By:

Zhai, Xinmeng;
Chen, Yue;
Li, Yuefeng;
Zou, Jun;
Shi, Mingming;
Yang, Bobo

Publication type:

Article

Effect of Soldering Temperature on the Reliability of Sn-Ag-Cu Lead-Free Solder Joints.

Published in:

Journal of Electronic Materials, 2021, v. 50, n. 3, p. 869, doi. 10.1007/s11664-020-08715-5

By:

Xinmeng, Zhai;
Yuefeng, Li;
Jun, Zou;
Mingming, Shi;
Bobo, Yang;
Yang, Li;
Chunfeng, Guo;
Rongrong, Hu

Publication type:

Article

Balancing temperature and time in reflow soldering for improving Sn-3.0Ag-0.5Cu solder joint strength.

Published in:

Journal of Materials Science: Materials in Electronics, 2025, v. 36, n. 2, p. 1, doi. 10.1007/s10854-024-14201-z

By:

Yong, Guoqing;
Meng, Yu;
Wang, Shanshan;
Han, Zongjie;
Xia, Haiyang;
Zhang, Yan;
Chen, Yunfei

Publication type:

Article

Real-time monitoring of soldering process in SAC composite solder paste: movement and interaction of dopant particles in solder paste.

Published in:

Journal of Materials Science: Materials in Electronics, 2023, v. 34, n. 5, p. 1, doi. 10.1007/s10854-023-09921-7

By:

Tamizi, M.;
Movahedi, M.;
Kokabi, A. H.

Publication type:

Article

Interfacial IMC growth behavior and mechanical properties of Cu/Sn58Bi/Cu and Cu/Sn58Bi–0.05AlN/Cu solder joints under ultrasonic-assisted soldering.

Published in:

Journal of Materials Science: Materials in Electronics, 2023, v. 34, n. 5, p. 1, doi. 10.1007/s10854-022-09609-4

By:

Wang, Xi;
Zhang, Liang;
Chen, Chen;
Lu, Xiao;
Long, Wei-min

Publication type:

Article

Comparative study of laser- and reflow-soldered Sn–3.0Ag–0.5Cu joints on thin Au/Pd/Ni(P) substrate.

Published in:

Journal of Materials Science: Materials in Electronics, 2023, v. 34, n. 3, p. 1, doi. 10.1007/s10854-022-09632-5

By:

Lee, Dong-Hwan;
Jeong, Min-Seong;
Yoon, Jeong-Won

Publication type:

Article

Strengthening mechanism of Ni-modified graphene nanosheets reinforced SnAgCuRE composite solder/Cu joints.

Published in:

Journal of Materials Science: Materials in Electronics, 2021, v. 32, n. 24, p. 28695, doi. 10.1007/s10854-021-07245-y

By:

Wang, Huigai;
Zhang, Keke;
Wu, Yongjin;
Wang, Bingying

Publication type:

Article