Works matching Printed circuits

Results: 5000

耐温裸光纤在挠性光电电路中的应用.

Published in:

China Sciencepaper, 2021, v. 16, n. 3, p. 325

By:

毛久兵;
许梦婷;
杨伟;
杨剑;
冯晓娟

Publication type:

Article

MuSAP-GAN: printed circuit board defect detection using multi-level attention-based printed circuit board with generative adversarial network.

Published in:

Electrical Engineering, 2025, v. 107, n. 3, p. 3573, doi. 10.1007/s00202-024-02703-2

By:

Patel, Nileshkumar

Publication type:

Article

某印制电路板企业清洁生产评价体系构建与探讨.

Published in:

Electroplating & Finishing, 2022, v. 41, n. 21, p. 1558, doi. 10.19289/j.1004-227x.2022.21.013

By:

陈妤;
魏喆;
叶茂盛;
李杨杨;
魏立安

Publication type:

Article

Ultrasonic Bonding of Electrodes of Rigid and Flexible Printed Circuit Boards with Non-Conductive Film (NCF).

Published in:

Journal of Adhesion, 2009, v. 85, n. 6, p. 341, doi. 10.1080/00218460902880198

By:

Jong-Bum Lee;
Ja-Myeong Koo;
Jong-Woong Kim;
Bo-In Noh;
Jong-Gun Lee;
Seung-Boo Jung

Publication type:

Article

Analiza postupanja plastikom iz tretmana električnog i elektronskog otpada u Republici Srbiji i ispitivanje reciklažnog potencijala nemetalične frakcije štampanih ploča.

Published in:

Chemical Industry / Hemijska Industrija, 2017, v. 71, n. 3, p. 271, doi. 10.2298/HEMIND160415037V

By:

Vučinić, Aleksandra S.;
Kamberović, Željko J.;
Ranitović, Milisav B.;
Kovačević, Tihomir M.;
Najčević, Irena D.

Publication type:

Article

A LOW-COST PRINTED CIRCUIT BOARD DESIGN TECHNIQUE AND PROCESSES USING FERRIC CHLORIDE SOLUTION.

Published in:

Nigerian Journal of Technology, 2020, v. 39, n. 4, p. 1223, doi. 10.4314/njt.v39i4.31

By:

Obe, C. T.;
Oti, S. E.;
Eya, C. U.;
Nnadi, D. B. N.;
Nnadi, O. E.

Publication type:

Article

多场耦合研究印制电路盲孔填铜.

Published in:

Electronic Components & Materials, 2018, v. 37, n. 7, p. 22, doi. 10.14106/j.cnki.1001-2028.2018.07.004

By:

苏世栋;
冀林仙

Publication type:

Article

MODELING OF GRINDING PROCESS BY PRINTED CIRCUIT BOARDS RECYCLING.

Published in:

Annals of DAAAM & Proceedings, 2010, p. 475

By:

Charvatova, H.

Publication type:

Article

ДОСЛІДЖЕННЯ НАПРУЖЕНО-ДЕФОРМОВАНОГО СТАНУ ПОЛІІМІДНИХ КОМУНІКАЦІЙНИХ СТРУКТУР НА ПРИКЛАДІ ГНУЧКОГО ШЛЕЙФУ

Published in:

Problems of Friction & Wear, 2019, v. 83, n. 2, p. 54, doi. 10.18372/0370-2197.2(83).13693

By:

НЕВЛЮДОВ, І. Ш.;
ПАЛАГІН, В. А.;
ДЕМСЬКА, Н. П.;
НЕВЛЮДОВА, В. В.;
СТАРОДУБЦЕВ, М. Г.

Publication type:

Article

Design of Printed Circuit Board Production using Water Jet Technology.

Published in:

TEM Journal, 2019, v. 8, n. 4, p. 1313, doi. 10.18421/TEM84-30

By:

Gajdovcik, Peter;
Lehocka, Dominika;
Duplákova, Darina;
Botko, Frantisek;
Sitek, Libor

Publication type:

Article

Multi-objective constructal design of a printed circuit cooler for S-CO<sub>2</sub> cycle.

Published in:

Journal of Thermal Analysis & Calorimetry, 2024, v. 149, n. 22, p. 13345, doi. 10.1007/s10973-024-13718-z

By:

Dan, Zhisong;
Feng, Huijun;
Chen, Lingen;
Ge, Yanlin

Publication type:

Article

Techniki szybkiego wytwarzania prototypowych obwodów drukowanych.

Published in:

Przegląd Elektrotechniczny, 2019, v. 95, n. 9, p. 165, doi. 10.15199/48.2019.09.35

By:

DĄBROWSKI, Jacek

Publication type:

Article

Using Deep Learning to Automatic Inspection System of Printed Circuit Board in Manufacturing Industry under the Internet of Things.

Published in:

Computer Science & Information Systems, 2023, v. 20, n. 2, p. 723, doi. 10.2298/CSIS220718020Z

By:

Kai Zhang

Publication type:

Article

Simulation studies of printed circuit board using finite element method to evaluate the potential of cellulose fibres to replace glass fibres.

Published in:

Materialwissenschaft und Werkstoffechnik, 2025, v. 56, n. 5, p. 715, doi. 10.1002/mawe.202400028

By:

Velosa, J. C.;
Curto, J. M. R.

Publication type:

Article

Optical Detection Techniques for Biomedical Sensing: A Review of Printed Circuit Board (PCB)-Based Lab-on-Chip Systems.

Published in:

Micromachines, 2025, v. 16, n. 5, p. 564, doi. 10.3390/mi16050564

By:

Perdigones, Francisco;
Giménez-Gómez, Pablo;
Muñoz-Berbel, Xavier;
Aracil, Carmen

Publication type:

Article

Surface modification of printed circuit board by low-temperature plasma.

Published in:

Electroplating & Finishing, 2022, v. 41, n. 19, p. 1398, doi. 10.19289/j.1004-227x.2022.19.011

By:

WANG Zhiwei;
WANG Jun;
YANG Tao;
WANG Hui

Publication type:

Article

纳秒脉冲激光剥离印制电路板三防漆试验研究.

Published in:

Electroplating & Finishing, 2022, v. 41, n. 5, p. 371, doi. 10.19289/j.1004-227x.2022.05.013

By:

何宗泰;
金聪;
张润华;
汪于涛;
杨奇彪;
刘顿

Publication type:

Article

THE CURRENT STATE OF SCIENTIFIC RESEARCH IN THE FIELD OF OPTIMIZING PRINTED CIRCUIT BOARD PROCESSING TECHNOLOGIES BY MINIMIZING DRILLING PATH USING GENETIC ALGORITHMS.

Published in:

Academic Journal of Manufacturing Engineering, 2024, v. 22, n. 4, p. 119

By:

GHINDAOANU, Stefan-Valentin;
ANCAU, Mircea

Publication type:

Article

Treatment of volatile organic compounds from a typical waste printed circuit board dismantling workshop by a pilot-scale biotrickling filter.

Published in:

Biotechnology & Bioprocess Engineering, 2015, v. 20, n. 4, p. 766, doi. 10.1007/s12257-015-0212-z

By:

Liao, Dongqi;
Li, Jianjun;
Sun, Duanfang;
Xu, Meiying;
An, Taicheng;
Sun, Guoping

Publication type:

Article

Parametric Optimization of Double-Sided Printed Circuit Board With Triple Modal Reservation Accounting Failures.

Published in:

Electrica, 2023, v. 23, n. 2, p. 338, doi. 10.5152/electrica.2023.22078

By:

Medvedev, Artem V.;
Gazizov, Talgat R.

Publication type:

Article

Bioleaching of Metals from Printed Circuit Boards.

Published in:

Nature Environment & Pollution Technology, 2022, v. 21, n. 2, p. 599, doi. 10.46488/NEPT.2022.v21i02.018

By:

Pavithira V.;
C., Anchana Devi;
Pushpa N.

Publication type:

Article

A low-cost design experience for junior-level electronics circuits laboratories through emulation of industry-printed circuit board design practice.

Published in:

International Journal of Electrical Engineering Education, 2017, v. 54, n. 3, p. 208, doi. 10.1177/0020720916673650

By:

Kim, Ernest M.;
Schubert Jr., Thomas F.

Publication type:

Article

Particle size distribution and water recovery under the natural hydrophobic response flotation of printed circuit board comminution fines.

Published in:

Minerals & Metallurgical Processing, 2013, v. 30, n. 2, p. 85

By:

Otunniyi, I. O.;
Vermaak, M. K. G.;
Groot, D. R.

Publication type:

Article

Influence of non‐metallic fraction of printed circuit boards waste on recycled polyvinyl chloride from waste wires.

Published in:

Journal of Applied Polymer Science, 2022, v. 139, n. 2, p. 1, doi. 10.1002/app.51469

By:

Grigorescu, Ramona Marina;
Ghioca, Paul;
Iancu, Lorena;
David, Madalina Elena;
Ion, Rodica‐Mariana;
Nicolae, Cristian‐Andi;
Gabor, Raluca Augusta;
Radu, Elena Ruxandra;
Ganciarov, Mihaela;
Spurcaciu, Bogdan;
Alexandrescu, Elvira;
Ciuprina, Florin

Publication type:

Article

Deformation characteristics and resistance distribution in thermoforming of printed electrical circuits for in-mold electronics application.

Published in:

International Journal of Advanced Manufacturing Technology, 2020, v. 108, n. 3, p. 749, doi. 10.1007/s00170-020-05377-9

By:

Gong, Yao;
Cha, Kyoung Je;
Park, Jang Min

Publication type:

Article

Materials and micro drilling of high frequency and high speed printed circuit board: a review.

Published in:

International Journal of Advanced Manufacturing Technology, 2019, v. 100, n. 1-4, p. 827, doi. 10.1007/s00170-018-2711-5

By:

Shi, Hongyan;
Liu, Xianwen;
Lou, Yan

Publication type:

Article

Fabrication of complex circuit on printed circuit board (PCB) using electrochemical micro-machining.

Published in:

International Journal of Advanced Manufacturing Technology, 2016, v. 85, n. 9-12, p. 2073, doi. 10.1007/s00170-015-7817-4

By:

Singh, Jitendra;
Jain, V.;
Ramkumar, J.

Publication type:

Article

Analysis of sonic waves generated during laser engraving of printed circuits.

Published in:

International Journal of Advanced Manufacturing Technology, 2009, v. 42, n. 1/2, p. 138, doi. 10.1007/s00170-008-1581-7

By:

Gorkič, Aleš;
Kovačič, Drago;
Diaci, Janez

Publication type:

Article

Evaluation of US EPA Method 3052 Microwave Acid Digestion for Quantification of Majority Metals in Waste Printed Circuit Boards.

Published in:

Metals (2075-4701), 2020, v. 10, n. 11, p. 1511, doi. 10.3390/met10111511

By:

Remeteiová, Dagmar;
Ružičková, Silvia;
Mičková, Vladislava;
Laubertová, Martina;
Slezáková, Róberta

Publication type:

Article

Hydrometallurgical Treatment of Waste Printed Circuit Boards: Bromine Leaching.

Published in:

Metals (2075-4701), 2020, v. 10, n. 4, p. 462, doi. 10.3390/met10040462

By:

Cui, Hao;
Anderson, Corby

Publication type:

Article

Mechanism of Dissolving Tin Solders from Waste Printed Circuit Board Assemblies by Cyclic Fluoboric Acid Composite System.

Published in:

Environmental Engineering Science, 2019, v. 36, n. 8, p. 903, doi. 10.1089/ees.2018.0308

By:

Ping, Zhu;
Liu, Xiankai;
Tao, Qi;
Ma, Yi;
Wang, Yangjun;
Li, Zuliang;
Wang, Jingpei;
Cao, Zhenbang;
Hao, Ying;
Qian, Guangren

Publication type:

Article

An Efficient Hybrid Method for Calculating the EMC Coupling to a Device on a Printed Circuit Board inside a Cavity by a Wire Penetrating an Aperture.

Published in:

Electromagnetics, 2005, v. 25, n. 7/8, p. 637, doi. 10.1080/02726340500214860

By:

Lertsirimit, Chatrpol;
Jackson, DavidR.;
Wilton, DonaldR.

Publication type:

Article

Thermodynamic-Based Exergy Analysis of Precious Metal Recovery out of Waste Printed Circuit Board through Black Copper Smelting Process.

Published in:

Energies (19961073), 2019, v. 12, n. 7, p. 1313, doi. 10.3390/en12071313

By:

Ghodrat, Maryam;
Samali, Bijan;
Rhamdhani, Muhammad Akbar;
Brooks, Geoffrey

Publication type:

Article

Compact structure with high TX-RX isolation for frequency domain duplexing on printed circuit boards.

Published in:

Journal of Electromagnetic Waves & Applications, 2020, v. 34, n. 3, p. 390, doi. 10.1080/09205071.2020.1715267

By:

Kunzler, Jakob W.;
Bartschi, Jacob M.;
Warnick, Karl F.

Publication type:

Article

Waste remediation: Low-temperature synthesis of hybrid Cu(OH)<sub>2</sub>/CuO and CuO nanostructures from spent printed circuit boards and their dye degradation studies.

Published in:

Environmental Science & Pollution Research, 2024, v. 31, n. 29, p. 41624, doi. 10.1007/s11356-023-29005-7

By:

Gautam, Pushpa;
De, Arup Kumar;
Rao, Mudila Dhanunjaya;
Sinha, Indrajit;
Behera, Chhail Kumar;
Singh, Kamalesh Kumar

Publication type:

Article

Co-pyrolysis of waste printed circuit boards with iron compounds for Br-fixing and material recovery.

Published in:

Environmental Science & Pollution Research, 2021, v. 28, n. 45, p. 64642, doi. 10.1007/s11356-021-15506-w

By:

Chen, Weifang;
Shu, Yongkai;
Li, Yonglun;
Chen, Yanjun;
Wei, Jianbo

Publication type:

Article

Immobilization of Acidithiobacillus ferrooxidans on Cotton Gauze for the Bioleaching of Waste Printed Circuit Boards.

Published in:

Applied Biochemistry & Biotechnology, 2015, v. 177, n. 3, p. 675, doi. 10.1007/s12010-015-1772-2

By:

Nie, Hongyan;
Zhu, Nengwu;
Cao, Yanlan;
Xu, Zhiguo;
Wu, Pingxiao

Publication type:

Article

Copper recovery from leach solution of waste printed circuit boards by pulse current electrodeposition.

Published in:

Journal of Material Cycles & Waste Management, 2023, v. 25, n. 2, p. 1108, doi. 10.1007/s10163-023-01604-z

By:

Hao, Juanjuan;
Wang, Xiaolu;
Wang, Yishu;
Guo, Fu;
Wu, Yufeng

Publication type:

Article

Determining the Level of Dust on Printed Circuit Boards of Radio-Electronic Equipment by Optoelectronic Method.

Published in:

Inorganic Materials, 2020, v. 56, n. 15, p. 1458, doi. 10.1134/S0020168520150169

By:

Semenov, V. V.;
Astsaturov, Yu. G.;
Khanzhonkov, Yu. B.

Publication type:

Article

Mixed-Integer Linear Programming Model and Heuristic for Short-Term Scheduling of Pressing Process in Multi-Layer Printed Circuit Board Manufacturing.

Published in:

Mathematics (2227-7390), 2021, v. 9, n. 6, p. 653, doi. 10.3390/math9060653

By:

Laisupannawong, Teeradech;
Intiyot, Boonyarit;
Jeenanunta, Chawalit;
Werner, Frank

Publication type:

Article

Thermal Performance Analysis and Prediction of Printed Circuit Boards.

Published in:

Journal of Circuits, Systems & Computers, 2023, v. 32, n. 13, p. 1, doi. 10.1142/S0218126623502250

By:

Wan, Yi;
Huang, Hailong

Publication type:

Article

Creating an User Interface that Provides Optimized Distribution of Microelectronic Components on the Printed Circuit Board Used in Automobile Lighting Systems.

Published in:

Journal of Integrated Circuits & Systems, 2024, v. 19, n. 2, p. 1, doi. 10.29292/jics.v19i2.856

By:

Bilbay, Fahri Berk;
Ediz, Barış;
Çal, Enes;
Çakır, Mustafa Cemal

Publication type:

Article

Subgraph matching-based reference placement for printed circuit board designs.

Published in:

Journal of Supercomputing, 2024, v. 80, n. 16, p. 24324, doi. 10.1007/s11227-024-06338-9

By:

Zhu, Ziran;
Li, Yilin;
Su, Miaodi;
Zhang, Shu;
Su, Haiyuan;
Xiao, Yifeng;
He, Huan;
Chen, Jianli;
Chang, Yao-Wen

Publication type:

Article

Automatic printed circuit board inspection: a comprehensible survey.

Published in:

Discover Artificial Intelligence, 2024, v. 4, n. 1, p. 1, doi. 10.1007/s44163-023-00081-5

By:

Fonseca, Luis Augusto Libório Oliveira;
Iano, Yuzo;
Oliveira, Gabriel Gomes de;
Vaz, Gabriel Caumo;
Carnielli, Giulliano Paes;
Pereira, Júlio César;
Arthur, Rangel

Publication type:

Article

响应曲面法优化废电路板浸金工艺参数试验研究.

Published in:

Hydrometallurgy of China, 2022, v. 41, n. 6, p. 533, doi. 10.13355/j.cnki.sfyj.2022.06.015

By:

高娜

Publication type:

Article

Preparation of Biobased Printed Circuit Board Prototypes Using Poly(furfuryl alcohol) Resin.

Published in:

Electronics (2079-9292), 2023, v. 12, n. 23, p. 4729, doi. 10.3390/electronics12234729

By:

Carrigan, Aidan M.;
Valentine, Joseph;
Viitaniemi, Maria L. K.;
Frost, Kali;
Nguyen, Bichlien H.;
Lincoln, John D.;
Tontisakis, Antonios

Publication type:

Article

Study on thermal-hydraulic performance of printed circuit heat exchanger with non-uniform channels used for steam generator.

Published in:

China Sciencepaper, 2020, v. 15, n. 4, p. 432

By:

CHENG Xiang;
LIAN Jie;
SU Tong;
WANG Qiuwang;
MA Ting

Publication type:

Article

Printed Circuit Board (PCB) Technology for Electrochemical Sensors and Sensing Platforms.

Published in:

Biosensors (2079-6374), 2020, v. 10, n. 11, p. 159, doi. 10.3390/bios10110159

By:

Shamkhalichenar, Hamed;
Bueche, Collin J.;
Choi, Jin-Woo

Publication type:

Article

Biplanar Nulling Coil System for OPM-MEG Using Printed Circuit Boards.

Published in:

Sensors (14248220), 2025, v. 25, n. 9, p. 2759, doi. 10.3390/s25092759

By:

Jas, Mainak;
Kamataris, John;
Matsubara, Teppei;
Dong, Chunling;
Motta, Gabriel;
Sohrabpour, Abbas;
Ahlfors, Seppo P.;
Hämäläinen, Matti;
Okada, Yoshio;
Sundaram, Padmavathi

Publication type:

Article

Temperature Hotspot Detection on Printed Circuit Boards (PCBs) Using Ultrasonic Guided Waves—A Machine Learning Approach.

Published in:

Sensors (14248220), 2024, v. 24, n. 4, p. 1081, doi. 10.3390/s24041081

By:

Yule, Lawrence;
Harris, Nicholas;
Hill, Martyn;
Zaghari, Bahareh;
Grundy, Joanna

Publication type:

Article