Works matching Integrated circuits
Results: 5000
Microwave Flexible Electronics Directly Transformed from Foundry‐Produced, Multilayered Monolithic Integrated Circuits.
- Published in:
- Advanced Electronic Materials, 2022, v. 8, n. 7, p. 1, doi. 10.1002/aelm.202101350
- By:
- Publication type:
- Article
Low-Power Current Integrating Flat-Passband Infinite Impulse Response Filter for Sensor Read-Out Integrated Circuit in 65-nm CMOS Technology.
- Published in:
- Electronics (2079-9292), 2023, v. 12, n. 5, p. 1191, doi. 10.3390/electronics12051191
- By:
- Publication type:
- Article
AN EQUIVALENT THERMAL CONDUCTIVITY MODEL OF THROUGH SILICON VIA ARRAYS FOR THERMAL ANALYSIS IN 3-D INTEGRATED CIRCUITS.
- Published in:
- Thermal Science, 2024, v. 28, n. 5B, p. 4081, doi. 10.2298/TSCI230919129X
- By:
- Publication type:
- Article
THERMAL MODELLING AND ANALYSIS OF 3-D INTEGRATED CIRCUITS WITH IRREGULAR STRUCTURE.
- Published in:
- Thermal Science, 2023, v. 27, n. 5B, p. 4193, doi. 10.2298/TSCI220805061R
- By:
- Publication type:
- Article
THERMAL MODEL FOR 3-D INTEGRATED CIRCUITS WITH INTEGRATED MLGNR-BASED THROUGH SILICON VIA.
- Published in:
- Thermal Science, 2020, v. 24, n. 3B, p. 2067, doi. 10.2298/TSCI180507321X
- By:
- Publication type:
- Article
THERMAL MANAGEMENT OF THE THROUGH SILICON VIAS IN 3-D INTEGRATED CIRCUITS.
- Published in:
- Thermal Science, 2019, v. 23, n. 4, p. 2157, doi. 10.2298/TSCI1904157W
- By:
- Publication type:
- Article
A Neutrosophic Perspective on Enhancing Quality Virtual Simulation Experimental Education of Integrated Circuits: A New Approach.
- Published in:
- Neutrosophic Sets & Systems, 2025, v. 80, p. 700
- By:
- Publication type:
- Article
Simulated annealing‐based high‐level synthesis methodology for reliable and energy‐aware application specific integrated circuit designs with multiple supply voltages.
- Published in:
- International Journal of Circuit Theory & Applications, 2023, v. 51, n. 10, p. 4897, doi. 10.1002/cta.3666
- By:
- Publication type:
- Article
Photonic Integrated Circuits for Passive Optical Networks: Outlook and Case Study of Integrated Quasi-Coherent Receiver.
- Published in:
- Photonics, 2023, v. 10, n. 2, p. 182, doi. 10.3390/photonics10020182
- By:
- Publication type:
- Article
Integrated gate driver circuit technology with IGZO TFT for sensing operation.
- Published in:
- Journal of the Society for Information Display, 2019, v. 27, n. 5, p. 313, doi. 10.1002/jsid.785
- By:
- Publication type:
- Article
INTELLECTUAL PROPERTY AND SECURITY IN THE INTEGRATED CIRCUITS INDUSTRY.
- Published in:
- Strategies for Policy in Science & Education / Strategii na Obrazovatelnata i Nauchnata Politika, 2024, v. 32, p. 71, doi. 10.53656/str2024-1s-5-int
- By:
- Publication type:
- Article
Integrated circuit design of a discrete memristive chaotic system optimized by the fixed-point specific processor with acceleration instructions.
- Published in:
- Nonlinear Dynamics, 2024, v. 112, n. 12, p. 10451, doi. 10.1007/s11071-024-09624-6
- By:
- Publication type:
- Article
Discussion on Improving Safety of Station Tracks Equipped with Integrated Track Circuits of High-speed Railways.
- Published in:
- Railway Signalling & Communication Engineering, 2024, v. 21, n. 6, p. 13, doi. 10.3969/j.issn.1673-4440.2024.06.003
- By:
- Publication type:
- Article
站内ZPW-2000A一体化轨道电路低道床 适应性研究.
- Published in:
- Railway Signalling & Communication Engineering, 2022, v. 19, n. 11, p. 1, doi. 10.3969/j.issn.1673-4440.2022.11.001
- By:
- Publication type:
- Article
A Gain-Enhanced Low Hardware Complexity Charge-Domain Read-Out Integrated Circuit Using a Sampled Charge Redistribution Technique.
- Published in:
- Electronics (2079-9292), 2022, v. 11, n. 23, p. 3846, doi. 10.3390/electronics11233846
- By:
- Publication type:
- Article
Design of Three-Dimensional Virtual Simulation Experiment Platform for Integrated Circuit Course.
- Published in:
- Electronics (2079-9292), 2022, v. 11, n. 9, p. N.PAG, doi. 10.3390/electronics11091437
- By:
- Publication type:
- Article
Evaluation of the Potential Electromagnetic Interference in Vertically Stacked 3D Integrated Circuits.
- Published in:
- Applied Sciences (2076-3417), 2020, v. 10, n. 3, p. 748, doi. 10.3390/app10030748
- By:
- Publication type:
- Article
Research on Analog Integrated Circuit Test Parameter Set Reduction Based on XGBoost.
- Published in:
- Journal of Electronic Testing, 2022, v. 38, n. 3, p. 279, doi. 10.1007/s10836-022-06009-8
- By:
- Publication type:
- Article
Test Planning for Core-based Integrated Circuits under Power Constraints.
- Published in:
- Journal of Electronic Testing, 2017, v. 33, n. 1, p. 7, doi. 10.1007/s10836-016-5638-5
- By:
- Publication type:
- Article
AN ANALYTICAL THERMAL MODEL FOR THE 3-D INTEGRATED CIRCUIT WITH NEW-TYPE THROUGH SILICON VIA.
- Published in:
- Thermal Science, 2023, v. 27, n. 3B, p. 2391, doi. 10.2298/TSCI220621140X
- By:
- Publication type:
- Article
THERMAL OPTIMIZATION OF A 3-D INTEGRATED CIRCUIT.
- Published in:
- Thermal Science, 2020, v. 24, n. 4, p. 2615, doi. 10.2298/TSCI2004615W
- By:
- Publication type:
- Article
THERMAL MANAGEMENT OF THE HOTSPOTS IN 3-D INTEGRATED CIRCUITS.
- Published in:
- Thermal Science, 2018, v. 22, n. 4, p. 1685, doi. 10.2298/TSCI1804685W
- By:
- Publication type:
- Article
INTEGRATED MICROCHANNEL COOLING IN A THREE DIMENSIONAL INTEGRATED CIRCUIT.
- Published in:
- Thermal Science, 2016, v. 20, n. 3, p. 899, doi. 10.2298/TSCI1603899W
- By:
- Publication type:
- Article
An Analytical Method to Calculate the Heat Flow and Temperatures Within the Structure of A VLSI Integrated Circuit.
- Published in:
- Journal of Active & Passive Electronic Devices, 2016, v. 11, n. 2/3, p. 143
- By:
- Publication type:
- Article
A MOO-based Methodology for Designing 3D Stacked Integrated Circuits.
- Published in:
- Journal of Multi-Criteria Decision Analysis, 2014, v. 21, n. 1/2, p. 43, doi. 10.1002/mcda.1497
- By:
- Publication type:
- Article
Emerging MoS<sub>2</sub> Wafer-Scale Technique for Integrated Circuits.
- Published in:
- Nano-Micro Letters, 2023, v. 15, n. 1, p. 1, doi. 10.1007/s40820-022-01010-4
- By:
- Publication type:
- Article
Photonic Integrated Circuits for Communication Systems.
- Published in:
- Radioengineering, 2018, v. 27, n. 2, p. 357, doi. 10.13164/re.2018.0357
- By:
- Publication type:
- Article
Two-ways chip to chip communications through 2-dimensional photonic structures via photonic integrated circuit.
- Published in:
- Optical & Quantum Electronics, 2023, v. 55, n. 7, p. 1, doi. 10.1007/s11082-023-04941-3
- By:
- Publication type:
- Article
Designing low power and high contrast ratio all-optical NOT logic gate for using in optical integrated circuits.
- Published in:
- Optical & Quantum Electronics, 2019, v. 51, n. 1, p. 1, doi. 10.1007/s11082-018-1715-6
- By:
- Publication type:
- Article
Gamification for Teaching Integrated Circuit Processing in an Introductory VLSI Design Course.
- Published in:
- Education Sciences, 2024, v. 14, n. 8, p. 921, doi. 10.3390/educsci14080921
- By:
- Publication type:
- Article
Proper orthogonal decomposition-based reduced basis element thermal modeling of integrated circuits.
- Published in:
- International Journal for Numerical Methods in Engineering, 2017, v. 112, n. 5, p. 479, doi. 10.1002/nme.5529
- By:
- Publication type:
- Article
Mixed Signal Integrated Circuit Design for Integrate-and-Fire Spiking Neurons.
- Published in:
- Circuits, Systems & Signal Processing, 2023, v. 42, n. 1, p. 27, doi. 10.1007/s00034-022-02131-2
- By:
- Publication type:
- Article
A new source formulation for FDTD simulation of high-frequency integrated circuits with and without ground planes.
- Published in:
- Microwave & Optical Technology Letters, 1997, v. 14, n. 6, p. 321, doi. 10.1002/(SICI)1098-2760(19970420)14:6<321::AID-MOP4>3.0.CO;2-K
- By:
- Publication type:
- Article
Active Terahertz Modulator and Slow Light Metamaterial Devices with Hybrid Graphene–Superconductor Photonic Integrated Circuits.
- Published in:
- Nanomaterials (2079-4991), 2021, v. 11, n. 11, p. 2999, doi. 10.3390/nano11112999
- By:
- Publication type:
- Article
Fabrication of Low Cost and Low Temperature Poly-Silicon Nanowire Sensor Arrays for Monolithic Three-Dimensional Integrated Circuits Applications.
- Published in:
- Nanomaterials (2079-4991), 2020, v. 10, n. 12, p. 2488, doi. 10.3390/nano10122488
- By:
- Publication type:
- Article
A 4H-SiC Bipolar Technology for High-Temperature Integrated Circuits.
- Published in:
- Journal of Microelectronic & Electronic Packaging, 2013, v. 10, n. 4, p. 155, doi. 10.4071/imaps.390
- By:
- Publication type:
- Article
DESA: a new hybrid global optimization method and its application to analog integrated circuit sizing.
- Published in:
- Journal of Global Optimization, 2009, v. 44, n. 1, p. 53, doi. 10.1007/s10898-008-9307-9
- By:
- Publication type:
- Article
Predicting gate oxide reliability from statistical process control nodes in integrated circuit manufacturing — a case study.
- Published in:
- Quality & Reliability Engineering International, 1997, v. 13, n. 5, p. 269, doi. 10.1002/(SICI)1099-1638(199709/10)13:5<269::AID-QRE101>3.0.CO;2-H
- By:
- Publication type:
- Article
A COMPARISON OF DETERMINISTIC AND STATISTICAL SAMPLING TECHNIQUES FOR QUALITY ANALYSIS OF INTEGRATED CIRCUITS.
- Published in:
- Quality & Reliability Engineering International, 1993, v. 9, n. 6, p. 489, doi. 10.1002/qre.4680090606
- By:
- Publication type:
- Article
A COMPUTER-CONTROLLED ENVIRONMENTAL TEST SYSTEM FOR HIGH PIN-COUNT INTEGRATED CIRCUIT PACKAGES.
- Published in:
- Quality & Reliability Engineering International, 1993, v. 9, n. 2, p. 95, doi. 10.1002/qre.4680090206
- By:
- Publication type:
- Article
THE TEST NEEDS OF APPLICATION-SPECIFIC INTEGRATED CIRCUITS.
- Published in:
- Quality & Reliability Engineering International, 1986, v. 2, n. 3, p. 159, doi. 10.1002/qre.4680020305
- By:
- Publication type:
- Article
Design and Analysis of 150° Bend SIW and Corrugated SIW Bandpass Filter with Multiple Transmission Zeroes Using Reactive Periodic Structures Suitable for Microwave Integrated Circuits (MICs).
- Published in:
- Wireless Personal Communications, 2018, v. 101, n. 1, p. 167, doi. 10.1007/s11277-018-5681-x
- By:
- Publication type:
- Article
Knowledge Spillovers and Integrated Circuit Innovation Ecosystem Resilience: Evidence from China.
- Published in:
- Systems, 2024, v. 12, n. 10, p. 441, doi. 10.3390/systems12100441
- By:
- Publication type:
- Article
Large-Scale Reconfigurable Integrated Circuits for Wideband Analog Photonic Computing.
- Published in:
- Photonics, 2023, v. 10, n. 3, p. 300, doi. 10.3390/photonics10030300
- By:
- Publication type:
- Article
Key Technologies for THz Wireless Link by Silicon CMOS Integrated Circuits.
- Published in:
- Photonics, 2018, v. 5, n. 4, p. 50, doi. 10.3390/photonics5040050
- By:
- Publication type:
- Article
Human Capital Flows in Taiwan’s Technological Catch Up in Integrated Circuit Manufacturing.
- Published in:
- 2014
- By:
- Publication type:
- Case Study
Study on Hierarchical Dynamic Adjustment of Integrated Circuit Flow Based on Nonlinear Detection.
- Published in:
- Journal of Interconnection Networks, 2022, v. 22, n. Sup6, p. 1, doi. 10.1142/S0219265921480030
- By:
- Publication type:
- Article
The application of deep learning technology in integrated circuit design.
- Published in:
- Energy Informatics, 2024, v. 7, n. 1, p. 1, doi. 10.1186/s42162-024-00380-w
- By:
- Publication type:
- Article
A Review of Carbon-Based Conductive Inks and Their Printing Technologies for Integrated Circuits.
- Published in:
- Coatings (2079-6412), 2023, v. 13, n. 10, p. 1769, doi. 10.3390/coatings13101769
- By:
- Publication type:
- Article
Dependability evaluation of integrated circuits at design time against laser fault injection.
- Published in:
- Security & Communication Networks, 2012, v. 5, n. 5, p. 450, doi. 10.1002/sec.327
- By:
- Publication type:
- Article