Works matching Integrated circuits

Results: 5000

Microwave Flexible Electronics Directly Transformed from Foundry‐Produced, Multilayered Monolithic Integrated Circuits.

Published in:

Advanced Electronic Materials, 2022, v. 8, n. 7, p. 1, doi. 10.1002/aelm.202101350

By:

Qin, Guoxuan;
Jung, Yei Hwan;
Zhang, Huilong;
Jiang, Ningyue;
Ma, Pingxi;
Stetson, Scott;
Racanelli, Marco;
Ma, Zhenqiang

Publication type:

Article

Low-Power Current Integrating Flat-Passband Infinite Impulse Response Filter for Sensor Read-Out Integrated Circuit in 65-nm CMOS Technology.

Published in:

Electronics (2079-9292), 2023, v. 12, n. 5, p. 1191, doi. 10.3390/electronics12051191

By:

Jo, Sung-Hun

Publication type:

Article

Discussion on Improving Safety of Station Tracks Equipped with Integrated Track Circuits of High-speed Railways.

Published in:

Railway Signalling & Communication Engineering, 2024, v. 21, n. 6, p. 13, doi. 10.3969/j.issn.1673-4440.2024.06.003

By:

Li Jin

Publication type:

Article

站内ZPW-2000A一体化轨道电路低道床适应性研究.

Published in:

Railway Signalling & Communication Engineering, 2022, v. 19, n. 11, p. 1, doi. 10.3969/j.issn.1673-4440.2022.11.001

By:

邵嘉声

Publication type:

Article

Test Planning for Core-based Integrated Circuits under Power Constraints.

Published in:

Journal of Electronic Testing, 2017, v. 33, n. 1, p. 7, doi. 10.1007/s10836-016-5638-5

By:

SenGupta, Breeta;
Nikolov, Dimitar;
Ingelsson, Urban;
Larsson, Erik

Publication type:

Article

Research on Analog Integrated Circuit Test Parameter Set Reduction Based on XGBoost.

Published in:

Journal of Electronic Testing, 2022, v. 38, n. 3, p. 279, doi. 10.1007/s10836-022-06009-8

By:

Xiao, Yindong;
Zeng, Yutong;
Wu, Qiong;
Liu, Ke;
Li, Yanjun;
Hu, Chong

Publication type:

Article

Design of Three-Dimensional Virtual Simulation Experiment Platform for Integrated Circuit Course.

Published in:

Electronics (2079-9292), 2022, v. 11, n. 9, p. N.PAG, doi. 10.3390/electronics11091437

By:

Lai, Ziliang;
Cui, Yansong;
Zhao, Tonggang;
Wu, Qiang

Publication type:

Article

Integrated gate driver circuit technology with IGZO TFT for sensing operation.

Published in:

Journal of the Society for Information Display, 2019, v. 27, n. 5, p. 313, doi. 10.1002/jsid.785

By:

Kim, In June;
Noh, Seok;
Ban, Myung Ho;
Son, Kimin;
Han, Inhyo;
Shin, Hun Ki;
Oh, Kilhwan;
Kim, Bumsik;
Kang, In Byeong

Publication type:

Article

AN EQUIVALENT THERMAL CONDUCTIVITY MODEL OF THROUGH SILICON VIA ARRAYS FOR THERMAL ANALYSIS IN 3-D INTEGRATED CIRCUITS.

Published in:

Thermal Science, 2024, v. 28, n. 5B, p. 4081, doi. 10.2298/TSCI230919129X

By:

Zhao-Pei XU;
Kang-Jia WANG

Publication type:

Article

THERMAL MODEL FOR 3-D INTEGRATED CIRCUITS WITH INTEGRATED MLGNR-BASED THROUGH SILICON VIA.

Published in:

Thermal Science, 2020, v. 24, n. 3B, p. 2067, doi. 10.2298/TSCI180507321X

By:

Peng XU;
Zhong-Liang PAN

Publication type:

Article

THERMAL MANAGEMENT OF THE THROUGH SILICON VIAS IN 3-D INTEGRATED CIRCUITS.

Published in:

Thermal Science, 2019, v. 23, n. 4, p. 2157, doi. 10.2298/TSCI1904157W

By:

WANG, Kang-Jia;
HUA, Chu-Xia;
SUN, Hong-Chang

Publication type:

Article

Simulated annealing‐based high‐level synthesis methodology for reliable and energy‐aware application specific integrated circuit designs with multiple supply voltages.

Published in:

International Journal of Circuit Theory & Applications, 2023, v. 51, n. 10, p. 4897, doi. 10.1002/cta.3666

By:

Dilek, Selma;
Tosun, Suleyman;
Cakin, Alperen

Publication type:

Article

INTELLECTUAL PROPERTY AND SECURITY IN THE INTEGRATED CIRCUITS INDUSTRY.

Published in:

Strategies for Policy in Science & Education / Strategii na Obrazovatelnata i Nauchnata Politika, 2024, v. 32, p. 71, doi. 10.53656/str2024-1s-5-int

By:

Nachev, Ivan;
Tomova, Yuliana;
Konstantinov, Iskren;
Spasova, Marina

Publication type:

Article

Photonic Integrated Circuits for Passive Optical Networks: Outlook and Case Study of Integrated Quasi-Coherent Receiver.

Published in:

Photonics, 2023, v. 10, n. 2, p. 182, doi. 10.3390/photonics10020182

By:

Rodrigues, Francisco;
Rodrigues, Carla;
Santos, João;
Rodrigues, Cláudio;
Teixeira, António

Publication type:

Article

A Neutrosophic Perspective on Enhancing Quality Virtual Simulation Experimental Education of Integrated Circuits: A New Approach.

Published in:

Neutrosophic Sets & Systems, 2025, v. 80, p. 700

By:

Lihua Dai;
Ben Wang;
Xuemin Cheng;
Junyi Xu;
Hao Wang

Publication type:

Article

Integrated circuit design of a discrete memristive chaotic system optimized by the fixed-point specific processor with acceleration instructions.

Published in:

Nonlinear Dynamics, 2024, v. 112, n. 12, p. 10451, doi. 10.1007/s11071-024-09624-6

By:

Zhao, Yan;
Parastesh, Fatemeh;
He, Shaobo;
Fu, Longxiang;
Jafari, Sajad

Publication type:

Article

Design and Analysis of 150° Bend SIW and Corrugated SIW Bandpass Filter with Multiple Transmission Zeroes Using Reactive Periodic Structures Suitable for Microwave Integrated Circuits (MICs).

Published in:

Wireless Personal Communications, 2018, v. 101, n. 1, p. 167, doi. 10.1007/s11277-018-5681-x

By:

Moitra, Sourav;
Bhowmik, Partha Sarathee

Publication type:

Article

Graphene‐Based Lateral Heterojunctions for 2D Integrated Circuits.

Published in:

Advanced Electronic Materials, 2024, v. 10, n. 5, p. 1, doi. 10.1002/aelm.202300761

By:

Haidari, Mohd.Musaib;
Jang, Dong Jin;
Yoon, Duhee;
Kim, Hakseong;
Choi, Hong Kyw;
Yi, Yoonsik;
Kim, Jin Hong;
Ko, Jin‐Yong;
Lee, Dooho;
Kee, Eun Hee;
Jeong, Hu Young;
Park, Jeong Young;
Park, Bae Ho;
Choi, Jin Sik

Publication type:

Article

Bottom‐Up Growth of n‐Type Polymer Monolayers for High‐Performance Complementary Integrated Circuits.

Published in:

Advanced Electronic Materials, 2023, v. 9, n. 5, p. 1, doi. 10.1002/aelm.202201307

By:

Guo, Yifu;
Yang, Mingqun;
Deng, Junyang;
Ding, Chenming;
Duan, Chunhui;
Li, Mengmeng;
Li, Ling;
Liu, Ming

Publication type:

Article

Emerging MoS2 Wafer-Scale Technique for Integrated Circuits.

Published in:

Nano-Micro Letters, 2023, v. 15, n. 1, p. 1, doi. 10.1007/s40820-022-01010-4

By:

Ye, Zimeng;
Tan, Chao;
Huang, Xiaolei;
Ouyang, Yi;
Yang, Lei;
Wang, Zegao;
Dong, Mingdong

Publication type:

Article

Accurate Models for Evaluating the Direct Conducted and Radiated Emissions from Integrated Circuits.

Published in:

Applied Sciences (2076-3417), 2018, v. 8, n. 4, p. 477, doi. 10.3390/app8040477

By:

Capriglione, Domenico;
Chiariello, Andrea G.;
Maffucci, Antonio

Publication type:

Article

Towards Large-Scale Fast Reprogrammable SOA-Based Photonic Integrated Switch Circuits.

Published in:

Applied Sciences (2076-3417), 2017, v. 7, n. 9, p. 920, doi. 10.3390/app7090920

By:

Stabile, Ripalta

Publication type:

Article

A MOO-based Methodology for Designing 3D Stacked Integrated Circuits.

Published in:

Journal of Multi-Criteria Decision Analysis, 2014, v. 21, n. 1/2, p. 43, doi. 10.1002/mcda.1497

By:

Doan, N.A.V.;
Milojevic, D.;
Robert, F.;
De Smet, Y.

Publication type:

Article

Development of Integrated Circuits Using Artificial Conducting Liquid (Synthetic Plasma) - A Novel Research.

Published in:

American Journal of Biomedical Sciences, 2018, v. 10, n. 2, p. 65, doi. 10.5099/aj180200065

By:

Pandya, Killol

Publication type:

Article

Predicting gate oxide reliability from statistical process control nodes in integrated circuit manufacturing — a case study.

Published in:

Quality & Reliability Engineering International, 1997, v. 13, n. 5, p. 269, doi. 10.1002/(SICI)1099-1638(199709/10)13:5<269::AID-QRE101>3.0.CO;2-H

By:

Prendergast, James G.;
Murphy, Eamonn;
Stephenson, Malcom

Publication type:

Article

A COMPARISON OF DETERMINISTIC AND STATISTICAL SAMPLING TECHNIQUES FOR QUALITY ANALYSIS OF INTEGRATED CIRCUITS.

Published in:

Quality & Reliability Engineering International, 1993, v. 9, n. 6, p. 489, doi. 10.1002/qre.4680090606

By:

Ilumoka, A. A.

Publication type:

Article

A COMPUTER-CONTROLLED ENVIRONMENTAL TEST SYSTEM FOR HIGH PIN-COUNT INTEGRATED CIRCUIT PACKAGES.

Published in:

Quality & Reliability Engineering International, 1993, v. 9, n. 2, p. 95, doi. 10.1002/qre.4680090206

By:

Barrett, John;
Donavan, John Ó.;
Hayes, Thomas;
Mathúna, Seán C. Ó.

Publication type:

Article

THE TEST NEEDS OF APPLICATION-SPECIFIC INTEGRATED CIRCUITS.

Published in:

Quality & Reliability Engineering International, 1986, v. 2, n. 3, p. 159, doi. 10.1002/qre.4680020305

By:

Davison, Chris

Publication type:

Article

An In-Depth Study of Ring Oscillator Reliability under Accelerated Degradation and Annealing to Unveil Integrated Circuit Usage.

Published in:

Micromachines, 2024, v. 15, n. 6, p. 769, doi. 10.3390/mi15060769

By:

Diaz-Fortuny, Javier;
Saraza-Canflanca, Pablo;
Bury, Erik;
Degraeve, Robin;
Kaczer, Ben

Publication type:

Article

A Fast Simulation Method for Evaluating the Single-Event Effect in Aerospace Integrated Circuits.

Published in:

Micromachines, 2023, v. 14, n. 10, p. 1887, doi. 10.3390/mi14101887

By:

Zhang, Xiaorui;
Liu, Yi;
Xu, Changqing;
Liao, Xinfang;
Chen, Dongdong;
Yang, Yintang

Publication type:

Article

Recent Progress in Physics-Based Modeling of Electromigration in Integrated Circuit Interconnects.

Published in:

Micromachines, 2022, v. 13, n. 6, p. 883, doi. 10.3390/mi13060883

By:

Zhao, Wen-Sheng;
Zhang, Rui;
Wang, Da-Wei

Publication type:

Article

Complex Network-Based Resilience Assessment of the Integrated Circuit Industry Chain.

Published in:

Sustainability (2071-1050), 2024, v. 16, n. 12, p. 5163, doi. 10.3390/su16125163

By:

Wang, Chuang;
Zhang, Tianyi;
Jia, Jing;
Wang, Jin;
Ren, Shan

Publication type:

Article

Knowledge Spillovers and Integrated Circuit Innovation Ecosystem Resilience: Evidence from China.

Published in:

Systems, 2024, v. 12, n. 10, p. 441, doi. 10.3390/systems12100441

By:

Zhou, Shiyu;
Xu, Xueguo;
Liu, Fengmei

Publication type:

Article

Widely Tunable (2.47–2.64 µm) Hybrid Laser Based on GaSb/GaInAsSb Quantum‐Wells and a Low‐Loss Si3N4 Photonic Integrated Circuit.

Published in:

Laser & Photonics Reviews, 2023, v. 17, n. 7, p. 1, doi. 10.1002/lpor.202201028

By:

Ojanen, Samu‐Pekka;
Viheriälä, Jukka;
Zia, Nouman;
Koivusalo, Eero;
Hilska, Joonas;
Tuorila, Heidi;
Guina, Mircea

Publication type:

Article

A 4H-SiC Bipolar Technology for High-Temperature Integrated Circuits.

Published in:

Journal of Microelectronic & Electronic Packaging, 2013, v. 10, n. 4, p. 155, doi. 10.4071/imaps.390

By:

Lanni, L.;
Malm, B. G.;
Zetterling, C. -M.;
Östling, M.

Publication type:

Article

DESA: a new hybrid global optimization method and its application to analog integrated circuit sizing.

Published in:

Journal of Global Optimization, 2009, v. 44, n. 1, p. 53, doi. 10.1007/s10898-008-9307-9

By:

Olenšek, Jernej;
Bűrmen, Árpád;
Puhan, Janez;
Tuma, Tadej

Publication type:

Article

Gamification for Teaching Integrated Circuit Processing in an Introductory VLSI Design Course.

Published in:

Education Sciences, 2024, v. 14, n. 8, p. 921, doi. 10.3390/educsci14080921

By:

Diéguez, Ángel;
Canals, Joan;
Moreno, Sergio;
Vilà, Anna

Publication type:

Article

Optimal Physical Implementation of Radiation Tolerant High-Speed Digital Integrated Circuits in Deep-Submicron Technologies.

Published in:

Electronics (2079-9292), 2019, v. 8, n. 4, p. 432, doi. 10.3390/electronics8040432

By:

Prinzie, Jeffrey;
Appels, Karel;
Kulis, Szymon

Publication type:

Article

Review of Polynomial Chaos-Based Methods for Uncertainty Quantification in Modern Integrated Circuits.

Published in:

Electronics (2079-9292), 2018, v. 7, n. 3, p. 30, doi. 10.3390/electronics7030030

By:

Kaintura, Arun;
Dhaene, Tom;
Spina, Domenico

Publication type:

Article

Surface wave communication-based wave guide design concerns for flip chip package-based integrated circuits with bump pitch sizes of 1.2 mm and above.

Published in:

Australian Journal of Electrical & Electronic Engineering, 2024, v. 21, n. 3, p. 301, doi. 10.1080/1448837X.2024.2323878

By:

Penna, Mahaveer;
J J, Jijesh

Publication type:

Article

Study on Hierarchical Dynamic Adjustment of Integrated Circuit Flow Based on Nonlinear Detection.

Published in:

Journal of Interconnection Networks, 2022, v. 22, n. Sup6, p. 1, doi. 10.1142/S0219265921480030

By:

Cheng, Lei;
Lu, Lin;
Bhola, Jyoti;
Butter, Ahmed Mateen

Publication type:

Article

Mixed Signal Integrated Circuit Design for Integrate-and-Fire Spiking Neurons.

Published in:

Circuits, Systems & Signal Processing, 2023, v. 42, n. 1, p. 27, doi. 10.1007/s00034-022-02131-2

By:

Jie, Zhang;
Baoquan, Yin

Publication type:

Article

Multislice imaging of integrated circuits by precession X-ray ptychography.

Published in:

Acta Crystallographica. Section A, Foundations & Advances, 2018, v. 74, n. 1, p. 66, doi. 10.1107/S205327331701525X

By:

Shimomura, Kei;
Hirose, Makoto;
Takahashi, Yukio

Publication type:

Article

3D-ACC：基于3D集成电路的卷积神经网络加速结构研究.

Published in:

Application Research of Computers / Jisuanji Yingyong Yanjiu, 2020, v. 37, n. 12, p. 3671, doi. 10.19734/j.issn.1001-3695.2019.08.0558

By:

王吉军;
郝子宇;
李宏亮

Publication type:

Article

High-efficiency broadband light coupling between optical fibers and photonic integrated circuits.

Published in:

Nanophotonics (21928606), 2018, v. 7, n. 12, p. 1845, doi. 10.1515/nanoph-2018-0075

By:

Son, Gyeongho;
Han, Seungjun;
Park, Jongwoo;
Kwon, Kyungmok;
Yu, Kyoungsik

Publication type:

Article

Highly integrated optical phased arrays: photonic integrated circuits for optical beam shaping and beam steering.

Published in:

Nanophotonics (21928606), 2017, v. 6, n. 1, p. 93, doi. 10.1515/nanoph-2015-0152

By:

Heck, Martijn J.R.

Publication type:

Article

The limits to upgrading and value capture in R&D global value chains: Indian and Chinese contract R&D firms in the integrated circuit design and pharmaceutical global value chains.

Published in:

Competition & Change, 2024, v. 28, n. 1, p. 144, doi. 10.1177/10245294231202417

By:

Fuller, Douglas B;
Ramirez, Paulina

Publication type:

Article

AN ANALYTICAL THERMAL MODEL FOR THE 3-D INTEGRATED CIRCUIT WITH NEW-TYPE THROUGH SILICON VIA.

Published in:

Thermal Science, 2023, v. 27, n. 3B, p. 2391, doi. 10.2298/TSCI220621140X

By:

XU, Zhao-Pei;
WANG, Kang-Jia

Publication type:

Article

THERMAL OPTIMIZATION OF A 3-D INTEGRATED CIRCUIT.

Published in:

Thermal Science, 2020, v. 24, n. 4, p. 2615, doi. 10.2298/TSCI2004615W

By:

Kang-Jia WANG;
Chu-Xia HUA;
Yan-Hong LIANG

Publication type:

Article

THERMAL MANAGEMENT OF THE HOTSPOTS IN 3-D INTEGRATED CIRCUITS.

Published in:

Thermal Science, 2018, v. 22, n. 4, p. 1685, doi. 10.2298/TSCI1804685W

By:

Kang-Jia Wang;
Hong-Chang Sun;
Cui-Ling Li;
Guo-Dong Wang;
Hong-Wei Zhu

Publication type:

Article