Microwave Flexible Electronics Directly Transformed from Foundry‐Produced, Multilayered Monolithic Integrated Circuits.
- Published in:
- Advanced Electronic Materials, 2022, v. 8, n. 7, p. 1, doi. 10.1002/aelm.202101350
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- Publication type:
- Article
Works matching Integrated circuits
Results: 5000
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Low-Power Current Integrating Flat-Passband Infinite Impulse Response Filter for Sensor Read-Out Integrated Circuit in 65-nm CMOS Technology.
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- Electronics (2079-9292), 2023, v. 12, n. 5, p. 1191, doi. 10.3390/electronics12051191
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- Publication type:
- Article
3
Test Planning for Core-based Integrated Circuits under Power Constraints.
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- Journal of Electronic Testing, 2017, v. 33, n. 1, p. 7, doi. 10.1007/s10836-016-5638-5
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- Article
4
Photonic Integrated Circuits for Passive Optical Networks: Outlook and Case Study of Integrated Quasi-Coherent Receiver.
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- Photonics, 2023, v. 10, n. 2, p. 182, doi. 10.3390/photonics10020182
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- Publication type:
- Article
5
A Neutrosophic Perspective on Enhancing Quality Virtual Simulation Experimental Education of Integrated Circuits: A New Approach.
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- Neutrosophic Sets & Systems, 2025, v. 80, p. 700
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- Publication type:
- Article
6
Correction Method for Power Analysis of Digital Integrated Circuits Based on Standard Cells.
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- Journal of Circuits, Systems & Computers, 2025, v. 34, n. 7, p. 1, doi. 10.1142/S0218126625501324
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- Article
7
INTELLECTUAL PROPERTY AND SECURITY IN THE INTEGRATED CIRCUITS INDUSTRY.
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- Strategies for Policy in Science & Education / Strategii na Obrazovatelnata i Nauchnata Politika, 2024, v. 32, p. 71, doi. 10.53656/str2024-1s-5-int
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8
Radiation-Hardened Design and Experimental Validation Using a Mixed-Stage Model for Reliability Assessment of Integrated Circuits in Radiation Environments.
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- Electronics (2079-9292), 2025, v. 14, n. 7, p. 1296, doi. 10.3390/electronics14071296
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- Article
9
A Gain-Enhanced Low Hardware Complexity Charge-Domain Read-Out Integrated Circuit Using a Sampled Charge Redistribution Technique.
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- Electronics (2079-9292), 2022, v. 11, n. 23, p. 3846, doi. 10.3390/electronics11233846
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10
Design of Three-Dimensional Virtual Simulation Experiment Platform for Integrated Circuit Course.
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- Electronics (2079-9292), 2022, v. 11, n. 9, p. N.PAG, doi. 10.3390/electronics11091437
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Integrated gate driver circuit technology with IGZO TFT for sensing operation.
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- Journal of the Society for Information Display, 2019, v. 27, n. 5, p. 313, doi. 10.1002/jsid.785
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- Article
12
Evaluation of the Potential Electromagnetic Interference in Vertically Stacked 3D Integrated Circuits.
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- Applied Sciences (2076-3417), 2020, v. 10, n. 3, p. 748, doi. 10.3390/app10030748
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- Article
13
Discussion on Improving Safety of Station Tracks Equipped with Integrated Track Circuits of High-speed Railways.
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- Railway Signalling & Communication Engineering, 2024, v. 21, n. 6, p. 13, doi. 10.3969/j.issn.1673-4440.2024.06.003
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14
站内ZPW-2000A一体化轨道电路低道床 适应性研究.
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- Railway Signalling & Communication Engineering, 2022, v. 19, n. 11, p. 1, doi. 10.3969/j.issn.1673-4440.2022.11.001
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- Article
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AN EQUIVALENT THERMAL CONDUCTIVITY MODEL OF THROUGH SILICON VIA ARRAYS FOR THERMAL ANALYSIS IN 3-D INTEGRATED CIRCUITS.
- Published in:
- Thermal Science, 2024, v. 28, n. 5B, p. 4081, doi. 10.2298/TSCI230919129X
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16
THERMAL MODELLING AND ANALYSIS OF 3-D INTEGRATED CIRCUITS WITH IRREGULAR STRUCTURE.
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- Thermal Science, 2023, v. 27, n. 5B, p. 4193, doi. 10.2298/TSCI220805061R
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- Article
17
THERMAL MODEL FOR 3-D INTEGRATED CIRCUITS WITH INTEGRATED MLGNR-BASED THROUGH SILICON VIA.
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- Thermal Science, 2020, v. 24, n. 3B, p. 2067, doi. 10.2298/TSCI180507321X
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- Article
18
THERMAL MANAGEMENT OF THE THROUGH SILICON VIAS IN 3-D INTEGRATED CIRCUITS.
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- Thermal Science, 2019, v. 23, n. 4, p. 2157, doi. 10.2298/TSCI1904157W
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- Article
19
Research on Analog Integrated Circuit Test Parameter Set Reduction Based on XGBoost.
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- Journal of Electronic Testing, 2022, v. 38, n. 3, p. 279, doi. 10.1007/s10836-022-06009-8
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- Publication type:
- Article
20
Simulated annealing‐based high‐level synthesis methodology for reliable and energy‐aware application specific integrated circuit designs with multiple supply voltages.
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- International Journal of Circuit Theory & Applications, 2023, v. 51, n. 10, p. 4897, doi. 10.1002/cta.3666
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- Publication type:
- Article
21
Integrated circuit design of a discrete memristive chaotic system optimized by the fixed-point specific processor with acceleration instructions.
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- Nonlinear Dynamics, 2024, v. 112, n. 12, p. 10451, doi. 10.1007/s11071-024-09624-6
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- Article
22
Using Variations in the Frequency of a Ring Oscillator to Measure the Thermal Resistance of Digital Integrated Circuits.
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- Measurement Techniques, 2018, v. 61, n. 2, p. 154, doi. 10.1007/s11018-018-1402-9
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- Article
23
Production Process Control Subsystem for Manufacture of Integrated Circuits.
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- Measurement Techniques, 2017, v. 60, n. 6, p. 529, doi. 10.1007/s11018-017-1227-y
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- Article
24
Knowledge Spillovers and Integrated Circuit Innovation Ecosystem Resilience: Evidence from China.
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- Systems, 2024, v. 12, n. 10, p. 441, doi. 10.3390/systems12100441
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- Article
25
Surface wave communication-based wave guide design concerns for flip chip package-based integrated circuits with bump pitch sizes of 1.2 mm and above.
- Published in:
- Australian Journal of Electrical & Electronic Engineering, 2024, v. 21, n. 3, p. 301, doi. 10.1080/1448837X.2024.2323878
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- Publication type:
- Article
26
Two-ways chip to chip communications through 2-dimensional photonic structures via photonic integrated circuit.
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- Optical & Quantum Electronics, 2023, v. 55, n. 7, p. 1, doi. 10.1007/s11082-023-04941-3
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- Publication type:
- Article
27
Designing low power and high contrast ratio all-optical NOT logic gate for using in optical integrated circuits.
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- Optical & Quantum Electronics, 2019, v. 51, n. 1, p. 1, doi. 10.1007/s11082-018-1715-6
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- Publication type:
- Article
28
Large-Scale Reconfigurable Integrated Circuits for Wideband Analog Photonic Computing.
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- Photonics, 2023, v. 10, n. 3, p. 300, doi. 10.3390/photonics10030300
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- Article
29
Key Technologies for THz Wireless Link by Silicon CMOS Integrated Circuits.
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- Photonics, 2018, v. 5, n. 4, p. 50, doi. 10.3390/photonics5040050
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30
Multislice imaging of integrated circuits by precession X-ray ptychography.
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- Acta Crystallographica. Section A, Foundations & Advances, 2018, v. 74, n. 1, p. 66, doi. 10.1107/S205327331701525X
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- Publication type:
- Article
31
A new source formulation for FDTD simulation of high-frequency integrated circuits with and without ground planes.
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- Microwave & Optical Technology Letters, 1997, v. 14, n. 6, p. 321, doi. 10.1002/(SICI)1098-2760(19970420)14:6<321::AID-MOP4>3.0.CO;2-K
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- Article
32
Surface-Wave Elimination in Integrated Circuit Structures with Artificial Periodic Materials.
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- Electromagnetics, 2000, v. 20, n. 2, p. 125, doi. 10.1080/027263400308311
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- Article
33
Study on Hierarchical Dynamic Adjustment of Integrated Circuit Flow Based on Nonlinear Detection.
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- Journal of Interconnection Networks, 2022, v. 22, n. Sup6, p. 1, doi. 10.1142/S0219265921480030
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- Article
34
Photonic Integrated Circuits for Communication Systems.
- Published in:
- Radioengineering, 2018, v. 27, n. 2, p. 357, doi. 10.13164/re.2018.0357
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- Article
35
Active Terahertz Modulator and Slow Light Metamaterial Devices with Hybrid Graphene–Superconductor Photonic Integrated Circuits.
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- Nanomaterials (2079-4991), 2021, v. 11, n. 11, p. 2999, doi. 10.3390/nano11112999
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- Publication type:
- Article
36
Fabrication of Low Cost and Low Temperature Poly-Silicon Nanowire Sensor Arrays for Monolithic Three-Dimensional Integrated Circuits Applications.
- Published in:
- Nanomaterials (2079-4991), 2020, v. 10, n. 12, p. 2488, doi. 10.3390/nano10122488
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- Publication type:
- Article
37
320×256 Readout Integrated Circuit for Infrared Focal Plane Arrays with Low-temperature MOSFET Model.
- Published in:
- IETE Journal of Research, 2011, v. 57, n. 6, p. 550, doi. 10.4103/0377-2063.92271
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38
Low-Leakage Double-Body MOSFET: A Promising Circuit-Level Technique for Deep-Submicron Analog Integrated Circuit Design.
- Published in:
- Journal of Circuits, Systems & Computers, 2024, v. 33, n. 8, p. 1, doi. 10.1142/S0218126624501421
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- Publication type:
- Article
39
An Integrated Circuit Based, Single-Inductor-Dual-Output Buck LED Driver for Dimmable and Color Temperature Tunable Indoor Lighting Application.
- Published in:
- Journal of Circuits, Systems & Computers, 2023, v. 32, n. 6, p. 1, doi. 10.1142/S0218126623501062
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- Publication type:
- Article
40
A Variability-Aware Robust Design Methodology for Integrated Circuits by Geometric Programming.
- Published in:
- Journal of Circuits, Systems & Computers, 2019, v. 28, n. 5, p. N.PAG, doi. 10.1142/S0218126619500737
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- Publication type:
- Article
41
A DIRECT SEARCH METHOD FOR WORST CASE ANALYSIS AND YIELD OPTIMIZATION OF INTEGRATED CIRCUITS.
- Published in:
- Journal of Circuits, Systems & Computers, 2009, v. 18, n. 7, p. 1185, doi. 10.1142/S0218126609005617
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- Article
42
Design and Analysis of 150° Bend SIW and Corrugated SIW Bandpass Filter with Multiple Transmission Zeroes Using Reactive Periodic Structures Suitable for Microwave Integrated Circuits (MICs).
- Published in:
- Wireless Personal Communications, 2018, v. 101, n. 1, p. 167, doi. 10.1007/s11277-018-5681-x
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- Publication type:
- Article
43
Heuristic Enz–Krummenacher–Vittoz (EKV) Model Fitting for Low-Power Integrated Circuit Design: An Open-Source Implementation.
- Published in:
- Electronics (2079-9292), 2025, v. 14, n. 6, p. 1162, doi. 10.3390/electronics14061162
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- Publication type:
- Article
44
Optimal Physical Implementation of Radiation Tolerant High-Speed Digital Integrated Circuits in Deep-Submicron Technologies.
- Published in:
- Electronics (2079-9292), 2019, v. 8, n. 4, p. 432, doi. 10.3390/electronics8040432
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- Publication type:
- Article
45
Review of Polynomial Chaos-Based Methods for Uncertainty Quantification in Modern Integrated Circuits.
- Published in:
- Electronics (2079-9292), 2018, v. 7, n. 3, p. 30, doi. 10.3390/electronics7030030
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- Publication type:
- Article
46
A Review of Carbon-Based Conductive Inks and Their Printing Technologies for Integrated Circuits.
- Published in:
- Coatings (2079-6412), 2023, v. 13, n. 10, p. 1769, doi. 10.3390/coatings13101769
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- Publication type:
- Article
47
A MOO-based Methodology for Designing 3D Stacked Integrated Circuits.
- Published in:
- Journal of Multi-Criteria Decision Analysis, 2014, v. 21, n. 1/2, p. 43, doi. 10.1002/mcda.1497
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- Publication type:
- Article
48
An Analytical Method to Calculate the Heat Flow and Temperatures Within the Structure of A VLSI Integrated Circuit.
- Published in:
- Journal of Active & Passive Electronic Devices, 2016, v. 11, n. 2/3, p. 143
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- Publication type:
- Article
49
Integrated Circuit Design for Radiation-Hardened Charge-Sensitive Amplifier Survived up to 2 Mrad.
- Published in:
- Sensors (14248220), 2020, v. 20, n. 10, p. 2765, doi. 10.3390/s20102765
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- Publication type:
- Article
50
Update of Single Event Effects Radiation Hardness Assurance of Readout Integrated Circuit of Infrared Image Sensors at Cryogenic Temperature.
- Published in:
- Sensors (14248220), 2018, v. 18, n. 7, p. 2338, doi. 10.3390/s18072338
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- Publication type:
- Article