Works matching Integrated Circuits

Results: 5000

Low-Power Current Integrating Flat-Passband Infinite Impulse Response Filter for Sensor Read-Out Integrated Circuit in 65-nm CMOS Technology.

Published in:

Electronics (2079-9292), 2023, v. 12, n. 5, p. 1191, doi. 10.3390/electronics12051191

By:

Jo, Sung-Hun

Publication type:

Article

Microwave Flexible Electronics Directly Transformed from Foundry‐Produced, Multilayered Monolithic Integrated Circuits.

Published in:

Advanced Electronic Materials, 2022, v. 8, n. 7, p. 1, doi. 10.1002/aelm.202101350

By:

Qin, Guoxuan;
Jung, Yei Hwan;
Zhang, Huilong;
Jiang, Ningyue;
Ma, Pingxi;
Stetson, Scott;
Racanelli, Marco;
Ma, Zhenqiang

Publication type:

Article

Radiation-Hardened Design and Experimental Validation Using a Mixed-Stage Model for Reliability Assessment of Integrated Circuits in Radiation Environments.

Published in:

Electronics (2079-9292), 2025, v. 14, n. 7, p. 1296, doi. 10.3390/electronics14071296

By:

Lee, Minwoong;
Lee, Namho;
Ki, Donghan;
Cho, Seongik

Publication type:

Article

A Gain-Enhanced Low Hardware Complexity Charge-Domain Read-Out Integrated Circuit Using a Sampled Charge Redistribution Technique.

Published in:

Electronics (2079-9292), 2022, v. 11, n. 23, p. 3846, doi. 10.3390/electronics11233846

By:

Jo, Sung-Hun

Publication type:

Article

Design of Three-Dimensional Virtual Simulation Experiment Platform for Integrated Circuit Course.

Published in:

Electronics (2079-9292), 2022, v. 11, n. 9, p. N.PAG, doi. 10.3390/electronics11091437

By:

Lai, Ziliang;
Cui, Yansong;
Zhao, Tonggang;
Wu, Qiang

Publication type:

Article

AN EQUIVALENT THERMAL CONDUCTIVITY MODEL OF THROUGH SILICON VIA ARRAYS FOR THERMAL ANALYSIS IN 3-D INTEGRATED CIRCUITS.

Published in:

Thermal Science, 2024, v. 28, n. 5B, p. 4081, doi. 10.2298/TSCI230919129X

By:

Zhao-Pei XU;
Kang-Jia WANG

Publication type:

Article

THERMAL MODELLING AND ANALYSIS OF 3-D INTEGRATED CIRCUITS WITH IRREGULAR STRUCTURE.

Published in:

Thermal Science, 2023, v. 27, n. 5B, p. 4193, doi. 10.2298/TSCI220805061R

By:

Xixin RAO;
Huizhong LIU;
Sai WANG;
Jianhao SONG;
Cheng JIN;
Chengdi XIAO

Publication type:

Article

THERMAL MODEL FOR 3-D INTEGRATED CIRCUITS WITH INTEGRATED MLGNR-BASED THROUGH SILICON VIA.

Published in:

Thermal Science, 2020, v. 24, n. 3B, p. 2067, doi. 10.2298/TSCI180507321X

By:

Peng XU;
Zhong-Liang PAN

Publication type:

Article

THERMAL MANAGEMENT OF THE THROUGH SILICON VIAS IN 3-D INTEGRATED CIRCUITS.

Published in:

Thermal Science, 2019, v. 23, n. 4, p. 2157, doi. 10.2298/TSCI1904157W

By:

WANG, Kang-Jia;
HUA, Chu-Xia;
SUN, Hong-Chang

Publication type:

Article

Integrated circuit design of a discrete memristive chaotic system optimized by the fixed-point specific processor with acceleration instructions.

Published in:

Nonlinear Dynamics, 2024, v. 112, n. 12, p. 10451, doi. 10.1007/s11071-024-09624-6

By:

Zhao, Yan;
Parastesh, Fatemeh;
He, Shaobo;
Fu, Longxiang;
Jafari, Sajad

Publication type:

Article

Research on Analog Integrated Circuit Test Parameter Set Reduction Based on XGBoost.

Published in:

Journal of Electronic Testing, 2022, v. 38, n. 3, p. 279, doi. 10.1007/s10836-022-06009-8

By:

Xiao, Yindong;
Zeng, Yutong;
Wu, Qiong;
Liu, Ke;
Li, Yanjun;
Hu, Chong

Publication type:

Article

Test Planning for Core-based Integrated Circuits under Power Constraints.

Published in:

Journal of Electronic Testing, 2017, v. 33, n. 1, p. 7, doi. 10.1007/s10836-016-5638-5

By:

SenGupta, Breeta;
Nikolov, Dimitar;
Ingelsson, Urban;
Larsson, Erik

Publication type:

Article

Correction Method for Power Analysis of Digital Integrated Circuits Based on Standard Cells.

Published in:

Journal of Circuits, Systems & Computers, 2025, v. 34, n. 7, p. 1, doi. 10.1142/S0218126625501324

By:

Li, Qunlin;
Lyu, Zejia;
Shen, Jizhong

Publication type:

Article

Evaluation of the Potential Electromagnetic Interference in Vertically Stacked 3D Integrated Circuits.

Published in:

Applied Sciences (2076-3417), 2020, v. 10, n. 3, p. 748, doi. 10.3390/app10030748

By:

Kapoor, Dipesh;
Tan, Cher Ming;
Sangwan, Vivek

Publication type:

Article

Integrated gate driver circuit technology with IGZO TFT for sensing operation.

Published in:

Journal of the Society for Information Display, 2019, v. 27, n. 5, p. 313, doi. 10.1002/jsid.785

By:

Kim, In June;
Noh, Seok;
Ban, Myung Ho;
Son, Kimin;
Han, Inhyo;
Shin, Hun Ki;
Oh, Kilhwan;
Kim, Bumsik;
Kang, In Byeong

Publication type:

Article

Photonic Integrated Circuits for Passive Optical Networks: Outlook and Case Study of Integrated Quasi-Coherent Receiver.

Published in:

Photonics, 2023, v. 10, n. 2, p. 182, doi. 10.3390/photonics10020182

By:

Rodrigues, Francisco;
Rodrigues, Carla;
Santos, João;
Rodrigues, Cláudio;
Teixeira, António

Publication type:

Article

Discussion on Improving Safety of Station Tracks Equipped with Integrated Track Circuits of High-speed Railways.

Published in:

Railway Signalling & Communication Engineering, 2024, v. 21, n. 6, p. 13, doi. 10.3969/j.issn.1673-4440.2024.06.003

By:

Li Jin

Publication type:

Article

站内ZPW-2000A一体化轨道电路低道床适应性研究.

Published in:

Railway Signalling & Communication Engineering, 2022, v. 19, n. 11, p. 1, doi. 10.3969/j.issn.1673-4440.2022.11.001

By:

邵嘉声

Publication type:

Article

A Neutrosophic Perspective on Enhancing Quality Virtual Simulation Experimental Education of Integrated Circuits: A New Approach.

Published in:

Neutrosophic Sets & Systems, 2025, v. 80, p. 700

By:

Lihua Dai;
Ben Wang;
Xuemin Cheng;
Junyi Xu;
Hao Wang

Publication type:

Article

INTELLECTUAL PROPERTY AND SECURITY IN THE INTEGRATED CIRCUITS INDUSTRY.

Published in:

Strategies for Policy in Science & Education / Strategii na Obrazovatelnata i Nauchnata Politika, 2024, v. 32, n. 1s, p. 71, doi. 10.53656/str2024-1s-5-int

By:

Nachev, Ivan;
Tomova, Yuliana;
Konstantinov, Iskren;
Spasova, Marina

Publication type:

Article

Simulated annealing‐based high‐level synthesis methodology for reliable and energy‐aware application specific integrated circuit designs with multiple supply voltages.

Published in:

International Journal of Circuit Theory & Applications, 2023, v. 51, n. 10, p. 4897, doi. 10.1002/cta.3666

By:

Dilek, Selma;
Tosun, Suleyman;
Cakin, Alperen

Publication type:

Article

Using Variations in the Frequency of a Ring Oscillator to Measure the Thermal Resistance of Digital Integrated Circuits.

Published in:

Measurement Techniques, 2018, v. 61, n. 2, p. 154, doi. 10.1007/s11018-018-1402-9

By:

Teten'kin, Ya. G.;
Sergeev, V. A.

Publication type:

Article

Production Process Control Subsystem for Manufacture of Integrated Circuits.

Published in:

Measurement Techniques, 2017, v. 60, n. 6, p. 529, doi. 10.1007/s11018-017-1227-y

By:

Lvovich, I.;
Lvovich, Ya.;
Preobrazhenskiy, A.;
Choporov, O.;
Saleev, D.

Publication type:

Article

Optimisation of test architecture in three‐dimensional stacked integrated circuits for partial stack/complete stack using hard system‐on‐chips.

Published in:

IET Computers & Digital Techniques (Wiley-Blackwell), 2015, v. 9, n. 5, p. 268, doi. 10.1049/iet-cdt.2014.0137

By:

Roy, Surajit Kumar;
Giri, Chandan;
Rahaman, Hafizur

Publication type:

Article

Heuristic Enz–Krummenacher–Vittoz (EKV) Model Fitting for Low-Power Integrated Circuit Design: An Open-Source Implementation.

Published in:

Electronics (2079-9292), 2025, v. 14, n. 6, p. 1162, doi. 10.3390/electronics14061162

By:

Dei, Michele

Publication type:

Article

60 Years from the Invention of the Integrated Circuits.

Published in:

Electrotehnica, Electronica, Automatica, 2018, v. 66, n. 3, p. 72

By:

LAKATOŞ, Eugen Ştefan

Publication type:

Article

Proper orthogonal decomposition-based reduced basis element thermal modeling of integrated circuits.

Published in:

International Journal for Numerical Methods in Engineering, 2017, v. 112, n. 5, p. 479, doi. 10.1002/nme.5529

By:

Meyer, Daniel S.;
Helenbrook, Brian T.;
Cheng, Ming‐C.

Publication type:

Article

Surface-Wave Elimination in Integrated Circuit Structures with Artificial Periodic Materials.

Published in:

Electromagnetics, 2000, v. 20, n. 2, p. 125, doi. 10.1080/027263400308311

By:

Yang, Hung-Yu David

Publication type:

Article

Predicting gate oxide reliability from statistical process control nodes in integrated circuit manufacturing — a case study.

Published in:

Quality & Reliability Engineering International, 1997, v. 13, n. 5, p. 269, doi. 10.1002/(SICI)1099-1638(199709/10)13:5<269::AID-QRE101>3.0.CO;2-H

By:

Prendergast, James G.;
Murphy, Eamonn;
Stephenson, Malcom

Publication type:

Article

A COMPARISON OF DETERMINISTIC AND STATISTICAL SAMPLING TECHNIQUES FOR QUALITY ANALYSIS OF INTEGRATED CIRCUITS.

Published in:

Quality & Reliability Engineering International, 1993, v. 9, n. 6, p. 489, doi. 10.1002/qre.4680090606

By:

Ilumoka, A. A.

Publication type:

Article

A COMPUTER-CONTROLLED ENVIRONMENTAL TEST SYSTEM FOR HIGH PIN-COUNT INTEGRATED CIRCUIT PACKAGES.

Published in:

Quality & Reliability Engineering International, 1993, v. 9, n. 2, p. 95, doi. 10.1002/qre.4680090206

By:

Barrett, John;
Donavan, John Ó.;
Hayes, Thomas;
Mathúna, Seán C. Ó.

Publication type:

Article

THE TEST NEEDS OF APPLICATION-SPECIFIC INTEGRATED CIRCUITS.

Published in:

Quality & Reliability Engineering International, 1986, v. 2, n. 3, p. 159, doi. 10.1002/qre.4680020305

By:

Davison, Chris

Publication type:

Article

3D-ACC：基于3D集成电路的卷积神经网络加速结构研究.

Published in:

Application Research of Computers / Jisuanji Yingyong Yanjiu, 2020, v. 37, n. 12, p. 3671, doi. 10.19734/j.issn.1001-3695.2019.08.0558

By:

王吉军;
郝子宇;
李宏亮

Publication type:

Article

A Review of Carbon-Based Conductive Inks and Their Printing Technologies for Integrated Circuits.

Published in:

Coatings (2079-6412), 2023, v. 13, n. 10, p. 1769, doi. 10.3390/coatings13101769

By:

Qin, Yufeng;
Ouyang, Xueqiong;
Lv, Yang;
Liu, Wencai;
Liu, Qing;
Wang, Shuangxi

Publication type:

Article

Complex Network-Based Resilience Assessment of the Integrated Circuit Industry Chain.

Published in:

Sustainability (2071-1050), 2024, v. 16, n. 12, p. 5163, doi. 10.3390/su16125163

By:

Wang, Chuang;
Zhang, Tianyi;
Jia, Jing;
Wang, Jin;
Ren, Shan

Publication type:

Article

AN ANALYTICAL THERMAL MODEL FOR THE 3-D INTEGRATED CIRCUIT WITH NEW-TYPE THROUGH SILICON VIA.

Published in:

Thermal Science, 2023, v. 27, n. 3B, p. 2391, doi. 10.2298/TSCI220621140X

By:

XU, Zhao-Pei;
WANG, Kang-Jia

Publication type:

Article

THERMAL OPTIMIZATION OF A 3-D INTEGRATED CIRCUIT.

Published in:

Thermal Science, 2020, v. 24, n. 4, p. 2615, doi. 10.2298/TSCI2004615W

By:

Kang-Jia WANG;
Chu-Xia HUA;
Yan-Hong LIANG

Publication type:

Article

THERMAL MANAGEMENT OF THE HOTSPOTS IN 3-D INTEGRATED CIRCUITS.

Published in:

Thermal Science, 2018, v. 22, n. 4, p. 1685, doi. 10.2298/TSCI1804685W

By:

Kang-Jia Wang;
Hong-Chang Sun;
Cui-Ling Li;
Guo-Dong Wang;
Hong-Wei Zhu

Publication type:

Article

INTEGRATED MICROCHANNEL COOLING IN A THREE DIMENSIONAL INTEGRATED CIRCUIT.

Published in:

Thermal Science, 2016, v. 20, n. 3, p. 899, doi. 10.2298/TSCI1603899W

By:

Kang-Jia WANG;
Zhong-Liang PAN

Publication type:

Article

An Analytical Method to Calculate the Heat Flow and Temperatures Within the Structure of A VLSI Integrated Circuit.

Published in:

Journal of Active & Passive Electronic Devices, 2016, v. 11, n. 2/3, p. 143

By:

LAKSHMINARAYANAN, V.;
SRIRAAM, N.

Publication type:

Article

A new source formulation for FDTD simulation of high-frequency integrated circuits with and without ground planes.

Published in:

Microwave & Optical Technology Letters, 1997, v. 14, n. 6, p. 321, doi. 10.1002/(SICI)1098-2760(19970420)14:6<321::AID-MOP4>3.0.CO;2-K

By:

Wang, Xudong;
Hwu, R. Jennifer

Publication type:

Article

Compact photonic crystal integrated circuit for all‐optical logic operation.

Published in:

IET Optoelectronics (Wiley-Blackwell), 2016, v. 10, n. 4, p. 142, doi. 10.1049/iet-opt.2015.0072

By:

Xavier, Susan Christina;
Carolin, B. Elizebeth;
Kabilan, Arunachalam P.;
Johnson, William

Publication type:

Article

The application of deep learning technology in integrated circuit design.

Published in:

Energy Informatics, 2024, v. 7, n. 1, p. 1, doi. 10.1186/s42162-024-00380-w

By:

Dai, Lihua;
Wang, Ben;
Cheng, Xuemin;
Wang, Qin;
Ni, Xinsen

Publication type:

Article

Low-Leakage Double-Body MOSFET: A Promising Circuit-Level Technique for Deep-Submicron Analog Integrated Circuit Design.

Published in:

Journal of Circuits, Systems & Computers, 2024, v. 33, n. 8, p. 1, doi. 10.1142/S0218126624501421

By:

Maryan, Mohammad Moradinezhad;
Azhari, Seyed Javad

Publication type:

Article

An Integrated Circuit Based, Single-Inductor-Dual-Output Buck LED Driver for Dimmable and Color Temperature Tunable Indoor Lighting Application.

Published in:

Journal of Circuits, Systems & Computers, 2023, v. 32, n. 6, p. 1, doi. 10.1142/S0218126623501062

By:

Bakshi, Biswadeep Gupta

Publication type:

Article

A Variability-Aware Robust Design Methodology for Integrated Circuits by Geometric Programming.

Published in:

Journal of Circuits, Systems & Computers, 2019, v. 28, n. 5, p. N.PAG, doi. 10.1142/S0218126619500737

By:

Zhang, Yi;
Zhou, Junlong;
Chen, Li;
Sun, Jin

Publication type:

Article

A DIRECT SEARCH METHOD FOR WORST CASE ANALYSIS AND YIELD OPTIMIZATION OF INTEGRATED CIRCUITS.

Published in:

Journal of Circuits, Systems & Computers, 2009, v. 18, n. 7, p. 1185, doi. 10.1142/S0218126609005617

By:

CIJAN, GREGOR;
TUMA, TADEJ;
BŰRMEN, ÁRPÁD

Publication type:

Article

Mixed Signal Integrated Circuit Design for Integrate-and-Fire Spiking Neurons.

Published in:

Circuits, Systems & Signal Processing, 2023, v. 42, n. 1, p. 27, doi. 10.1007/s00034-022-02131-2

By:

Jie, Zhang;
Baoquan, Yin

Publication type:

Article

Accurate Models for Evaluating the Direct Conducted and Radiated Emissions from Integrated Circuits.

Published in:

Applied Sciences (2076-3417), 2018, v. 8, n. 4, p. 477, doi. 10.3390/app8040477

By:

Capriglione, Domenico;
Chiariello, Andrea G.;
Maffucci, Antonio

Publication type:

Article

Towards Large-Scale Fast Reprogrammable SOA-Based Photonic Integrated Switch Circuits.

Published in:

Applied Sciences (2076-3417), 2017, v. 7, n. 9, p. 920, doi. 10.3390/app7090920

By:

Stabile, Ripalta

Publication type:

Article