Works matching IS 26733978 AND DT 2024 AND VI 5 AND IP 3
1
- Electronic Materials, 2024, v. 5, n. 3, p. 160, doi. 10.3390/electronicmat5030011
- Bai, Huiwen;
- Voyles, Richard M.;
- Nawrocki, Robert A.
- Article
2
- Electronic Materials, 2024, v. 5, n. 3, p. 166, doi. 10.3390/electronicmat5030012
- Kafle, Amrit P.;
- McKeown, David;
- Wong-Ng, Winnie;
- Alsubaie, Meznh;
- Alenezi, Manar;
- Pegg, Ian L.;
- Dutta, Biprodas
- Article
3
- Electronic Materials, 2024, v. 5, n. 3, p. 145, doi. 10.3390/electronicmat5030010
- Rafi, Jobair Al;
- Islam, Md. Ariful;
- Mahmud, Sayed;
- Honda, Mitsuhiro;
- Ichikawa, Yo;
- Athar Uddin, Muhammad
- Article
4
- Electronic Materials, 2024, v. 5, n. 3, p. 132, doi. 10.3390/electronicmat5030009
- Cioni, Marcello;
- Giorgino, Giovanni;
- Chini, Alessandro;
- Parisi, Antonino;
- Cappellini, Giacomo;
- Miccoli, Cristina;
- Castagna, Maria Eloisa;
- Tringali, Cristina;
- Iucolano, Ferdinando
- Article
5
- Electronic Materials, 2024, v. 5, n. 3, p. 101, doi. 10.3390/electronicmat5030008
- Wang, Jingyu;
- Yang, Bao;
- Jiang, Zhenyu;
- Liu, Yiping;
- Zhou, Licheng;
- Liu, Zejia;
- Tang, Liqun
- Article