Works matching IS 26733978 AND DT 2022 AND VI 3 AND IP 4
1
- Electronic Materials, 2022, v. 3, n. 4, p. 291, doi. 10.3390/electronicmat3040025
- Hourani, Wael;
- Rousselot, Christophe;
- N'Djoré, Kouamé Boko Joël-Igor;
- Billard, Alain;
- Arab Pour Yazdi, Mohammad;
- Makoudi, Younes
- Article
2
- Electronic Materials, 2022, v. 3, n. 4, p. 265, doi. 10.3390/electronicmat3040023
- Cruz, Bruna;
- Eschlwech, Philipp;
- Hani, Michael;
- Biebl, Erwin
- Article
3
- Electronic Materials, 2022, v. 3, n. 4, p. 344, doi. 10.3390/electronicmat3040028
- Boni, Georgia A.;
- Filip, Lucian D.;
- Radu, Cristian;
- Chirila, Cristina;
- Pasuk, Iuliana;
- Botea, Mihaela;
- Pintilie, Ioana;
- Pintilie, Lucian
- Article
4
- Electronic Materials, 2022, v. 3, n. 4, p. 281, doi. 10.3390/electronicmat3040024
- Lago, Nicolò;
- Buonomo, Marco;
- Prescimone, Federico;
- Toffanin, Stefano;
- Muccini, Michele;
- Cester, Andrea
- Article
5
- Electronic Materials, 2022, v. 3, n. 4, p. 357, doi. 10.3390/electronicmat3040029
- Vashishtha, Pargam;
- Prajapat, Pukhraj;
- Goswami, Lalit;
- Yadav, Aditya;
- Pandey, Akhilesh;
- Gupta, Govind
- Article
6
- Electronic Materials, 2022, v. 3, n. 4, p. 332, doi. 10.3390/electronicmat3040027
- Toe, May Zin;
- Tan, Wai Kian;
- Muto, Hiroyuki;
- Kawamura, Go;
- Matsuda, Atsunori;
- Yaacob, Khatijah Aisha Binti;
- Pung, Swee-Yong
- Article
7
- Electronic Materials, 2022, v. 3, n. 4, p. 301, doi. 10.3390/electronicmat3040026
- Article
