Works matching IS 25234447 AND DT 2024 AND VI 29 AND IP 3
1
- Microsystems, Electronics & Acoustics, 2024, v. 29, n. 3, p. 1, doi. 10.20535/2523-4455.mea.316127
- Lipkof, D. O.;
- Bondarenkos, O. F.
- Article
2
- Microsystems, Electronics & Acoustics, 2024, v. 29, n. 3, p. 1, doi. 10.20535/2523-4455.mea.314535
- Article
3
- Microsystems, Electronics & Acoustics, 2024, v. 29, n. 3, p. 1, doi. 10.20535/2523-4455.mea.309513
- Andrienkof, O. V.;
- Sydorenkof, S. B.;
- Maikut, S. O.;
- Tsybulsky, L. Yu.;
- Kuzmichevs, A. I.
- Article
4
- Microsystems, Electronics & Acoustics, 2024, v. 29, n. 3, p. 1, doi. 10.20535/2523-4455.mea.303929
- Mysiukf, Y. I.;
- Smachylof, Y. B.;
- Ilinf, O. V.;
- Bulavinets, T. B.;
- Yaremchuks, I. Y.
- Article