Co‐packaged datacenter optics: Opportunities and challenges.
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- IET Optoelectronics (Wiley-Blackwell), 2021, v. 15, n. 2, p. 77, doi. 10.1049/ote2.12020
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- Publication type:
- Article
Works matching IS 17518768 AND DT 2021 AND VI 15 AND IP 2
Results: 5
1
2
Guest editorial: IET optoelectronics—special issue on optical interconnects.
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- IET Optoelectronics (Wiley-Blackwell), 2021, v. 15, n. 2, p. 75, doi. 10.1049/ote2.12028
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- Article
3
Dithering‐based real‐time control of cascaded silicon photonic devices by means of non‐invasive detectors.
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- IET Optoelectronics (Wiley-Blackwell), 2021, v. 15, n. 2, p. 111, doi. 10.1049/ote2.12019
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- Article
4
Silicon circuits for chip‐to‐chip communications in multi‐socket server board interconnects.
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- IET Optoelectronics (Wiley-Blackwell), 2021, v. 15, n. 2, p. 102, doi. 10.1049/ote2.12018
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- Article
5
Electronic‐photonic board as an integration platform for Tb/s multi‐chip optical communication.
- Published in:
- IET Optoelectronics (Wiley-Blackwell), 2021, v. 15, n. 2, p. 92, doi. 10.1049/ote2.12017
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- Publication type:
- Article