Works matching IS 1674649X AND DT 2021 AND VI 35 AND IP 3


Results: 18
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    IGBT模块封装回流焊的应力翘曲分析.

    Published in:
    Journal of Xi'an Polytechnic University, 2021, v. 35, n. 3, p. 74, doi. 10.13338/j.issn.1674-649x.2021.03.011
    By:
    • 谈利鹏;
    • 佘陈慧;
    • 刘培生;
    • 徐鹏鹏;
    • 陶玉娟
    Publication type:
    Article
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    PPy/AC的制备工艺优化与性能表征.

    Published in:
    Journal of Xi'an Polytechnic University, 2021, v. 35, n. 3, p. 24, doi. 10.13338/j.issn.1674-649x.2021.03.004
    By:
    • 张 腾;
    • 李海红;
    • 韩豆豆
    Publication type:
    Article
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