Works matching IS 16714776 AND DT 2024 AND VI 61 AND IP 8

Results: 20

封装工艺对半导体激光器偏振特性的影响.

Published in:

Micronanoelectronic Technology, 2024, v. 61, n. 8, p. 1, doi. 10.13250/j.cnki.wndz.24080501

By:

沈牧;
房玉锁;
申正坤

Publication type:

Article

粒子群优化算法在 MEMS 压力传感器电桥电阻计算与零偏补偿中的应用.

Published in:

Micronanoelectronic Technology, 2024, v. 61, n. 8, p. 1, doi. 10.13250/j.cnki.wndz.24080401

By:

王帆;
王津津;
王伟忠;
杨拥军

Publication type:

Article

铜银合金纳米岛的可控制备及其量子点荧光增强性能.

Published in:

Micronanoelectronic Technology, 2024, v. 61, n. 8, p. 1, doi. 10.13250/j.cnki.wndz.24080303

By:

张简玙;
张健

Publication type:

Article

基于液滴反应器的图案化 ZnO 纳米棒阵列的合成和荧光检测性能.

Published in:

Micronanoelectronic Technology, 2024, v. 61, n. 8, p. 1, doi. 10.13250/j.cnki.wndz.24080302

By:

李思雨;
徐如意;
潘海林;
赵振杰;
李欣

Publication type:

Article

Ti 掺杂 SnS<sub>2</sub> 吸附气体分子的第一性原理研究.

Published in:

Micronanoelectronic Technology, 2024, v. 61, n. 8, p. 1, doi. 10.13250/j.cnki.wndz.24080301

By:

金永波;
李卫;
许巍;
任青颖;
李金泽

Publication type:

Article

基于原子体系人造晶格构建量子模拟器.

Published in:

Micronanoelectronic Technology, 2024, v. 61, n. 8, p. 1, doi. 10.13250/j.cnki.wndz.24080101

By:

商姊萌;
王博维;
韩伟华

Publication type:

Article

影响流延成型陶瓷素坯质量的因素.

Published in:

Micronanoelectronic Technology, 2024, v. 61, n. 8, p. 1, doi. 10.13250/j.cnki.wndz.24080009

By:

王贝;
刘林杰;
吴亚光;
张义政

Publication type:

Article

高温共烧陶瓷大深径比通孔填充工艺改良.

Published in:

Micronanoelectronic Technology, 2024, v. 61, n. 8, p. 1, doi. 10.13250/j.cnki.wndz.24080008

By:

刘曼曼;
淦作腾;
杨德明;
马栋栋;
程换丽;
王杰;
刘冰倩;
郭志伟

Publication type:

Article

激光加工氧化铝生瓷微结构制备方法.

Published in:

Micronanoelectronic Technology, 2024, v. 61, n. 8, p. 1, doi. 10.13250/j.cnki.wndz.24080007

By:

马栋栋;
淦作腾;
张鑫磊;
王杰;
程换丽;
刘曼曼

Publication type:

Article

高温共烧陶瓷封装外壳生瓷加工精度的控制.

Published in:

Micronanoelectronic Technology, 2024, v. 61, n. 8, p. 1, doi. 10.13250/j.cnki.wndz.24080011

By:

王灿;
淦作腾;
张世伟;
韩永年;
李庆民;
张家豪

Publication type:

Article

高温共烧陶瓷精细线条批量印刷工艺.

Published in:

Micronanoelectronic Technology, 2024, v. 61, n. 8, p. 1, doi. 10.13250/j.cnki.wndz.24080010

By:

王杰;
淦作腾;
马栋栋;
刘洋;
程换丽;
刘曼曼;
闫昭朴;
段强

Publication type:

Article

应用于陶瓷封装外壳镍层表面的自动化金丝焊接方法.

Published in:

Micronanoelectronic Technology, 2024, v. 61, n. 8, p. 1, doi. 10.13250/j.cnki.wndz.24080014

By:

吴兵硕;
刘旭;
张玉

Publication type:

Article

氨基磺酸镍镀层均一性与耐腐蚀性.

Published in:

Micronanoelectronic Technology, 2024, v. 61, n. 8, p. 1, doi. 10.13250/j.cnki.wndz.24080013

By:

张佳琦

Publication type:

Article

垂直电镀挂具对 TO 封装陶瓷外壳表面镀镍层厚度均匀性的影响.

Published in:

Micronanoelectronic Technology, 2024, v. 61, n. 8, p. 1, doi. 10.13250/j.cnki.wndz.24080012

By:

刘北元

Publication type:

Article

双面腔体结构的 HTCC 层压模具设计实现.

Published in:

Micronanoelectronic Technology, 2024, v. 61, n. 8, p. 1, doi. 10.13250/j.cnki.wndz.24080006

By:

程换丽;
淦作腾;
马栋栋;
王杰;
刘曼曼

Publication type:

Article

氧化铝陶瓷金属化的界面性能.

Published in:

Micronanoelectronic Technology, 2024, v. 61, n. 8, p. 1, doi. 10.13250/j.cnki.wndz.24080005

By:

淦作腾;
杨梦想;
刘林杰;
杨德明

Publication type:

Article

50 GHz 金锡封口 CQFN 外壳的研究及应用.

Published in:

Micronanoelectronic Technology, 2024, v. 61, n. 8, p. 1, doi. 10.13250/j.cnki.wndz.24080004

By:

左汉平;
王轲;
乔志壮

Publication type:

Article

一种带热沉结构的 100 Gbps 高速差分 BGA 一体化封装外壳.

Published in:

Micronanoelectronic Technology, 2024, v. 61, n. 8, p. 1, doi. 10.13250/j.cnki.wndz.24080003

By:

金浓;
左汉平;
周扬帆;
乔志壮

Publication type:

Article

氮化硅陶瓷的流延制备及性.

Published in:

Micronanoelectronic Technology, 2024, v. 61, n. 8, p. 1, doi. 10.13250/j.cnki.wndz.24080002

By:

刘思雨;
刘林杰;
张义政;
赵昱

Publication type:

Article

SiC 功率模块用氮化硅陶瓷 AMB 覆铜基板的研究进展.

Published in:

Micronanoelectronic Technology, 2024, v. 61, n. 8, p. 1, doi. 10.13250/j.cnki.wndz.24080001

By:

赵昱;
刘林杰;
吴亚光;
张义政;
刘思雨;
谢峥嵘

Publication type:

Article