Works matching IS 16065131 AND DT 2024 AND VI 63 AND IP 1

Coverage and reliability improvement of copper metallization layer in through hole at BGA area during load board manufacture.

Published in:

Reviews on Advanced Materials Science, 2024, v. 63, n. 1, p. 1, doi. 10.1515/rams-2023-0163

By:

• Zhu, Kai;
• Xing, Ruimin;
• Jiang, Zhongming;
• Zhong, Rongjun;
• Chen, Liuming;
• Liu, Jianhui;
• Miao, Hua;
• Zhou, Guoyun

Publication type:

Article