Works matching IS 15514897 AND DT 2024 AND VI 21 AND IP 4
1
- Journal of Microelectronic & Electronic Packaging, 2024, v. 21, n. 4, p. 86, doi. 10.4071/001c.127407
- Article
2
- Journal of Microelectronic & Electronic Packaging, 2024, v. 21, n. 4, p. 80, doi. 10.4071/001c.127403
- Kleinholz, Cathleen;
- Müller, Björn;
- Fischer, Michael;
- Dreissigacker, Marc;
- Nallaweg, Oliver;
- Tschoban, Christian;
- Becker, Karl-Friedrich;
- Schneider-Ramelow, Martin;
- M€uller, Jens
- Article
3
- Journal of Microelectronic & Electronic Packaging, 2024, v. 21, n. 4, p. 73, doi. 10.4071/001c.127390
- Rommel, Mathias;
- May, Alexander;
- Baier, Leander;
- Kauth, Julian;
- B€ottcher, Norman;
- Jank, Michael
- Article