Cold Sprayed Copper-Diamond Composites for Thermal Management of Semiconductor Packages.
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- Journal of Microelectronic & Electronic Packaging, 2024, v. 21, n. 3, p. 67, doi. 10.4071/001c.124091
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Works matching IS 15514897 AND DT 2024 AND VI 21 AND IP 3
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Design and Architecture De!nition for Advanced 3D Fan-Out Wafer-Level Packaging.
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- Journal of Microelectronic & Electronic Packaging, 2024, v. 21, n. 3, p. 59, doi. 10.4071/001c.124087
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