Works matching IS 15514897 AND DT 2023 AND VI 20 AND IP 1
Results: 4
Study on CPI Behaviors of X Dimension Fan-Out Integration (XDFOI) Packages.
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- Journal of Microelectronic & Electronic Packaging, 2023, v. 20, n. 1, p. 36, doi. 10.4071/imaps.1926257
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- Article
A Physics-of-Failure Investigation of Flip Chip Reliability Based on Lead-Free Solder Fatigue Modeling.
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- Journal of Microelectronic & Electronic Packaging, 2023, v. 20, n. 1, p. 27, doi. 10.4071/imaps.1939648
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- Article
Prevention of Cu Electrolytic Migration Defects on RDL by a Cu-Selective Passivation to Enhance Reliability.
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- Journal of Microelectronic & Electronic Packaging, 2023, v. 20, n. 1, p. 17, doi. 10.4071/imaps.1903845
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- Article
Electromigration Risk Assessment and Circuit Optimization Using Innovative Multiphysics Modeling.
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- Journal of Microelectronic & Electronic Packaging, 2023, v. 20, n. 1, p. 9, doi. 10.4071/imaps.1882247
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- Article