Works matching IS 15514897 AND DT 2021 AND VI 18 AND IP 3
Results: 5
Shear Strength Degradation Modeling of Lead-Free Solder Joints at Different Isothermal Aging Conditions.
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- Journal of Microelectronic & Electronic Packaging, 2021, v. 18, n. 3, p. 137, doi. 10.4071/imaps.1423793
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- Article
Thermal and Reliability Characterization of an Epoxy Resin-Based Double-Side Cooled Power Module.
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- Journal of Microelectronic & Electronic Packaging, 2021, v. 18, n. 3, p. 123, doi. 10.4071/imaps.1427774
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- Article
A SiC Double-Sided Stacked Wire-Bondless Power Module for High-Frequency Power Electronic Applications.
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- Journal of Microelectronic & Electronic Packaging, 2021, v. 18, n. 3, p. 113, doi. 10.4071/imaps.1426127
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- Article
Mechanical Properties and Interface Microstructure of SAC305 Solder Joints Made to a Ag-Pd-Pt Thick Film Metallization: Part 2--Isothermal Aging Effects.
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- Journal of Microelectronic & Electronic Packaging, 2021, v. 18, n. 3, p. 97, doi. 10.4071/imaps.1463995
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Mechanical Properties and Interface Microstructure of SAC305 Solder Joints Made to an Ag-Pd-Pt Thick Film Metallization: Part 1--Processing Effects.
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- Journal of Microelectronic & Electronic Packaging, 2021, v. 18, n. 3, p. 81, doi. 10.4071/imaps.1435232
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- Article