Works matching IS 15514897 AND DT 2019 AND VI 16 AND IP 2
Results: 5
Flexible PET Substrate for High-Definition Printing of Polymer Thick-Film Conductive Pastes.
- Published in:
- Journal of Microelectronic & Electronic Packaging, 2019, v. 16, n. 2, p. 103, doi. 10.4071/imaps.788036
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- Article
Head-on-Pillow Defect Detection: X-Ray Inspection Limitations.
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- Journal of Microelectronic & Electronic Packaging, 2019, v. 16, n. 2, p. 91, doi. 10.4071/imaps.871613
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- Article
Experimental Studies of Electronics Cooling Capabilities at High Altitude.
- Published in:
- Journal of Microelectronic & Electronic Packaging, 2019, v. 16, n. 2, p. 84, doi. 10.4071/imaps.871683
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- Article
Sixty Earth-Day Test of a Prototype Pt/HTCC Alumina Package in a Simulated Venus Environment.
- Published in:
- Journal of Microelectronic & Electronic Packaging, 2019, v. 16, n. 2, p. 78, doi. 10.4071/imaps.873073
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- Article
Recent Advances and Trends in Heterogeneous Integrations.
- Published in:
- Journal of Microelectronic & Electronic Packaging, 2019, v. 16, n. 2, p. 45, doi. 10.4071/imaps.780287
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- Article