Works matching IS 15514897 AND DT 2018 AND VI 15 AND IP 1
Results: 5
An Electronic Packaging Approach to Improving an Environmental Sensor and Sensing Technique.
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- Journal of Microelectronic & Electronic Packaging, 2018, v. 15, n. 1, p. 41, doi. 10.4071/imaps.526068
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- Article
Thermal Stability of Intermetallic Cu-Sn Interconnections for High Temperature Applications.
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- Journal of Microelectronic & Electronic Packaging, 2018, v. 15, n. 1, p. 35, doi. 10.4071/imaps.529384
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- Article
Thermal Performance Evaluation of a New Close-Coupled Cooling Solution including Cooling Failure Analysis.
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- Journal of Microelectronic & Electronic Packaging, 2018, v. 15, n. 1, p. 21, doi. 10.4071/imaps.528113
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- Article
Multichip Module Planarity Requirements Derived From Solder Surface Tension Models.
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- Journal of Microelectronic & Electronic Packaging, 2018, v. 15, n. 1, p. 9, doi. 10.4071/imaps.526636
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- Article
High-Precision Mixed-Signal Sensor Interface for a Wide Temperature Range [0-300°C].
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- Journal of Microelectronic & Electronic Packaging, 2018, v. 15, n. 1, p. 1, doi. 10.4071/imaps.523847
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- Article