Works matching IS 15514897 AND DT 2017 AND VI 14 AND IP 4
Results: 6
Evaluation of Printed-Circuit Board Materials for High-Temperature Operation.
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- Journal of Microelectronic & Electronic Packaging, 2017, v. 14, n. 4, p. 166, doi. 10.4071/imaps.516313
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- Article
An Advanced Extreme-Environment Wireless Telemetry System for Turbine Blade Instrumentation.
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- Journal of Microelectronic & Electronic Packaging, 2017, v. 14, n. 4, p. 158, doi. 10.4071/imaps.520648
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- Article
A Comparison Between Solders & Transient Liquid Phase Sintered Interconnects in High Temperature Multilayer Ceramic Capacitors.
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- Journal of Microelectronic & Electronic Packaging, 2017, v. 14, n. 4, p. 150, doi. 10.4071/imaps.522150
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- Article
Time-Efficient Sintering Processes to Attach Power Devices Using Nanosilver Dry Film.
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- Journal of Microelectronic & Electronic Packaging, 2017, v. 14, n. 4, p. 140, doi. 10.4071/imaps.521776
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- Article
Localized Laser Sintering of Metal Nanoparticle Inks Printed with Aerosol Jet® Technology for Flexible Electronics.
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- Journal of Microelectronic & Electronic Packaging, 2017, v. 14, n. 4, p. 132, doi. 10.4071/imaps.521797
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- Article
Fan-Out Wafer-Level Packaging (FOWLP) of Large Chip with Multiple Redistribution Layers (RDLs).
- Published in:
- Journal of Microelectronic & Electronic Packaging, 2017, v. 14, n. 4, p. 123, doi. 10.4071/imaps.522798
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- Article