Works matching IS 15514897 AND DT 2016 AND VI 13 AND IP 4
Results: 6
A PCB Environmental Sensor for Use in Monitoring Drought Conditions in Estuaries.
- Published in:
- Journal of Microelectronic & Electronic Packaging, 2016, v. 13, n. 4, p. 182, doi. 10.4071/imaps.523
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- Publication type:
- Article
Adaption of Functional Ceramic Materials for the Laser Sintering Process in Integrated Sensor Applications.
- Published in:
- Journal of Microelectronic & Electronic Packaging, 2016, v. 13, n. 4, p. 176, doi. 10.4071/imaps.515
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- Publication type:
- Article
The Design and Evaluation of an Integrated Wire Bond-less Power Module using a Low Temperature Co-fired Ceramic Interposer.
- Published in:
- Journal of Microelectronic & Electronic Packaging, 2016, v. 13, n. 4, p. 169, doi. 10.4071/imaps.514
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- Publication type:
- Article
Toward Integrated Pressure Sensors for Temperatures up to 600°C.
- Published in:
- Journal of Microelectronic & Electronic Packaging, 2016, v. 13, n. 4, p. 163, doi. 10.4071/imaps.522
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- Publication type:
- Article
Component Attachment with Pressureless Ag Sintering for 300°C Applications.
- Published in:
- Journal of Microelectronic & Electronic Packaging, 2016, v. 13, n. 4, p. 155, doi. 10.4071/imaps.524
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- Publication type:
- Article
Extended High-Temperature Operation of Silicon Carbide CMOS Circuits for Venus Surface Application.
- Published in:
- Journal of Microelectronic & Electronic Packaging, 2016, v. 13, n. 4, p. 143, doi. 10.4071/imaps.527
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- Publication type:
- Article