Works matching IS 15514897 AND DT 2016 AND VI 13 AND IP 3
Results: 7
Thick Film Process Characterization for Thin Film Metallized LTCC.
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- Journal of Microelectronic & Electronic Packaging, 2016, v. 13, n. 3, p. 136, doi. 10.4071/imaps.512
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- Article
Design and Demonstration of Fine-Pitch and High-Speed Redistribution Layers for Panel-Based Glass Interposers at 40-µm Bump Pitch.
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- Journal of Microelectronic & Electronic Packaging, 2016, v. 13, n. 3, p. 128, doi. 10.4071/imaps.504
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- Article
Impact of Metallurgical and Mechanical Properties of Sintered Silver Joints on Die-Attach Reliability of High-Temperature Power Modules.
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- Journal of Microelectronic & Electronic Packaging, 2016, v. 13, n. 3, p. 121, doi. 10.4071/imaps.506
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- Article
Additive Manufacturing Design and Fabrication of Ceramic Cylindrical Ion Trap Mass Analyzer Chips for Miniaturized Mass Spectrometer Smart-Device (Internet of Things) Applications.
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- Journal of Microelectronic & Electronic Packaging, 2016, v. 13, n. 3, p. 113, doi. 10.4071/imaps.517
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High-Permittivity and Low-Loss Electromagnetic Composites Based on Co-fired Ba<sub>0.55</sub>Sr<sub>0.45</sub>TiO<sub>3</sub> or MgCaTiO<sub>2</sub> Microfillers for Additive Manufacturing and Their Application to 3-D Printed K-Band Antennas.
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- Journal of Microelectronic & Electronic Packaging, 2016, v. 13, n. 3, p. 102, doi. 10.4071/imaps.509
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- Article
Thermodynamic Analysis of Physical Vapor Deposited Inorganic Thin Films on Low Temperature Cofired Ceramic.
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- Journal of Microelectronic & Electronic Packaging, 2016, v. 13, n. 3, p. 95, doi. 10.4071/imaps.518
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- Article
Round-Robin of High-Frequency Test Methods by IPC-D24C Task Group.
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- Journal of Microelectronic & Electronic Packaging, 2016, v. 13, n. 3, p. 77, doi. 10.4071/imaps.508
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- Article