Works matching IS 15514897 AND DT 2016 AND VI 13 AND IP 2
Results: 5
Packaging Architecture for an Implanted System that Monitors Brain Activity and Applies Therapeutic Stimulation.
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- Journal of Microelectronic & Electronic Packaging, 2016, v. 13, n. 2, p. 64, doi. 10.4071/imaps.499
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- Article
A New In-Line Laser-Based Acoustic Technique for Pillar Bump Metrology.
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- Journal of Microelectronic & Electronic Packaging, 2016, v. 13, n. 2, p. 58, doi. 10.4071/imaps.501
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- Article
Modeling, Design, Fabrication, and Characterization of Ultra-High Bandwidth 3-D Glass Photonic Substrates.
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- Journal of Microelectronic & Electronic Packaging, 2016, v. 13, n. 2, p. 51, doi. 10.4071/imaps.502
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- Article
Development of an SiC Multichip Phase-Leg Module for High-Temperature and High-Frequency Applications.
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- Journal of Microelectronic & Electronic Packaging, 2016, v. 13, n. 2, p. 39, doi. 10.4071/imaps.503
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- Article
Heterogeneous Integration of a 300-mm Silicon Photonics-CMOS Wafer Stack by Direct Oxide Bonding and Via-Last 3-D Interconnection.
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- Journal of Microelectronic & Electronic Packaging, 2016, v. 13, n. 2, p. 71, doi. 10.4071/imaps.494
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- Article