Works matching IS 15514897 AND DT 2014 AND VI 11 AND IP 1
Results: 7
Effects of Copper Pattern Density and Orientation on the Modulus of BGA Substrates.
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- Journal of Microelectronic & Electronic Packaging, 2014, v. 11, n. 1, p. 36, doi. 10.4071/imaps.404
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- Article
Mechanical Stress Analyses of Packaged Pressure Sensors for Very High Temperatures.
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- Journal of Microelectronic & Electronic Packaging, 2014, v. 11, n. 1, p. 30, doi. 10.4071/imaps.399
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- Article
Reliability of SiC Digital Telemetry Circuits on AlN Substrate.
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- Journal of Microelectronic & Electronic Packaging, 2014, v. 11, n. 1, p. 25, doi. 10.4071/imaps.397
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- Article
Redistribution Layers (RDLs) for 2.5D/3D IC Integration.
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- Journal of Microelectronic & Electronic Packaging, 2014, v. 11, n. 1, p. 16, doi. 10.4071/imaps.406
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- Article
LT-TLPS Die Attach for High Temperature Electronic Packaging.
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- Journal of Microelectronic & Electronic Packaging, 2014, v. 11, n. 1, p. 7, doi. 10.4071/imaps.394
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- Article
Void Formation and Bond Strength Investigated for Wafer-Level Cu-Sn Solid-Liquid Interdiffusion (SLID) Bonding.
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- Journal of Microelectronic & Electronic Packaging, 2014, v. 11, n. 1, p. 1, doi. 10.4071/imaps.408
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- Article
Ultra Low Weight Spacer for PCB to PCB Interconnections.
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- Journal of Microelectronic & Electronic Packaging, 2014, v. 11, n. 1, p. 42, doi. 10.4071/imaps.396
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- Article