Works matching IS 15514897 AND DT 2010 AND VI 7 AND IP 4
Results: 7
Analysis of Refrigeration Requirements of Digital Processors in Subambient Temperatures.
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- Journal of Microelectronic & Electronic Packaging, 2010, v. 7, n. 4, p. 197, doi. 10.4071/imaps.257
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- Article
A Multistep Process for Thinning Individual Die to sub-35 μm Thickness.
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- Journal of Microelectronic & Electronic Packaging, 2010, v. 7, n. 4, p. 189, doi. 10.4071/imaps.256
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- Article
The LTCC Chip for Electrochemical Measurement of DNA Concentration.
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- Journal of Microelectronic & Electronic Packaging, 2010, v. 7, n. 4, p. 220, doi. 10.4071/imaps.278
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- Article
Inkjet Printing of Fine-Line Thick-Film Inductors.
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- Journal of Microelectronic & Electronic Packaging, 2010, v. 7, n. 4, p. 205, doi. 10.4071/imaps.258
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- Article
Advanced SiP Packaging Technologies of IPD for Mobile Applications.
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- Journal of Microelectronic & Electronic Packaging, 2010, v. 7, n. 4, p. 223, doi. 10.4071/imaps.267
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- Article
Application of a Flow Optimizer in a Limited Space to Increase Series Fan Performance.
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- Journal of Microelectronic & Electronic Packaging, 2010, v. 7, n. 4, p. 181, doi. 10.4071/imaps.255
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- Article
Using Permanent and Temporary Polyimide Adhesives in 3D-TSV Processing to Avoid Thin Wafer Handling.
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- Journal of Microelectronic & Electronic Packaging, 2010, v. 7, n. 4, p. 214, doi. 10.4071/imaps.260
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- Article