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GE SiC Semiconductor Device Operation at Extreme Temperatures.
- Published in:
- Journal of Microelectronic & Electronic Packaging, 2022, v. 19, n. 3, p. 83, doi. 10.4071/imaps.1531475
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- Publication type:
- Article
Numerical Simulation on the Warpage of Reconstructed Wafer During Encapsulation Process.
- Published in:
- Journal of Microelectronic & Electronic Packaging, 2022, v. 19, n. 3, p. 89, doi. 10.4071/imaps.1721531
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- Publication type:
- Article
Atomistic Modeling to Predict and Improve the Strength of Doped Sn-Cu Solder Interfaces.
- Published in:
- Journal of Microelectronic & Electronic Packaging, 2022, v. 19, n. 3, p. 95, doi. 10.4071/imaps.1803272
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- Publication type:
- Article