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Process Optimization and Implementation of Online Monitoring Process in the Transfer Molding for Electronic Packaging.
- Published in:
- Journal of Microelectronic & Electronic Packaging, 2019, v. 16, n. 4, p. 157, doi. 10.4071/imaps.954402
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- Article
Stackable SiC-Embedded Ceramic Packages for High-Voltage and High-Temperature Power Electronic Applications.
- Published in:
- Journal of Microelectronic & Electronic Packaging, 2019, v. 16, n. 4, p. 176, doi. 10.4071/imaps.952440
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- Publication type:
- Article
Rapid and Localized Soldering Using Reactive Films for Electronic Applications.
- Published in:
- Journal of Microelectronic & Electronic Packaging, 2019, v. 16, n. 4, p. 182, doi. 10.4071/imaps.955217
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- Publication type:
- Article
Fabrication of Highly Reliable Joint Based on Cu/Ni/Sn Double-Layer Powder for High Temperature Application.
- Published in:
- Journal of Microelectronic & Electronic Packaging, 2019, v. 16, n. 4, p. 188, doi. 10.4071/imaps.960671
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- Article