Found: 6
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Optical Beam Propagation and Ray Tracing Simulation of Interruption-Free Asymmetric Multimode Bus Couplers.
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- Journal of Microelectronic & Electronic Packaging, 2017, v. 14, n. 1, p. 1, doi. 10.4071/imaps.530
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- Article
Electrical Performance of a 32-I/O HTCC Alumina Package for High-Temperature Microelectronics.
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- Journal of Microelectronic & Electronic Packaging, 2017, v. 14, n. 1, p. 11, doi. 10.4071/imaps.529
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- Article
A Resistive GaN-HEMT Mixer for a Cable Modem Operable up to 250°C for Downhole Communications.
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- Journal of Microelectronic & Electronic Packaging, 2017, v. 14, n. 1, p. 17, doi. 10.4071/imaps.526
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- Article
Proposal of Ultrafine and High Reliable Trench Wiring Process for Organic Interposer.
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- Journal of Microelectronic & Electronic Packaging, 2017, v. 14, n. 1, p. 26, doi. 10.4071/imaps.348184
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- Article
Addressing Flux Dip Challenges for 3-D Integrated Large Die, Ultrafine Pitch Interconnect.
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- Journal of Microelectronic & Electronic Packaging, 2017, v. 14, n. 1, p. 32, doi. 10.4071/imaps.348081
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- Article
Temporary Wafer Bonding Materials with Mechanical and Laser Debonding Technologies for Semiconductor Device Processing.
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- Journal of Microelectronic & Electronic Packaging, 2017, v. 14, n. 1, p. 39, doi. 10.4071/imaps.349121
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- Article