Works matching IS 15370755 AND DT 2025 AND VI 27 AND IP 1

Results: 27

MICROSCOPY & MICROANALYSIS MEETING 2025.

Published in:: Electronic Device Failure Analysis, 2025, v. 27, n. 1, p. 52
Publication type:: Article

TRAINING CALENDAR.

Published in:

Electronic Device Failure Analysis, 2025, v. 27, n. 1, p. 50

By:

Ring, Rosalinda M.

Publication type:

Article

PRODUCT NEWS.

Published in:

2025

By:

Kolasa, Ted

Publication type:

Product Review

Peer Reviewed Literature of Interest to Failure Analysis: Cornucopia of reliability, 3D, package, sample prep, system level, AI, quantum computing, security, reverse engineering, processing, and novel materials.

Published in:

2025

By:

Bruce, Michael R.

Publication type:

Literature Review

2025 EDFAS AWARDS.

Published in:: Electronic Device Failure Analysis, 2025, v. 27, n. 1, p. 41
Publication type:: Article

SPOTLIGHT ON TUTORIALS.

Published in:

Electronic Device Failure Analysis, 2025, v. 27, n. 1, p. 46

By:

Asadi, Navid

Publication type:

Article

FIB SEM 2024: 16TH ANNUAL MEETING.

Published in:

Electronic Device Failure Analysis, 2025, v. 27, n. 1, p. 44

By:

DiBattista, Michael

Publication type:

Article

EDFAS BOARD OF DIRECTORS REPORT.

Published in:

Electronic Device Failure Analysis, 2025, v. 27, n. 1, p. 43

By:

Richardson, Chris

Publication type:

Article

ESREF 2025.

Published in:: Electronic Device Failure Analysis, 2025, v. 27, n. 1, p. 41
Publication type:: Article

IRPS 2025.

Published in:: Electronic Device Failure Analysis, 2025, v. 27, n. 1, p. 41
Publication type:: Article

DIRECTORY OF INDEPENDENT FA PROVIDERS.

Published in:

Electronic Device Failure Analysis, 2025, v. 27, n. 1, p. 45

By:

Ring, Rosalinda M.

Publication type:

Article

EDFAS AWARD WINNERS: RECOGNIZING INDUSTRY PIONEERS AND LEADERS.

Published in:

Electronic Device Failure Analysis, 2025, v. 27, n. 1, p. 40

By:

Beaudoin, Felix

Publication type:

Article

ISTFA 2024 SYSTEM IN PACKAGE (SIP) USER GROUP.

Published in:

Electronic Device Failure Analysis, 2025, v. 27, n. 1, p. 39

By:

Zhiyong Wang;
Tanukonda, Chandu;
O'Sullivan, Jer

Publication type:

Article

ISTFA 2024 SAMPLE PREP USER GROUP.

Published in:

Electronic Device Failure Analysis, 2025, v. 27, n. 1, p. 38

By:

Colvin, Jim;
Bonifacio, Cecile;
Germanicus, Rosine Coq;
Tracy, Bryan;
Bakken, Nathan

Publication type:

Article

ISTFA 2024 OPTICAL FAULT ISOLATION (OFI), TEST, AND DIAGNOSTICS USER GROUP.

Published in:

Electronic Device Failure Analysis, 2025, v. 27, n. 1, p. 37

By:

Bockelman, Dan;
Bodoh, Dan;
Distelhurst, Kevin

Publication type:

Article

ISTFA 2024 NANOPROBING AND SPM USER GROUP.

Published in:

Electronic Device Failure Analysis, 2025, v. 27, n. 1, p. 37

By:

Johnson, Greg;
Antoniou, Nicholas;
Lockledge, Scott P.

Publication type:

Article

ISTFA 2024 FOCUSED ION BEAM (FIB) USER GROUP.

Published in:

Electronic Device Failure Analysis, 2025, v. 27, n. 1, p. 36

By:

Brogden, Valerie;
Herschbein, Steve;
Wong, Michael;
Principe, Edward

Publication type:

Article

ISTFA 2024 ARTIFICIAL INTELLIGENCE (AI) IN FAILURE ANALYSIS USER GROUP.

Published in:

Electronic Device Failure Analysis, 2025, v. 27, n. 1, p. 35

By:

Hoffrogge, Peter;
Rodgers, Thomas;
Schekotihin, Konstantin;
Brand, Sebastian;
Felux, Florian

Publication type:

Article

ISTFA 2024 USER GROUP HIGHLIGHTS.

Published in:

Electronic Device Failure Analysis, 2025, v. 27, n. 1, p. 35

By:

Dahanayaka, Daminda;
Liao, Joy;
Madan, Anita

Publication type:

Article

A SUMMARY OF THE ISTFA 2024 PANEL DISCUSSION: AI APPLICATIONS IN FAILURE ANALYSIS.

Published in:

Electronic Device Failure Analysis, 2025, v. 27, n. 1, p. 33

By:

Kolasa, Ted;
Johnson, Greg

Publication type:

Article

WEFA 2024 ISTFA LUNCH SESSION RECAP.

Published in:

Electronic Device Failure Analysis, 2025, v. 27, n. 1, p. 32

By:

Sampath, Amrutha;
Parente, Renee;
Poehlmann, Sarah

Publication type:

Article

ISTFA/2024.

Published in:: Electronic Device Failure Analysis, 2025, v. 27, n. 1, p. 30
Publication type:: Article

ISTFA 2024 HIGHLIGHTS.

Published in:

Electronic Device Failure Analysis, 2025, v. 27, n. 1, p. 28, doi. 10.31399/asm.edfa.2025-1.p028

By:

Yan Li

Publication type:

Article

QUANTUM DIAMOND MICROSCOPY FOR SEMICONDUCTOR FAILURE ANALYSIS.

Published in:

Electronic Device Failure Analysis, 2025, v. 27, n. 1, p. 18, doi. 10.31399/asm.edfa.2025-1.p018

By:

Garsi, Marwa;
Welscher, Andreas;
Schrimpf, Manuel;
Bisgin, Bartu;
Hanke, Michael;
Gieser, Horst;
Zahn, Daniela;
Bruckmaier, Fleming

Publication type:

Article

LOW FREQUENCY NOISE SPECTROSCOPY: A POWERFUL DIAGNOSTIC TOOL FOR TRAP IDENTIFICATION IN ACTIVE AND PASSIVE COMPONENTS.

Published in:

Electronic Device Failure Analysis, 2025, v. 27, n. 1, p. 8, doi. 10.31399/asm.edfa.2025-1.p008

By:

Cretu, B.;
Tahiat, A.;
Germanicus, R. Coq;
Bezerra, F.;
Bunel, C.;
Veloso, A.;
Simoen, E.

Publication type:

Article

FULL CHIP BACKSIDE DELAYERING OF 10 nm NODE INTEGRATED CIRCUITS WITH CHEMICALLY ASSISTED FOCUSED ION BEAM DEPROCESSING.

Published in:

Electronic Device Failure Analysis, 2025, v. 27, n. 1, p. 3, doi. 10.31399/asm.edfa.2025-1.p003

By:

DiBattista, Michael;
Chivas, Robert;
Yazdi, Ata Tafazoli;
Sheeder, Jonathan;
Silverman, Scott

Publication type:

Article

ELECTRONICS INDUSTRY GETS GOVERNMENT ATTENTION.

Published in:

2025

By:

Vardaman, E. Jan

Publication type:

Editorial