IN MEMORIAM.
- Published in:
- 2024
- Publication type:
- Obituary
Works matching IS 15370755 AND DT 2024 AND VI 26 AND IP 3
Results: 13
1
2
EDFAS' ROLE AND RECENT PROGRESS IN CULTIVATING FUTURE LEADERS.
- Published in:
- Electronic Device Failure Analysis, 2024, v. 26, n. 3, p. 50, doi. 10.31399/asm.edfa.2024-3.p050
- By:
- Publication type:
- Article
3
TRAINING CALENDAR.
- Published in:
- 2024
- By:
- Publication type:
- Calendar
4
PRODUCT NEWS.
- Published in:
- 2024
- By:
- Publication type:
- Product Review
5
Peer-Reviewed Literature of Interest to Failure Analysis: Optics, optical techniques and fault isolation, photonics, solar, photovoltaics, and LEDs.
- Published in:
- Electronic Device Failure Analysis, 2024, v. 26, n. 3, p. 44
- By:
- Publication type:
- Article
6
DIRECTORY OF INDEPENDENT FA PROVIDERS.
- Published in:
- Electronic Device Failure Analysis, 2024, v. 26, n. 3, p. 42
- By:
- Publication type:
- Article
7
INTERNET RESOURCES: FOR ENGINEERING.
- Published in:
- Electronic Device Failure Analysis, 2024, v. 26, n. 3, p. 41
- By:
- Publication type:
- Article
8
SPOTLIGHT ON TUTORIALS.
- Published in:
- Electronic Device Failure Analysis, 2024, v. 26, n. 3, p. 40
- By:
- Publication type:
- Article
9
ISTFA 2024 PREVIEW: 50TH ANNIVERSARY.
- Published in:
- Electronic Device Failure Analysis, 2024, v. 26, n. 3, p. 35
- By:
- Publication type:
- Article
10
RELIABILITY AND OPTIMIZATION OF WIRE BONDING IN POWER MICROELECTRONIC DEVICES.
- Published in:
- Electronic Device Failure Analysis, 2024, v. 26, n. 3, p. 28, doi. 10.31399/asm.edfa.2024-3.p028
- By:
- Publication type:
- Article
11
ASSESSING COMPATIBILITY OF ADVANCED IC PACKAGES TO X-RAY BASED PHYSICAL INSPECTION.
- Published in:
- Electronic Device Failure Analysis, 2024, v. 26, n. 3, p. 14, doi. 10.31399/asm.edfa.2024-3.p014
- By:
- Publication type:
- Article
12
NONDESTRUCTIVE DEFECT DETECTION IN 3D X-RAY MICROSCOPY DATA OF BALL GRID ARRAY SOLDER FOR VOID DETECTION IN SOLDER JOINTS USING DEEP LEARNING.
- Published in:
- Electronic Device Failure Analysis, 2024, v. 26, n. 3, p. 4, doi. 10.31399/asm.edfa.2024-3.p004
- By:
- Publication type:
- Article
13
DEMAND FOR AI COMPUTING WILL SHAPE FA COMMUNITY.
- Published in:
- Electronic Device Failure Analysis, 2024, v. 26, n. 3, p. 2, doi. 10.31399/asm.edfa.2024-3.p002
- By:
- Publication type:
- Article