Works matching IS 15370755 AND DT 2020 AND VI 22 AND IP 4

Results: 69

3D PRINTSHOP.

Published in:: Electronic Device Failure Analysis, 2020, v. 22, n. 4, p. 64
Publication type:: Article

Edward J. Kubel, Jr.

Published in:: 2020
Publication type:: Obituary

Persson Heads Up Berkeley's Molecular Foundry.

Published in:: Electronic Device Failure Analysis, 2020, v. 22, n. 4, p. 61
Publication type:: Article

Johnson Earns DOE Prize.

Published in:: Electronic Device Failure Analysis, 2020, v. 22, n. 4, p. 62
Publication type:: Article

Brandywine Valley Hosts Dr. Gray.

Published in:: Electronic Device Failure Analysis, 2020, v. 22, n. 4, p. 61
Publication type:: Article

Tillack Honored by AWS.

Published in:: Electronic Device Failure Analysis, 2020, v. 22, n. 4, p. 61
Publication type:: Article

Canada-Wide Virtual Event.

Published in:: Electronic Device Failure Analysis, 2020, v. 22, n. 4, p. 61
Publication type:: Article

EMERGING PROFESSIONALS: Resources on ASM Connect.

Published in:

Electronic Device Failure Analysis, 2020, v. 22, n. 4, p. 60

By:

Frerichs, Andrew

Publication type:

Article

WOMEN IN ENGINEERING.

Published in:

2020

By:

Perepezko, Elizabeth

Publication type:

Interview

MD CORNER.

Published in:

Electronic Device Failure Analysis, 2020, v. 22, n. 4, p. 57

By:

Aderhold, Ron

Publication type:

Article

FROM THE FOUNDATION.

Published in:

Electronic Device Failure Analysis, 2020, v. 22, n. 4, p. 59

By:

Daehn, Glenn S.

Publication type:

Article

ASM Data Ecosystem Initiative.

Published in:

Electronic Device Failure Analysis, 2020, v. 22, n. 4, p. 58

By:

Fryan, Ray

Publication type:

Article

HTS MEMBERS NAMED 2020 ASM AWARDEES AND FELLOWS.

Published in:: Electronic Device Failure Analysis, 2020, v. 22, n. 4, p. 42
Publication type:: Article

FROM THE PRESIDENT'S DESK.

Published in:

Electronic Device Failure Analysis, 2020, v. 22, n. 4, p. 56

By:

Zi-Kui Liu

Publication type:

Article

GIBBS AWARD.

Published in:: Electronic Device Failure Analysis, 2020, v. 22, n. 4, p. 55
Publication type:: Article

ASM ANNOUNCES 2020 CLASS OF FELLOWS.

Published in:: Electronic Device Failure Analysis, 2020, v. 22, n. 4, p. 51
Publication type:: Article

PRACTICAL CONSIDERATIONS FOR VACUUM HEAT TREATMENT OF AM METALS.

Published in:

Electronic Device Failure Analysis, 2020, v. 22, n. 4, p. 46

By:

Osterman, Virginia

Publication type:

Article

LASER HEAT TREATING CUTS COSTS AND SHORTENS SCHEDULES IN THE MANUFACTURE OF AUTOMOTIVE DIES: Automotive die OEMs throughout Europe are using laser heat treatment to deliver parts fast, with superior quality, at lower cost.

Published in:

Electronic Device Failure Analysis, 2020, v. 22, n. 4, p. 43

By:

Jonnalagadda, Aravind

Publication type:

Article

HIGHLIGHTS 2020 CLASS OF FELLOWS.

Published in:: Electronic Device Failure Analysis, 2020, v. 22, n. 4, p. 52
Publication type:: Article

ASM HTS/SURFACE COMBUSTION EMERGING LEADER AWARD.

Published in:: Electronic Device Failure Analysis, 2020, v. 22, n. 4, p. 42
Publication type:: Article

NOMINATIONS SOUGHT FOR GEORGE H. BODEEN HEAT TREATING ACHIEVEMENT AWARD.

Published in:: Electronic Device Failure Analysis, 2020, v. 22, n. 4, p. 41
Publication type:: Article

SOLICITING PAPERS FOR ASM HTS/BODYCOTE BEST PAPER IN HEAT TREATING CONTEST.

Published in:: Electronic Device Failure Analysis, 2020, v. 22, n. 4, p. 41
Publication type:: Article

HTS NAMES NEW BOARD MEMBERS FOR 2020.

Published in:: Electronic Device Failure Analysis, 2020, v. 22, n. 4, p. 40
Publication type:: Article

CREATING AN R&D ROADMAP FOR THE HEAT TREATING INDUSTRY.

Published in:

Electronic Device Failure Analysis, 2020, v. 22, n. 4, p. 40

By:

Pershing, Michael

Publication type:

Article

RESIDUAL STRESS: BOTH FRIEND AND FOE.

Published in:

Electronic Device Failure Analysis, 2020, v. 22, n. 4, p. 29

By:

Furrer, David

Publication type:

Article

ANTIMICROBIAL COPPERCONTAINING STAINLESS STEELS SHOW PROMISE: Given the demonstrated antimicrobial properties of copper, it is incumbent upon materials scientists to design potent antimicrobial copper-containing stainless steels as an economical option.

Published in:

Electronic Device Failure Analysis, 2020, v. 22, n. 4, p. 25

By:

Barber, Olivia;
Khan, Arman;
Hartmann, Erica M.;
Isheim, Dieter;
Vaynman, Semyon;
Wang, Q. Jane;
Yip-Wah Chung

Publication type:

Article

HISTORIC MONEL--PART I: PRODUCTION AND PROCESSES OF THE INTERNATIONAL NICKEL COMPANY INTO WORLD WAR II: Monel's importance in the first half of the 20th century as a decorative metal has been nearly forgotten.

Published in:

Electronic Device Failure Analysis, 2020, v. 22, n. 4, p. 22

By:

Churchill, James E.

Publication type:

Article

MICROWAVE NDT INSPECTION TECHNIQUES FOR POWER GENERATION AND SPECIALTY APPLICATION: With increasing use of nonmetallic materials in a variety of power generation applications, new opportunities are driving research and development of microwave inspection technologies

Published in:

Electronic Device Failure Analysis, 2020, v. 22, n. 4, p. 15

By:

Nelson, Christopher;
Stakenborghs, Robert

Publication type:

Article

ARMOR-PLATED MATERIAL REPELS WATER.

Published in:: Electronic Device Failure Analysis, 2020, v. 22, n. 4, p. 14
Publication type:: Article

POLYMER COATING PREVENTS FUNGI.

Published in:: Electronic Device Failure Analysis, 2020, v. 22, n. 4, p. 14
Publication type:: Article

WORLD'S LIGHTEST SHIELDING MATERIAL.

Published in:: Electronic Device Failure Analysis, 2020, v. 22, n. 4, p. 13
Publication type:: Article

DESIGNING SHAPEMORPHING DEVICES.

Published in:: Electronic Device Failure Analysis, 2020, v. 22, n. 4, p. 13
Publication type:: Article

CREATING 3D HETEROSTRUCTURED MATERIALS.

Published in:: Electronic Device Failure Analysis, 2020, v. 22, n. 4, p. 12
Publication type:: Article

STUDYING TUNGSTEN DITELLURIDE IN REAL-TIME.

Published in:: Electronic Device Failure Analysis, 2020, v. 22, n. 4, p. 8
Publication type:: Article

NEW DESIGN FOR MIXING POWDER COMPOSITES.

Published in:: Electronic Device Failure Analysis, 2020, v. 22, n. 4, p. 12
Publication type:: Article

SELF-HEALING STRAIN SENSOR.

Published in:: Electronic Device Failure Analysis, 2020, v. 22, n. 4, p. 10
Publication type:: Article

STUDYING STEEL ON THE SPACE STATION.

Published in:: Electronic Device Failure Analysis, 2020, v. 22, n. 4, p. 10
Publication type:: Article

MAKING COMPOSITES FROM NEW RAW MATERIALS.

Published in:: Electronic Device Failure Analysis, 2020, v. 22, n. 4, p. 9
Publication type:: Article

FIRST NON-CUTTABLE MATERIAL DEBUTS.

Published in:: Electronic Device Failure Analysis, 2020, v. 22, n. 4, p. 8
Publication type:: Article

SCIENTISTS STUDY HUMAN ENAMEL.

Published in:: Electronic Device Failure Analysis, 2020, v. 22, n. 4, p. 11
Publication type:: Article

BRIEF.

Published in:: Electronic Device Failure Analysis, 2020, v. 22, n. 4, p. 7
Publication type:: Article

PROBING POROUS MATERIALS WITH MACHINE LEARNING.

Published in:: Electronic Device Failure Analysis, 2020, v. 22, n. 4, p. 7
Publication type:: Article

SCIENTIFIC MACHINE LEARNING TAKES OFF.

Published in:: Electronic Device Failure Analysis, 2020, v. 22, n. 4, p. 7
Publication type:: Article

SCIENTISTS FINETUNE HYBRID PEROVSKITES.

Published in:: Electronic Device Failure Analysis, 2020, v. 22, n. 4, p. 6
Publication type:: Article

NEUTRONS VERIFY NEW TOPOLOGICAL MATERIAL.

Published in:: Electronic Device Failure Analysis, 2020, v. 22, n. 4, p. 6
Publication type:: Article

MAKING CONNECTIONS.

Published in:: Electronic Device Failure Analysis, 2020, v. 22, n. 4, p. 4
Publication type:: Article

UPCOMING EVENTS 2021.

Published in:: 2020
Publication type:: Calendar

ABOUT THE COVER.

Published in:: 2020
Publication type:: Cover Art

QUANTUM COMPUTING IS STILL IN BASIC RESEARCH PHASE.

Published in:

Electronic Device Failure Analysis, 2020, v. 22, n. 4, p. 50, doi. 10.31399/asm.edfa.2020-4.p050

By:

Teich, Paul

Publication type:

Article

B1500A SEMICONDUCTOR PARAMETER ANALYZER CONTINUES LEGACY OF POWERFUL DEVICE CHARACTERIZATION TOOLS.

Published in:

Electronic Device Failure Analysis, 2020, v. 22, n. 4, p. 48

By:

Kolasa, Ted

Publication type:

Article