Works matching IS 15370755 AND DT 2013 AND VI 15 AND IP 1

Results: 20

IPFA 2013.

Published in:: 2013
Publication type:: Proceeding

Pie Paper Features EDFAS Photo Contest Winners.

Published in:: Electronic Device Failure Analysis, 2013, v. 15, n. 1, p. 51
Publication type:: Article

EDFAS Celebrates Its 15th Anniversary.

Published in:

Electronic Device Failure Analysis, 2013, v. 15, n. 1, p. 50, doi. 10.31399/asm.edfa.2013-1.p050

By:

Walraven, Jeremy A.

Publication type:

Article

Product News.

Published in:

2013

By:

Wagner, Larry

Publication type:

Product Review

Directory of Independent FA Providers.

Published in:

2013

By:

Ring, Rose

Publication type:

Training Calendar.

Published in:

Electronic Device Failure Analysis, 2013, v. 15, n. 1, p. 42

By:

Ring, Rose M.

Publication type:

Article

ISTFA 2012 User's Group--Sample Preparation.

Published in:

Electronic Device Failure Analysis, 2013, v. 15, n. 1, p. 39

By:

Copeland, Lucas;
Klein, Jake

Publication type:

Article

ISTFA 2012 User's Group--Focused Ion Beam (FIB).

Published in:

2013

By:

DiBattista, Michael;
Livengood, Richard

Publication type:

Proceeding

ISTFA 2012 User's Group--Contactless Fault Isolation.

Published in:

2013

By:

Cole, Ed;
Altmann, Frank

Publication type:

Proceeding

ISTFA 2012 User's Group--Nanoprobing.

Published in:

2013

By:

Chowdhury, Vijay;
Mulder, Randal

Publication type:

Proceeding

IRPS Conference.

Published in:: 2013
Publication type:: Proceeding

Failure Analysis: What is the Problem?

Published in:

2013

By:

Burgess, Dave

Publication type:

Proceeding

A Review of the ISTFA 2012 Panel Discussion: Failure Analysis Challenges of 3Di Packaging.

Published in:

2013

By:

Vallett, Dave

Publication type:

Proceeding

ISTFA 2012 Wrap-Up.

Published in:

2013

By:

Perdu, Philippe

Publication type:

Conference Paper/Materials

EDFAS Board of Directors Report.

Published in:

2013

By:

Thayer, Matt

Publication type:

Proceeding

ESREF 2012 in Cagliari.

Published in:

Electronic Device Failure Analysis, 2013, v. 15, n. 1, p. 23

By:

Ciappa, Mauro;
Cova, Paolo;
Iannuzzo, Francesco;
Meneghesso, Gaudenzio

Publication type:

Article

High-Speed Transient Thermoreflectance Imaging of Microelectronic Devices and Circuits.

Published in:

Electronic Device Failure Analysis, 2013, v. 15, n. 1, p. 12, doi. 10.31399/asm.edfa.2013-1.p012

By:

Yazawa, Kazuaki;
Kendig, Dustin;
Hernandez, Daniel;
Maize, Kerry;
Alavi, Shila;
Shakouri, Ali

Publication type:

Article

New Challenges in Testing and Failure Analysis for Microsystems-Enabled Photovoltaics Modules.

Published in:

Electronic Device Failure Analysis, 2013, v. 15, n. 1, p. 4, doi. 10.31399/asm.edfa.2013-1.p004

By:

Cruz-Campa, Jose-Luis;
Kim, Bongsang;
Jared, Bradley;
Okandan, Murat;
Nielson, Gregory N.;
Ballance, Mark;
Nordquist, Chris;
Sweatt, William;
Lentine, Anthony

Publication type:

Article

AMFA Workshop.

Published in:: 2013
Publication type:: Proceeding

Calling All Authors!

Published in:: Electronic Device Failure Analysis, 2013, v. 15, n. 1, p. 2
Publication type:: Article