Nondestructive Failure Localization—A Challenge for Sub-100 nm Structures.
- Published in:
- Electronic Device Failure Analysis, 2009, v. 11, n. 1, p. 46, doi. 10.31399/asm.edfa.2009-1.p046
- By:
- Publication type:
- Article
Works matching IS 15370755 AND DT 2009 AND VI 11 AND IP 1
Results: 22
1
2
Noteworthy Item: IPFA 2009.
- Published in:
- Electronic Device Failure Analysis, 2009, v. 11, n. 1, p. 47
- Publication type:
- Article
3
KLA-Tencor Introduces New Monitor-Wafer Defect Inspection System for IC Fabs.
- Published in:
- 2009
- By:
- Publication type:
- Product Review
4
FEI Introduces New X-FEG Electron Source.
- Published in:
- 2009
- By:
- Publication type:
- Product Review
5
Noteworthy Item: IRPS Conference.
- Published in:
- 2009
- Publication type:
- Proceeding
6
Presto's In-Silicon Analysis Services Now Available on the 300 mm Probe Station from Micromanipulator.
- Published in:
- Electronic Device Failure Analysis, 2009, v. 11, n. 1, p. 43
- By:
- Publication type:
- Article
7
Presto Engineering Introduces New Thermal Solution for Analysis of High-Power Devices.
- Published in:
- 2009
- By:
- Publication type:
- Product Review
8
Agilent Technologies Introduces Free Phase-Locked Loop Analysis Software.
- Published in:
- 2009
- By:
- Publication type:
- Product Review
9
Presto Engineering and SEMICAPS Announce Strategic OEM Relationship.
- Published in:
- Electronic Device Failure Analysis, 2009, v. 11, n. 1, p. 41
- By:
- Publication type:
- Article
10
FEI's New TrueCrystal Package Provides Rapid, Accurate Strain Profiling.
- Published in:
- 2009
- By:
- Publication type:
- Product Review
11
Forward-Scattered Electron Imaging Sample Holder Is Available.
- Published in:
- 2009
- By:
- Publication type:
- Product Review
12
Noteworthy Item: AMFA Workshop 2009.
- Published in:
- 2009
- Publication type:
- Proceeding
13
Biannual Face-to-Face EDFAS Board Meeting.
- Published in:
- 2009
- By:
- Publication type:
- Proceeding
14
Industry Insights: Does FA Change in a Recession?
- Published in:
- 2009
- By:
- Publication type:
- Editorial
15
Pitfalls and Traps of Failure Analysis.
- Published in:
- 2009
- By:
- Publication type:
- Proceeding
16
Hanging on to Our Sanity.
- Published in:
- 2009
- By:
- Publication type:
- Editorial
17
Directory of Independent FA Labs.
- Published in:
- 2009
- By:
- Publication type:
- Directory
18
ISTFA 2008 Wrap-Up.
- Published in:
- 2009
- By:
- Publication type:
- Proceeding
19
ESREF 2008 in Maastricht.
- Published in:
- 2009
- By:
- Publication type:
- Proceeding
20
CMOS Electronics: How It Works, How It Fails Jaume Segura and Charles F. Hawkins.
- Published in:
- 2009
- Publication type:
- Book Review
21
IEEE 15th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2008).
- Published in:
- 2009
- By:
- Publication type:
- Proceeding
22
Response to Counterfeit Integrated Circuit Components in the Supply Chain: Part II.
- Published in:
- Electronic Device Failure Analysis, 2009, v. 11, n. 1, p. 14, doi. 10.31399/asm.edfa.2009-1.p014
- By:
- Publication type:
- Article