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MICROELECTRONICS SUPPLY CHAIN SECURITY.
- Published in:
- Electronic Device Failure Analysis, 2022, v. 24, n. 4, p. 2
- By:
- Publication type:
- Article
A GUIDE TO ACCURATE SYSTEM CALIBRATION AND DATA EXTRACTION TO INCREASE THE SIGNIFICANCE OF SPECTRAL PHOTON EMISSION MICROSCOPY MEASUREMENTS.
- Published in:
- Electronic Device Failure Analysis, 2022, v. 24, n. 4, p. 4, doi. 10.31399/asm.edfa.2022-4.p004
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- Publication type:
- Article
IEDM 2022.
- Published in:
- 2022
- Publication type:
- Proceeding
MEMOMETER: MEMORY PUF-BASED HARDWARE METERING METHODOLOGY FOR FPGAs.
- Published in:
- Electronic Device Failure Analysis, 2022, v. 24, n. 4, p. 12, doi. 10.31399/asm.edfa.2022-4.p012
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- Publication type:
- Article
SECURITY ASSESSMENT OF NONVOLATILE MEMORY AGAINST PHYSICAL PROBING.
- Published in:
- Electronic Device Failure Analysis, 2022, v. 24, n. 4, p. 22, doi. 10.31399/asm.edfa.2022-4.p022
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- Publication type:
- Article
PROCESSES FOR THINNING AND POLISHING HIGHLY WARPED DIE TO A NEARLY CONSISTENT THICKNESS: PART I.
- Published in:
- Electronic Device Failure Analysis, 2022, v. 24, n. 4, p. 34, doi. 10.31399/asm.edfa.2022-4.p034
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- Publication type:
- Article
EDFAS AWARDS.
- Published in:
- Electronic Device Failure Analysis, 2022, v. 24, n. 4, p. 40
- Publication type:
- Article
EDFAS MEMBERS RECEIVE ASM AWARDS.
- Published in:
- Electronic Device Failure Analysis, 2022, v. 24, n. 4, p. 40
- Publication type:
- Article
EXHIBITOR LIST.
- Published in:
- Electronic Device Failure Analysis, 2022, v. 24, n. 4, p. 44
- Publication type:
- Article
EXHIBITOR SHOWCASE.
- Published in:
- Electronic Device Failure Analysis, 2022, v. 24, n. 4, p. 46
- Publication type:
- Article
PROFILES OF CANDIDATES FOR THE EDFAS BOARD OF DIRECTORS.
- Published in:
- Electronic Device Failure Analysis, 2022, v. 24, n. 4, p. 48
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- Publication type:
- Article
EDFAS MEMBERSHIP.
- Published in:
- Electronic Device Failure Analysis, 2022, v. 24, n. 4, p. 50
- Publication type:
- Article
DIRECTORY OF INDEPENDENT FA PROVIDERS.
- Published in:
- 2022
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- Publication type:
- Directory
TRAINING CALENDAR.
- Published in:
- 2022
- Publication type:
- Calendar
LITERATURE REVIEW: Peer-Reviewed Literature of Interest to Failure Analysis: Cornucopia.
- Published in:
- Electronic Device Failure Analysis, 2022, v. 24, n. 4, p. 55
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- Publication type:
- Article
QUANTIFIED ELECTRICAL MATERIAL PROPERTY IMAGES FOR FA AND PROCESS MONITORING.
- Published in:
- Electronic Device Failure Analysis, 2022, v. 24, n. 4, p. 56
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- Publication type:
- Article
SENSITIVE PHOTO EMISSION MICROSCOPE FOR FA.
- Published in:
- 2022
- By:
- Publication type:
- Product Review
HIGH VACUUM AFM SYSTEM FOR ATMOSPHERE-SENSITIVE RESEARCH.
- Published in:
- 2022
- By:
- Publication type:
- Product Review
TEST SOCKET FOR RAPID DEVICE BRING UP, CHARACTERIZATION, AND FA.
- Published in:
- Electronic Device Failure Analysis, 2022, v. 24, n. 4, p. 57
- By:
- Publication type:
- Article
THE EDFAS FA TECHNOLOGY ROADMAP— FOUNDATION AND FUTURE.
- Published in:
- Electronic Device Failure Analysis, 2022, v. 24, n. 4, p. 58, doi. 10.31399/asm.edfa.2022-4.p058
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- Publication type:
- Article