Works matching IS 1535864X AND DT 2005 AND VI 9 AND IP 4

Results: 10

Future Package Technologies for Wireless Communication Systems.

Published in:

Intel Technology Journal, 2005, v. 9, n. 4, p. 353, doi. 10.1535/itj.0904.08

By:

Telesphor Kamgaing;
Kinya Ichikawa;
Xiang Yin Zeng;
Kyu-Pyung Hwang;
Yongki Min;
Jiro Kubota

Publication type:

Article

Advanced Fault Isolation and Failure Analysis Techniques for Future Package Technologies.

Published in:

Intel Technology Journal, 2005, v. 9, n. 4, p. 337, doi. 10.1535/itj.0904.07

By:

Pacheco, Mario;
Zhiyong Wang;
Skoglund, Lars;
Yongmei Liu;
Medina, Ariel;
Raman, Arun;
Dias, Rajen;
Goyal, Deepak;
Ramanathan, Shriram

Publication type:

Article

Pentium® 4 Processor High-Volume Land-Grid-Array Technology: Challenges and Future Trends.

Published in:

Intel Technology Journal, 2005, v. 9, n. 4, p. 325, doi. 10.1535/itj.0904.06

By:

Baldwin, Chris;
Byquist, Tod;
Combs, Chris;
Pandey, Vinayak;
Stone, Brent;
Viswanath, Ram;
Watwe, Abhay;
Wojewoda, Leigh

Publication type:

Article

Materials Technologies for Thermomechanical Management of Organic Packages.

Published in:

Intel Technology Journal, 2005, v. 9, n. 4, p. 309, doi. 10.1535/itj.0904.05

By:

Wakharkar, Vijay;
Matayabas, Chris;
Lehman, Ed;
Manepalli, Rahul;
Renavikar, Mukul;
Jayaraman, Saikumar;
LeBonheur, Vassou

Publication type:

Article

Finding Solutions to the Challenges in Package Interconnect Reliability.

Published in:

Intel Technology Journal, 2005, v. 9, n. 4, p. 297, doi. 10.1535/itj.0904.04

By:

Garner, Luke;
Sane, Sandeep;
Suh, Daewoong;
Byrne, Tiffany;
Dani, Ashay;
Martin, Ted;
Mello, Michael;
Patel, Mitesh;
Williams, Richard

Publication type:

Article

Nano and Micro Technology-Based Next-Generation Package-Level Cooling Solutions.

Published in:

Intel Technology Journal, 2005, v. 9, n. 4, p. 285, doi. 10.1535/itj.0904.03

By:

Ravi S. Prasher;
Je-Young Chang;
Ioan Sauciuc;
Sridhar Narasimhan;
David Chau;
Greg Chrysler;
Alan Myers;
Suzana Prstic;
Chuan Hu

Publication type:

Article

Power Delivery for High-Performance Microprocessors.

Published in:

Intel Technology Journal, 2005, v. 9, n. 4, p. 273, doi. 10.1535/itj.0904.02

By:

Aygün, Kemal;
Hill, Michael J.;
Eilert, Kimberly;
Radhakrishnan, Kaladhar;
Levin, Alex

Publication type:

Article

Advanced Package Technologies for High-Performance Systems.

Published in:

Intel Technology Journal, 2005, v. 9, n. 4, p. 259, doi. 10.1535/itj.0904.01

By:

Mallik, Debendra;
Radhakrishnan, Kaladhar;
Jiangqi He;
Chia-Pin Chiu;
Kamgaing, Telesphor;
Searls, Damion;
Jackson, James D.

Publication type:

Article

Challenges and Opportunities in Electronic Package Technology Development.

Published in:

Intel Technology Journal, 2005, v. 9, n. 4, p. 259, doi. 10.1535/itj.0904.f

By:

Grayeli, Nasser

Publication type:

Article

Electronic Package Technology Development.

Published in:

Intel Technology Journal, 2005, v. 9, n. 4, p. 259, doi. 10.1535/itj.0904.p

By:

Lin Chao

Publication type:

Article