Works matching IS 13880764 AND DT 2021 AND VI 23 AND IP 8


Results: 44
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    Formulation of a paste for copper thick film.

    Published in:
    Journal of Nanoparticle Research, 2021, v. 23, n. 8, p. 1, doi. 10.1007/s11051-021-05300-7
    By:
    • Tang, Jiayu;
    • Mak, Cheuk Hei Herry;
    • Tam, Sze Kee;
    • Ng, Ka Ming
    Publication type:
    Article
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