Works matching IS 12256463 AND DT 2011 AND VI 33 AND IP 4


Results: 23
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    Novel Bumping Material for Solder-on-Pad Technology.

    Published in:
    ETRI Journal, 2011, v. 33, n. 4, p. 637, doi. 10.4218/etrij.11.0210.0298
    By:
    • Kwang-Seong Choi;
    • Sun-Woo Chu;
    • Jong-Jin Lee;
    • Ki-Jun Sung;
    • Hyun-Cheol Bae;
    • Byeong-Ok Lim;
    • Jong-Tae Moon;
    • Yong-Sung Eom
    Publication type:
    Article
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