Synthesis and Evaluation of Organic Additives for Copper Electroplating of Interconnects.
- Published in:
- Journal of Electrochemistry, 2023, v. 29, n. 8, p. 1, doi. 10.13208/j.electrochem.2208111
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- Publication type:
- Article
Works matching IS 10063471 AND DT 2023 AND VI 29 AND IP 8
Results: 4
1
2
Pulse Electroplating of Nanotwinned Copper Using MPS-PEG Two-additive System for Damascene via Filling Process.
- Published in:
- Journal of Electrochemistry, 2023, v. 29, n. 8, p. 1, doi. 10.13208/j.electrochem.2209231
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- Publication type:
- Article
3
Effects of Traps on Photo-induced Interfacial Charge Transfer of Ag-TiO<sub>2</sub>: Photoelectro-chemical, Electrochemical and Spectroscopic Characterizations.
- Published in:
- Journal of Electrochemistry, 2023, v. 29, n. 8, p. 1, doi. 10.13208/j.electrochem.2208101
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- Publication type:
- Article
4
Effect of Amine Additives on Thermal Runaway Inhibition of SiCjjNCM811 Batteries.
- Published in:
- Journal of Electrochemistry, 2023, v. 29, n. 8, p. 1, doi. 10.13208/j.electrochem.2211141
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- Publication type:
- Article