Works in Electroplating

Results: 11
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    高电流密度通孔电镀铜用抑制剂的研究.

    Published in:
    Electroplating & Finishing, 2023, v. 42, n. 11, p. 43, doi. 10.19289/j.1004-227x.2023.11.007
    By:
    • 夏威;
    • 廖小茹;
    • 洪捷凯;
    • 廖代辉;
    • 谭柏照;
    • 孙宇曦;
    • 曾庆明;
    • 罗继业
    Publication type:
    Article
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    通信腔体类零部件电镀铜/银工艺.

    Published in:
    Electroplating & Finishing, 2023, v. 42, n. 11, p. 31, doi. 10.19289/j.1004-227x.2023.11.005
    By:
    • 刘超峰;
    • 王斌;
    • 陈英;
    • 李晓征;
    • 王珊;
    • 杨晓颖
    Publication type:
    Article
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    磷含量对化学镀钯层性能的影响.

    Published in:
    Electroplating & Finishing, 2023, v. 42, n. 11, p. 1, doi. 10.19289/j.1004-227x.2023.11.001
    By:
    • 郑沛峰;
    • 胡光辉;
    • 周仲鑫;
    • 路培培;
    • 潘湛昌;
    • 张波
    Publication type:
    Article