Works in Electroplating & Finishing, 2022, Vol 41, Issue 17

Results: 13

种电镀清洗水的高效回用方法.

Published in:

Electroplating & Finishing, 2022, v. 41, n. 17, p. 1266, doi. 10.19289/j.1004-227x.2022.17.013

By:

杨大春

Publication type:

Article

无磁铝合金连接器化学镀镍工艺研究.

Published in:

Electroplating & Finishing, 2022, v. 41, n. 17, p. 1262, doi. 10.19289/j.1004-227x.2022.17.012

By:

沈岳军;
孙雪松;
罗华江;
康鑫;
安远飞

Publication type:

Article

PCB 化学镀镍层改性对置换镀金的影响.

Published in:

Electroplating & Finishing, 2022, v. 41, n. 17, p. 1256, doi. 10.19289/j.1004-227x.2022.17.011

By:

郑沛峰;
胡光辉;
路培培;
崔子雅;
潘湛昌;
张波

Publication type:

Article

引线框架铜带显微组织对电镀镍层性能的影响.

Published in:

Electroplating & Finishing, 2022, v. 41, n. 17, p. 1250, doi. 10.19289/j.1004-227x.2022.17.010

By:

王云鹏;
莫永达;
张嘉凝;
白依可;
王苗苗;
娄花芬

Publication type:

Article

类硫脲结构添加剂在电解铜箔制备中的应用.

Published in:

Electroplating & Finishing, 2022, v. 41, n. 17, p. 1245, doi. 10.19289/j.1004-227x.2022.17.009

By:

宋言;
朱若林;
代泽宇;
林毅

Publication type:

Article

苯基修饰含氮整平剂对高厚径比盲孔镀铜的影响.

Published in:

Electroplating & Finishing, 2022, v. 41, n. 17, p. 1237, doi. 10.19289/j.1004-227x.2022.17.008

By:

何晓桐;
谭伟;
陈泳;
华子如;
罗勇葳;
潘文龙

Publication type:

Article

首饰金表面电镀铑层的颜色探讨.

Published in:

Electroplating & Finishing, 2022, v. 41, n. 17, p. 1230, doi. 10.19289/j.1004-227x.2022.17.007

By:

代司晖;
植宝;
袁军平;
王颖静;
练思沛

Publication type:

Article

防指纹膜对珠宝首饰检测干扰的试验研究.

Published in:

Electroplating & Finishing, 2022, v. 41, n. 17, p. 1222, doi. 10.19289/j.1004-227x.2022.17.006

By:

汤紫薇;
袁军平;
郭礼淳;
梁建辉;
杨春梅;
曾慧妍

Publication type:

Article

燃机压气机导叶轴用钢化学镀 Ni–P 合金.

Published in:

Electroplating & Finishing, 2022, v. 41, n. 17, p. 1218, doi. 10.19289/j.1004-227x.2022.17.005

By:

余沛坰;
刘中华;
邓喆;
蓝吉兵;
隋永枫;
何成

Publication type:

Article

给电方式对聚乙烯薄膜电镀镍性能的影响.

Published in:

Electroplating & Finishing, 2022, v. 41, n. 17, p. 1214, doi. 10.19289/j.1004-227x.2022.17.004

By:

丁祥;
靳俊玲;
陈红辉;
钟毅;
喻鹏

Publication type:

Article

CTAB 对锌−镍合金基复合电镀液中 PTFE 分散性的影响.

Published in:

Electroplating & Finishing, 2022, v. 41, n. 17, p. 1208, doi. 10.19289/j.1004-227x.2022.17.003

By:

刘嘉楠;
黄嘉乐;
阳颖飞;
张鹏;
陈德馨;
王启伟

Publication type:

Article

麦芽糖对氨羧配位体系无氰镀镉的影响.

Published in:

Electroplating & Finishing, 2022, v. 41, n. 17, p. 1203, doi. 10.19289/j.1004-227x.2022.17.002

By:

郑玉;
张骐;
詹中伟;
孙志华;
宇波;
梁鑫;
程红霞;
吕玲

Publication type:

Article

ATMP 作为辅助配位剂对 HEDP 体系铜电沉积行为的影响.

Published in:

Electroplating & Finishing, 2022, v. 41, n. 17, p. 1197, doi. 10.19289/j.1004-227x.2022.17.001

By:

喻岚;
廖志祥;
袁景追;
张娟;
王帅星;
杜楠

Publication type:

Article