Works matching IS 1001893X AND DT 2023 AND VI 63 AND IP 5


Results: 22
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    毫米波硅基 SiP 模块设计.

    Published in:
    Telecommunication Engineering, 2023, v. 63, n. 5, p. 741, doi. 10.20079/j.issn.1001-893x.220422002
    By:
    • 张先荣
    Publication type:
    Article
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    四维多极化天线阵.

    Published in:
    Telecommunication Engineering, 2023, v. 63, n. 5, p. 633, doi. 10.20079/j.issn.1001-893x.221103002
    By:
    • 孙 超
    Publication type:
    Article
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