Works matching IS 10012028 AND DT 2024 AND VI 43 AND IP 9
Results: 16
基于不对称二极管桥忆阻器的混沌电路动力学分析 及其 FPGA 实现研究.
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- Electronic Components & Materials, 2024, v. 43, n. 9, p. 1146, doi. 10.14106/j.cnki.1001-2028.2024.1378
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具有二维聚焦特性的柱形超表面透镜设计.
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- Electronic Components & Materials, 2024, v. 43, n. 9, p. 1161, doi. 10.14106/j.cnki.1001-2028.2024.0113
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添加 Sb 对 Sn-9Zn-3Bi/ Cu 钎料接头显微组织及 力学性能的影响.
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- Electronic Components & Materials, 2024, v. 43, n. 9, p. 1154, doi. 10.14106/j.cnki.1001-2028.2024.1634
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一种用于浮动电源的超低功耗欠压锁定电路.
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- Electronic Components & Materials, 2024, v. 43, n. 9, p. 1141, doi. 10.14106/j.cnki.1001-2028.2024.0259
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面向芯片静电放电问题的射频集成电路 防护系统设计.
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- Electronic Components & Materials, 2024, v. 43, n. 9, p. 1133, doi. 10.14106/j.cnki.1001-2028.2024.0390
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一种宽带低损耗微同轴功分器.
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- Electronic Components & Materials, 2024, v. 43, n. 9, p. 1127, doi. 10.14106/j.cnki.1001-2028.2024.1636
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基于射频技术的声光可调滤波器稳频优化.
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- Electronic Components & Materials, 2024, v. 43, n. 9, p. 1121, doi. 10.14106/j.cnki.1001-2028.2024.0213
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一种新型宽带小型化低损耗 LTCC 滤波器.
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- Electronic Components & Materials, 2024, v. 43, n. 9, p. 1113, doi. 10.14106/j.cnki.1001-2028.2024.0195
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³He 管探测器前端处理电路设计与实现.
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- Electronic Components & Materials, 2024, v. 43, n. 9, p. 1104, doi. 10.14106/j.cnki.1001-2028.2024.0056
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检测磷酸铁锂电池热失控气体 C<sub>2</sub> H<sub>4</sub> 的 MoS<sub>2</sub> @c-MOF 传感器研究.
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- Electronic Components & Materials, 2024, v. 43, n. 9, p. 1096, doi. 10.14106/j.cnki.1001-2028.2024.0297
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Mn 掺杂 Li<sub>3</sub> VO<sub>4</sub> 光学性质与弹性性质的 第一性原理研究.
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- Electronic Components & Materials, 2024, v. 43, n. 9, p. 1087, doi. 10.14106/j.cnki.1001-2028.2024.0033
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超低电阻率石墨 / 氧化铜 / 石墨三明治结构导电材料.
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- Electronic Components & Materials, 2024, v. 43, n. 9, p. 1081, doi. 10.14106/j.cnki.1001-2028.2024.0018
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具有可控空穴抽取路径的低损耗 4H-SiC 双沟槽超结 IGBT.
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- Electronic Components & Materials, 2024, v. 43, n. 9, p. 1071, doi. 10.14106/j.cnki.1001-2028.2024.0091
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具有沟槽氧化物和 P<sup>-</sup> 屏蔽层的 4H-SiC MPS 的 设计与仿真.
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- Electronic Components & Materials, 2024, v. 43, n. 9, p. 1063, doi. 10.14106/j.cnki.1001-2028.2024.0035
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射频系统先进封装技术研究进展.
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- Electronic Components & Materials, 2024, v. 43, n. 9, p. 1053, doi. 10.14106/j.cnki.1001-2028.2024.1649
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浅析射频 SiP 多物理场耦合分析关键技术.
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- Electronic Components & Materials, 2024, v. 43, n. 9, p. 1041, doi. 10.14106/j.cnki.1001-2028.2024.0050
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