Works in Electronic Components


Results: 17
    1

    高性能有机硅密封胶的研究.

    Published in:
    Electronic Components & Materials, 2023, v. 42, n. 7, p. 893, doi. 10.14106/j.cnki.1001-2028.2023.0220
    By:
    • 张 青;
    • 侯陈睿;
    • 王 谊
    Publication type:
    Article
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    高频功率磁技术的发展现状及展望.

    Published in:
    Electronic Components & Materials, 2023, v. 42, n. 7, p. 774, doi. 10.14106/j.cnki.1001-2028.2023.0112
    By:
    • 吴军科;
    • 古书杰;
    • 付振晓;
    • 李 强;
    • 李旺昌
    Publication type:
    Article
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